초록 ▼

The present invention provides a self-cleaning wiresaw cutting apparatus including a cleaning mechanism adapted to clean the components of the wiresaw before, during, or after a cutting process or to humidify the cutting region of the apparatus. The apparatus contains at least one dispenser adapted

The present invention provides a self-cleaning wiresaw cutting apparatus including a cleaning mechanism adapted to clean the components of the wiresaw before, during, or after a cutting process or to humidify the cutting region of the apparatus. The apparatus contains at least one dispenser adapted to dispense an aqueous fluid onto various components of the wiresaw.

대표청구항 ▼

1. A self-cleaning wiresaw apparatus comprising: at least one cutting wire looped under tension within wire guide grooves on at least two rotatable wire guide rollers, the cutting wire being movable with the synchronous rotation of rollers;a cutting region adapted to receive a substrate and to urge

1. A self-cleaning wiresaw apparatus comprising: at least one cutting wire looped under tension within wire guide grooves on at least two rotatable wire guide rollers, the cutting wire being movable with the synchronous rotation of rollers;a cutting region adapted to receive a substrate and to urge the substrate against the cutting wire to cut the substrate therewith;at least one slurry dispenser adapted to dispense a cutting slurry from a supply thereof onto the moving cutting wire to aid in cutting the substrate; andat least one cleaning fluid dispenser adapted to dispense an aqueous cleaning fluid at a pressure in the range of about 10 to about 160 pounds-per-square inch (psi) onto at least one movable or rotatable portion of the apparatus to clean the portion of the apparatus before, during or after cutting a substrate therewith, wherein the apparatus further comprising a retractable gate positionable to deflect the spray of aqueous cleaning fluid from at least one cleaning fluid dispenser or positionable to protect the opening of the cleaning fluid dispenser from most slurry splashing, and retractable so as to allow the at least one cleaning fluid dispenser to directly dispense the aqueous cleaning fluid onto at least one movable or rotatable portion of the apparatus. 2. The apparatus of claim 1 wherein at least one cleaning fluid dispenser nozzle is a adapted to spray the aqueous cleaning fluid onto a portion of the apparatus selected from the group consisting of a cutting wire, a wire guide groove, a wire guide roller, and a pulley. 3. The apparatus of claim 1 wherein the tension on the wire is about 12 N to about 32 N. 4. The apparatus of claim 1 wherein the apparatus is adapted to direct at least a portion of the aqueous cleaning fluid into the supply of cutting slurry after it contacts the movable or rotatable portion of the apparatus. 5. The apparatus of claim 1 wherein the aqueous cleaning fluid contains at least one of a corrosion inhibitor, an anti-drying additive, a surfactant, and air. 6. The apparatus of claim 1 wherein the apparatus includes at least one cleaning fluid dispenser adapted to dispense the aqueous cleaning fluid onto at least one cutting wire as the cutting wire is moving. 7. The apparatus of claim 1 further comprising a valve that is adapted to control the amount of aqueous cleaning fluid being dispensed from at least one cleaning fluid dispenser. 8. The apparatus of claim 7 wherein the apparatus is adapted to quantitatively monitor the amount of the aqueous cleaning fluid being dispensed from at least one cleaning fluid dispenser. 9. The apparatus of claim 1 wherein the at least one cutting wire looped under tension within wire guide grooves on at least two rotatable wire guide rollers has at least 200 wire loops around the wire guide rollers. 10. The apparatus of claim 7 wherein at least one cleaning fluid dispenser includes a valve that is located external to the cutting region of the wiresaw. 11. The apparatus of claim 1 wherein at least one cleaning fluid dispenser is located at a distance of about 1 mm to about 200 mm from a cutting wire. 12. The apparatus of claim 1 wherein at least one cleaning fluid dispenser is adapted to dispense the aqueous cleaning fluid at a spray angle of about 10 degrees to about 150 degrees. 13. The apparatus of claim 1 wherein at least one cleaning fluid dispenser is adapted to dispense the aqueous cleaning fluid in a dispersion pattern selected from the group consisting of a linear pattern, a circular pattern, a ring-shaped pattern, a square pattern, and a solid stream. 14. A self-cleaning wiresaw apparatus comprising: at least one cutting wire looped under tension within wire guide grooves on at least one pair of rotatable wire guide rollers, the cutting wire being movable with the synchronous rotation of the pair of rollers;a cutting region adapted to receive a substrate and to urge the substrate against at least one moving cutting wire to cut the substrate therewith; andat least one slurry dispenser adapted to dispense a cutting slurry from a supply thereof onto the moving cutting wire to aid in cutting the substrate;wherein at least one slurry dispenser is further adapted to alternatively dispense an aqueous cleaning fluid onto at least one movable or rotatable portion of the apparatus before, after, or intermittently during the process of cutting a substrate therewith to clean the portion of the apparatus. 15. The apparatus of claim 14 wherein at least one slurry dispenser is adapted to dispense the aqueous cleaning fluid onto a portion of the apparatus selected from the group consisting of a cutting wire, a wire guide groove, a wire guide roller, and a pulley. 16. The apparatus of claim 14 wherein the apparatus is adapted to direct a majority of the aqueous cleaning fluid away from the supply of cutting slurry after it contacts the movable or rotatable portion of the apparatus. 17. The apparatus of claim 14 wherein the aqueous cleaning fluid contains at least one of a corrosion inhibitor, an anti-drying additive, a surfactant, and air. 18. The apparatus of claim 14 wherein the apparatus further includes at least one dispenser adapted to dispense the aqueous cleaning fluid onto at least one cutting wire as the cutting wire exits the cutting region and the rollers of the wiresaw. 19. The apparatus of claim 14 wherein the slurry dispenser is adapted to spray an aqueous cleaning fluid at a pressure in the range of about 15 to about 30 pounds-per-square inch (psi).