Substrate backing device and substrate thermocompression-bonding device
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B29C-065/20
B32B-037/10
B32B-038/18
B32B-039/00
B32B-043/00
B30B-005/02
B32B-005/04
B30B-015/28
B25B-011/00
출원번호
US-0504591
(2011-07-05)
등록번호
US-8851138
(2014-10-07)
우선권정보
JP-2010-202578 (2010-09-10)
국제출원번호
PCT/JP2011/003830
(2011-07-05)
§371/§102 date
20120427
(20120427)
국제공개번호
WO2012/032701
(2012-03-15)
발명자
/ 주소
Maruo, Hiroki
Motomura, Koji
Eifuku, Hideki
Sakai, Tadahiko
출원인 / 주소
Panasonic Corporation
대리인 / 주소
Wenderoth, Lind & Ponack, L.L.P.
인용정보
피인용 횟수 :
0인용 특허 :
2
초록▼
A substrate backing device places and holds a rigid substrate thereon and receives, from therebelow, a pressing force during operations for thermocompressively bonding a flexible substrate thereto. The substrate backing device includes a plate-shaped backing plate provided with a backing support sur
A substrate backing device places and holds a rigid substrate thereon and receives, from therebelow, a pressing force during operations for thermocompressively bonding a flexible substrate thereto. The substrate backing device includes a plate-shaped backing plate provided with a backing support surface adapted to come into contact with the lower surface of the rigid substrate for supporting it. The backing support surface is provided with an opening portion having a planar opening shape encompassing the area of the rigid substrate to be compressively bonded to the flexible substrate. The backing support surface is provided, within the opening portion, a receiving member which, during the thermocompression bonding operations, come into contact with the lower surface of the rigid substrate and with an already-mounted component having been preliminarily mounted on this lower surface in the compression-bonding area and, further, apply an upward supporting counterforce corresponding to the pressing force.
대표청구항▼
1. A substrate backing device for placing and holding a first substrate and for receiving, from therebelow, a pressing force during thermocompressively bonding a second substrate to the first substrate, the substrate backing device comprising: a base portion having an upper surface and a horizontal
1. A substrate backing device for placing and holding a first substrate and for receiving, from therebelow, a pressing force during thermocompressively bonding a second substrate to the first substrate, the substrate backing device comprising: a base portion having an upper surface and a horizontal flat surface in the upper surface;a backing plate having a lower surface and an upper surface parallel with the lower surface, and being adapted to be contacted, at the lower surface of the backing plate, with the horizontal flat surface of the base portion, and having, in the upper surface of the backing plate, a backing support surface adapted to come into contact with a lower surface of the first substrate for supporting the first substrate;wherein the backing plate is rigid;wherein the backing support surface includes a holding flat-surface portion adapted to hold the lower surface of the first substrate placed on the backing plate, an opening portion which is shaped and positioned to encompass a compression bonding area of the first substrate placed on the opening portion which is to be compressively bonded to the second substrate, and a height reference portion which is provided adjacent to the opening portion and is adapted to restrict the first substrate in terms of a heightwise position of the first substrate;wherein the backing support surface is provided with a receiving member which is placed within the opening portion and is adapted to, during the thermocompression bonding, come into contact with the lower surface of the first substrate and with a component having been preliminarily mounted on the lower surface of the first substrate in an area coincident with the compression bonding area and, further, apply an upward supporting counterforce corresponding to the pressing force; andwherein the receiving member includes a resilient member which is adapted to exert an upward resilient force, which is induced when being pushed downwardly by the lower surface of the first substrate and the component which are in contact with an upper surface of the resilient member, as a supporting counterforce on the first substrate and on the component. 2. The substrate backing device according to claim 1, wherein the resilient member includes a plurality of blocks which are defined by a cutout extending from the upper surface of the resilient member and can be pushed individually. 3. The substrate backing device according to claim 2, wherein the cutout includes a plurality of first cutouts placed such that they are spaced apart from each other and extend in a linear shape in a first direction in a planar view, and a plurality of second cutouts placed such that they are spaced apart from each other and extend in a linear shape in a direction intersecting with the first direction in a planar view, andthe blocks have a column shape defined by the first and second cutouts. 4. The substrate backing device according to claim 1, wherein the resilient member comprises a combination of plural members made of materials having different resilient characteristics. 5. The substrate backing device according to claim 1, wherein the holding flat-surface portion is provided with a concave portion for preventing interference with the component having been already mounted on the lower surface of the first substrate. 6. The substrate backing device according to claim 5, further comprising a vacuum suction hole which is opened through a wall surface of the concave portion, andan evacuation system which is adapted to evacuate an inside of the concave portion through the vacuum suction hole for holding, through vacuum suction, the lower surface of the first substrate on the holding flat-surface portion. 7. The substrate backing device according to claim 1, wherein the first substrate comprises a substrate having flexibility, and the second substrate comprises a substrate having rigidity. 8. A substrate backing device for placing and holding a first substrate and for receiving, from therebelow, a pressing force during thermocompressively bonding a second substrate to the first substrate, the substrate backing device comprising: a base portion having an upper surface and a horizontal flat surface in the upper surface; anda backing plate having a lower surface and an upper surface parallel with the lower surface, and being adapted to be contacted, at the lower surface of the backing plate, with the horizontal flat surface of the base portion, and having, in the upper surface of the backing plate, a backing support surface adapted to come into contact with a lower surface of the first substrate for supporting the first substrate;wherein the backing support surface includes a holding flat-surface portion adapted to hold the lower surface of the first substrate placed on the backing plate, an opening portion which is shaped and positioned to encompass a compression bonding area of the first substrate placed on the opening portion which is to be compressively bonded to the second substrate, and a height reference portion which is provided adjacent to the opening portion and is adapted to restrict the first substrate in terms of a heightwise position of the first substrate,wherein the backing support surface is provided with a receiving member which is placed within the opening portion and is adapted to, during the thermocompression bonding, come into contact with the lower surface of the first substrate and with a component having been preliminarily mounted on the lower surface of the first substrate in an area coincident with the compression bonding area and, further, apply an upward supporting counterforce corresponding to the pressing force, andwherein the receiving member includes a resilient member which is adapted to exert an upward resilient force, which is induced when being pushed downwardly by the lower surface of the first substrate and the component which are in contact with an upper surface of the resilient member, as a supporting counterforce on the first substrate and on the component, andwherein the receiving member further includes a thickness adjustment member which is placed under the resilient member for adjusting a thickness of the entire receiving member. 9. A substrate backing device for placing and holding a first substrate and for receiving, from therebelow, a pressing force during thermocompressively bonding a second substrate to the first substrate, the substrate backing device comprising: a base portion having an upper surface and a horizontal flat surface in the upper surface; anda backing plate having a lower surface and an upper surface parallel with the lower surface, and being adapted to be contacted, at the lower surface of the backing plate, with the horizontal flat surface of the base portion, and having, in the upper surface of the backing plate, a backing support surface adapted to come into contact with a lower surface of the first substrate for supporting the first substrate;wherein the backing support surface includes a holding flat-surface portion adapted to hold the lower surface of the first substrate placed on the backing plate, an opening portion which is shaped and positioned to encompass a compression bonding area of the first substrate placed on the opening portion which is to be compressively bonded to the second substrate, and a height reference portion which is provided adjacent to the opening portion and is adapted to restrict the first substrate in terms of a heightwise position of the first substrate,wherein the backing support surface is provided with a receiving member which is placed within the opening portion and is adapted to, during the thermocompression bonding, come into contact with the lower surface of the first substrate and with a component having been preliminarily mounted on the lower surface of the first substrate in an area coincident with the compression bonding area and, further, apply an upward supporting counterforce corresponding to the pressing force, andwherein the opening portion has a cutout portion which communicates with an outside through a side surface of the backing plate at least in a single direction in a planar view, and this cutout portion is adapted to allow the receiving member to be attached and detached in a horizontal direction therethrough. 10. A substrate thermocompression-bonding device for pressing a second substrate to a first substrate for thermocompressively bonding them, the substrate thermocompression-bonding device comprising: the substrate backing device according to claim 1;a work transfer mechanism adapted to hold the second substrate and transfer it to the first substrate being held by the substrate backing device;a compression bonding portion adapted to press the transferred second substrate against the first substrate for thermocompressively bonding them; anda relative movement mechanism adapted to move the compression bonding portion with respect to the substrate backing portion.
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