IPC분류정보
| 국가/구분 |
United States(US) Patent
등록
|
| 국제특허분류(IPC7판) |
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| 출원번호 |
US-0445598
(2012-04-12)
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| 등록번호 |
US-8857261
(2014-10-14)
|
|
발명자
/ 주소 |
- Krohn, Matthew Harvey
- Meyer, Paul Aloysius
- Smith, Nathan John
- Matthews, Fred Timothy
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| 출원인 / 주소 |
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| 대리인 / 주소 |
|
| 인용정보 |
피인용 횟수 :
0 인용 특허 :
35 |
초록
▼
A sensing device and a method of attaching the sensing device to a target object is disclosed. The substrate of the sensing device has one or more bonding material vias that allows the bonding material used to attach the substrate to the target object to flow from one side of the substrate to the ot
A sensing device and a method of attaching the sensing device to a target object is disclosed. The substrate of the sensing device has one or more bonding material vias that allows the bonding material used to attach the substrate to the target object to flow from one side of the substrate to the other side of the substrate. The bonding material forms rivets to secure the substrate to the target object and to secure the layers of the substrate to each other.
대표청구항
▼
1. A sensing device comprising: a substrate for attachment to a surface of a target object using a bonding material, the substrate comprising a first side and a second side;one or more sensing elements located on the substrate;one or more bonding material vias extending from the first side of the su
1. A sensing device comprising: a substrate for attachment to a surface of a target object using a bonding material, the substrate comprising a first side and a second side;one or more sensing elements located on the substrate;one or more bonding material vias extending from the first side of the substrate to the second side of the substrate, wherein the bonding material vias are configured to allow the bonding material to flow from the second side of the substrate to the first side of the substrate and form bonding rivets on the first side of the substrate; andat least one layer on the first side of the substrate forming a window around each of the one or more bonding material vias and limiting the flow of the bonding material across the first side of the substrate within the window, wherein the at least one layer includes a material selected from the group consisting of polyimide, glass reinforced polyimide, copper, plating, electrolysis nickel over immersion gold, polyester, polyethylene naphthalate, and polyetherimide. 2. The sensing device of claim 1, wherein the one or more sensing elements are located on the second side of the substrate. 3. The sensing device of claim 1, wherein the substrate is a flexible circuit. 4. The sensing device of claim 1, wherein a diameter of the window around each of the one or more bonding material vias is greater than a diameter of its corresponding bonding material via. 5. The sensing device of claim 1, wherein the at least one layer includes a glass-reinforced polyimide layer formed over a copper layer. 6. The sensing device of claim 1, wherein the one or more sensing elements are piezoelectric elements. 7. The sensing device of claim 6, wherein the piezoelectric elements are ceramic piezoelectric transducers. 8. A sensing device for inspecting a target object, the sensing device comprising: a substrate comprising a first side and a second side, the substrate comprising one or more bonding material vias extending from the first side of the substrate to the second side of the substrate;at least one layer on the first side of the substrate forming a window around each of the one or more bonding material vias, wherein the at least one layer includes a material selected from the group consisting of polyimide, glass reinforced polyimide, copper, plating, electrolysis nickel over immersion gold, polyester, polyethylene naphthalate, and polyetherimide,one or more sensing elements located on the substrate; andbonding material between the entire second side of the substrate and the surface of the target object and extending from the second side of the substrate to the first side of the substrate through the one or more bonding material vias, forming bonding rivets on the first side of the substrate by covering a portion of the first side of the substrate adjacent the one or more bonding material vias. 9. The sensing device of claim 8, wherein the one or more sensing elements are located on the second side of the substrate. 10. The sensing device of claim 8, wherein the substrate is a flexible circuit. 11. The sensing device of claim 8, wherein the bonding material is selected from the group consisting of heat cured thermosettings, moisture cured thermosettings, two-part thermosettings, thermoplastics, cold-flow adhesives, epoxies, urethanes, polyimides, cyanoacrylates, urethanes, acrylics, silicones and hot melt adhesives. 12. The sensing device of claim 8, wherein the at least one layer includes a glass-reinforced polyimide layer formed over a copper layer. 13. The sensing device of claim 8, wherein one or more sensing elements are piezoelectric elements. 14. The sensing device of claim 13, wherein the piezoelectric elements are ceramic piezoelectric transducers. 15. A method of attaching a sensing device to a surface of a target object, the sensing device having a substrate with one or more bonding material vias, the method comprising the steps of: forming a layer on the first side of the substrate around each of the one or more bonding material vias, wherein the at least one layer includes a material selected from the group consisting of polyimide, glass reinforced polyimide, copper, plating, electrolysis nickel over immersion gold, polyester, polyethylene naphthalate, and polyetherimide;disposing a bonding material between a second side of the substrate and the surface of the target object;pressing the substrate and the bonding material against the surface of the target object causing the bonding material to disperse along the second side of the substrate and to flow through the one or more bonding material vias and onto a first side of the substrate to form one or more bonding rivets on the first side of the substrate, wherein the step of pressing the substrate includes causing the bonding material to contact the entire second side of the substrate; andmaintaining pressure to the first side of the substrate while the bonding material cures. 16. The method of claim 15, wherein the step of pressing the substrate further includes causing the bonding material to flow across the first side of the substrate including contacting the layer around each of the one or more bonding material vias. 17. The method of claim 15, wherein the layer on the first side of the substrate around each of the one or more bonding material vias comprises an opening having a diameter larger than a diameter of each of the one or more bonding material vias. 18. The method of claim 15, wherein the layer includes a glass-reinforced polyimide sheet and the forming-layer step includes disposing the glass-reinforced polyimide sheet over the first side of the substrate and laminating the glass-reinforced polyimide sheet to the substrate.
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