초록 ▼

The invention relates to a process for sealing an above-ground or underground construction. In particular it involves the use of non-reactive hot melt adhesives and flexible polyolefin films. This procedure in particular has the advantages that good and long-lasting adhesion can be achieved very qui

The invention relates to a process for sealing an above-ground or underground construction. In particular it involves the use of non-reactive hot melt adhesives and flexible polyolefin films. This procedure in particular has the advantages that good and long-lasting adhesion can be achieved very quickly, and that in particular by using polyolefin strips coated with non-reactive hot melt adhesives, insulating strips can be obtained simply which are non-tacky at room temperature and can be processed and bonded easily at the construction site.

대표청구항 ▼

1. Process for sealing an underground or above-ground construction, including the steps: a) coating a flexible polyolefin sealing film with a non-reactive hot melt adhesive compound to form a hot melt adhesive coated polyolefin sealing film, which is non-tacky at 25° C.;b) laying the hot melt adhesi

1. Process for sealing an underground or above-ground construction, including the steps: a) coating a flexible polyolefin sealing film with a non-reactive hot melt adhesive compound to form a hot melt adhesive coated polyolefin sealing film, which is non-tacky at 25° C.;b) laying the hot melt adhesive coated polyolefin sealing film on the surface of an above-ground or underground construction;c) adding heat to partially melt the non-reactive hot melt adhesive compound;d) cooling the non-reactive hot melt adhesive compound to form an adhesive bond between the flexible polyolefin sealing film and the surface of the construction,wherein the introduction of the heat in step c) occurs in such a way that the temperature of the hot melt adhesive compound does not exceed a temperature that is at least 30° C., below the melting point of the hot melt adhesive compound, andwherein the non-reactive hot melt adhesive compound contains no epoxy resin. 2. Process according to claim 1, wherein the non-reactive hot melt adhesive compound is a thermoplastic poly-α-olefin solid at 25° C., in a quantity of more than 50% by weight, based on the quantity of the non-reactive hot melt adhesive compound. 3. Process according to claim 1, wherein the non-reactive hot melt adhesive compound contains a copolymer that is solid at 25° C., which is obtained by free radical polymerization of at least two monomers with at least one, unsaturated C═C double bond, in a quantity of more than 50% by weight, based on the quantity of the non-reactive hot melt adhesive compound. 4. Process according to claim 1, wherein the non-reactive hot melt adhesive compound has a melting point of 80 to 200° C. 5. Process according to claim 1, wherein, the non-reactive hot melt adhesive compound in step a) is applied in the amount of 50 to 300 g/m2. 6. Process according to claim 1, wherein the surface of an underground or above-ground construction is a surface coated with hot melt adhesive, as obtained through the additional step a′) a′) applying a non-reactive hot melt adhesive compound to the surface of an underground or above-ground construction;with the provision that step a′) takes place before step b). 7. Process according to claim 1, wherein the introduction of heat in step c) occurs during the application of the hot melt adhesive coated polyolefin sealing film in step b), into the gap formed during the application between the hot melt adhesive coated polyolefin sealing film and the surface of a construction. 8. Process according to claim 1, wherein the introduction of heat in step c) takes place on the side of the polyolefin sealing film opposite from the hot melt adhesive compound, and is transferred onto the hot melt adhesive compound through the polyolefin sealing film. 9. Process according to claim 1, wherein the flexible polyolefin sealing film is reinforced with a fabric.