An apparatus for athermal ablation of a workpiece. The apparatus may include a laser device to direct a laser beam at the workpiece to remove a plurality of sections from the workpiece by athermal ablation. The removal may occur in a plurality of discrete motions that cause the laser beam to trace a
An apparatus for athermal ablation of a workpiece. The apparatus may include a laser device to direct a laser beam at the workpiece to remove a plurality of sections from the workpiece by athermal ablation. The removal may occur in a plurality of discrete motions that cause the laser beam to trace along outer perimeters of the sections in a specific order maintaining mechanical stability of the plurality of sections. The apparatus may further include a process gas nozzle to deliver process gas coaxially with the laser beam to clear debris and cool the workpiece, and a workpiece holder to hold and maneuver the workpiece during the removal of the plurality of sections.
대표청구항▼
1. An apparatus for athermal ablation of a workpiece, the apparatus comprising: a laser device to direct a laser beam at the workpiece to remove a plurality of sections from the workpiece by the athermal ablation, the removal occurring in a plurality of discrete motions that cause the laser beam to
1. An apparatus for athermal ablation of a workpiece, the apparatus comprising: a laser device to direct a laser beam at the workpiece to remove a plurality of sections from the workpiece by the athermal ablation, the removal occurring in a plurality of discrete motions that cause the laser beam to trace along outer perimeters of the plurality of sections in a specific order so as to maintain mechanical stability of the plurality of sections, wherein a frequency of the laser beam causes the athermal ablation at the workpiece, wherein the discrete motions include multiple lead-ins and lead-outs away from the perimeters of the plurality of sections; anda workpiece holder to hold and maneuver the workpiece during the removal of the plurality of sections. 2. The apparatus of claim 1, wherein the workpiece holder includes one or more polymer materials. 3. The apparatus of claim 1, wherein the workpiece holder is configured to hold a hollow tube. 4. The apparatus of claim 3, wherein the workpiece holder includes a mandrel to support the workpiece from the inside of the workpiece during the ablation process. 5. The apparatus of claim 4, wherein the mandrel includes at least an outer layer composed of the same material as the workpiece. 6. The apparatus of claim 4, wherein the mandrel is pressurized with a gas to increase and decrease the size of the mandrel in order to grip and release the workpiece. 7. The apparatus of claim 4, wherein the mandrel includes a spring loaded mechanism to grip and release the workpiece. 8. The apparatus of claim 4, wherein the mandrel includes an inner core that is tapered for ease of insertion and extraction. 9. The apparatus of claim 4, wherein a mandrel inner core includes a metal or a glass. 10. The apparatus of claim 1, wherein the workpiece holder is configured to hold a substantially flat workpiece. 11. The apparatus of claim 1, wherein the laser beam is generated by an ultrafast laser. 12. The apparatus of claim 1, wherein parameters of the laser beam are dynamically adjustable. 13. The apparatus of claim 1, wherein the laser device is configured to maneuver the laser beam in operation. 14. The apparatus of claim 1,further comprising a computer system having computer executable instructions configured to remove the plurality of sections that are selected in such a way that the workpiece is moved around its axis substantially in one direction as to avoid torsional distortion. 15. The apparatus of claim 1, wherein the workpiece holder is configured to hold a tubing structure including one or more of the following medical devices: an intravascular stent, a tumor encapsulator, and a catheter. 16. The apparatus of claim 1, further comprising a computer system having computer executable instructions configured to remove the plurality of sections using a multi-pass cutting technique, the workpiece being repetitively moved below the laser beam so that the laser beam traces outer perimeters of the plurality of sections for a plurality of passes, each pass cutting a partial thickness of the workpiece being machined away by the laser beam until a sufficient number of passes results in the laser beam cutting through the workpiece. 17. The apparatus of claim 1, further comprising a process gas nozzle, which is of a tapered conical shape with a small orifice positioned above a focal point of the laser beam, a clearance notch being cut into a side of the process gas nozzle to permit closer proximity to the focal point and to improve positioning stability of the workpiece. 18. The apparatus of claim 1, further comprising a computer system having computer executable instructions configured to make the laser beam cut a part of a section by starting in a first location internal to the section, moving onto the outer perimeter of the section, cutting along the outer perimeter of the section, and moving to a second location internal to the section. 19. The apparatus of claim 18, wherein the computer executable instructions are configured to remove the section by skipping parts of the outer perimeter of the section as to maintain mechanical stability of the section. 20. The apparatus of claim 1, wherein the laser beam is to achieve athermal material removal by ionization and Coulomb explosion. 21. The apparatus of claim 1, further comprising a process gas nozzle to deliver process gas substantially coaxially with the laser beam, the process gas clearing debris resulting from the laser ablation of the workpiece.
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