[특허]Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance

Phononic Device, Inc.

검색어에 아래의 연산자를 사용하시면 더 정확한 검색결과를 얻을 수 있습니다.
검색연산자

검색도움말
검색연산자	기능	검색시 예
()	우선순위가 가장 높은 연산자	예1) (나노 (기계 \| machine))
공백	두 개의 검색어(식)을 모두 포함하고 있는 문서 검색	예1) (나노 기계) 예2) 나노 장영실
\|	두 개의 검색어(식) 중 하나 이상 포함하고 있는 문서 검색	예1) (줄기세포 \| 면역) 예2) 줄기세포 \| 장영실
!	NOT 이후에 있는 검색어가 포함된 문서는 제외	예1) (황금 !백금) 예2) !image
*	검색어의 *란에 0개 이상의 임의의 문자가 포함된 문서 검색	예) semi*
""	따옴표 내의 구문과 완전히 일치하는 문서만 검색	예) "Transform and Quantization"

과학기술 지식인프라 ScienceON

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

특허 상세정보

MyON담기

내보내기 페이스북 공유 트위터 공유 카카오톡 공유

Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance

특허상세정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	F25B-021/02 F25B-021/00 H05K-001/18 H05K-001/02
미국특허분류(USC)	062/003.7; 062/003.2
출원번호	US-0888847 (2013-05-07)
등록번호	US-8893513 (2014-11-25)
발명자 / 주소	June, M. Sean Therrien, Robert Joseph Yadav, Abhishek Edwards, Jesse W.
출원인 / 주소	Phononic Device, Inc.
대리인 / 주소	Withrow & Terranova, PLLC
인용정보	피인용 횟수 : 6 인용 특허 : 197

초록
▼

A thermoelectric heat exchanger component includes a circuit board and multiple thermoelectric devices attached to the circuit board. Heights of at least two of the thermoelectric devices are different due to, for example, tolerances in a manufacturing process for the thermoelectric devices. The thermoelectric heat exchanger component also includes a first heat spreading lid over a first surface of the thermoelectric devices and a second heat spreading lid over a second surface of the thermoelectric devices. A thermal interface material is present between each one of the thermoelectric devices and the first and second heat spreading lids. The first heat spreading lid and the second heat spreading lid are oriented such that the thickness of the thermal interface material, and thus a thermal interface resistance, is optimized for the thermoelectric devices.

대표
청구항
▼

1. A thermoelectric heat exchanger component, comprising: a circuit board;a plurality of thermoelectric devices attached to the circuit board, wherein two or more of the plurality of thermoelectric devices have different heights relative to the circuit board;a heat spreading lid over the plurality of thermoelectric devices; anda thermal interface material between the plurality of thermoelectric devices and the heat spreading lid;wherein the heat spreading lid is oriented such that the thickness of the thermal interface material, and thus a thermal interface resistance, is minimized for the plurality of thermoelectric devices. 2. The thermoelectric heat exchanger component of claim 1 wherein: the plurality of thermoelectric devices are attached to a first surface of the circuit board and include a first surface opposite the first surface of the circuit board and a second surface opposite the first surface;the two or more of the plurality of thermoelectric devices have different heights relative to the first surface of the circuit board;the heat spreading lid is on the first surfaces of the plurality of thermoelectric devices opposite the first surface of the circuit board; andthe thermal interface material is between the first surfaces of the plurality of thermoelectric devices and the heat spreading lid. 3. The thermoelectric heat exchanger of claim 2 further comprising: a second heat spreading lid on the second surfaces of the plurality of thermoelectric devices exposed at a second surface of the circuit board through one or more holes through the circuit board; anda second thermal interface material between the plurality of thermoelectric devices and the second heat spreading lid;wherein the second heat spreading lid is oriented such that the thickness of the second thermal interface material, and thus a thermal interface resistance, is minimized for the plurality of thermoelectric devices. 4. The thermoelectric heat exchanger component of claim 2 wherein the heat spreading lid comprises: a body; anda plurality of pedestals of equal heights that extend from the body toward the first surfaces of the plurality of thermoelectric devices such that each pedestal of the plurality of pedestals is aligned with a corresponding one of the plurality of thermoelectric devices;wherein the thermal interface material is between a surface of each pedestal of the plurality of pedestals and the first surface of the corresponding one of the plurality of thermoelectric devices, and the orientation of the heat spreading lid is such that the thickness of the thermal interface material between each pedestal of the plurality of pedestals and the first surface of the corresponding one of the plurality of thermoelectric devices is minimized for the plurality of thermoelectric devices. 5. The thermoelectric heat exchanger component of claim 4 wherein the thermal interface material is one of a group consisting of: solder and thermal grease. 6. The thermoelectric heat exchanger component of claim 4 wherein each pedestal of the plurality of pedestals is a parallelepiped. 7. The thermoelectric heat exchanger component of claim 4 wherein each pedestal of the plurality of pedestals is a frustum. 8. The thermoelectric heat exchanger component of claim 4 wherein an area of the surface of each pedestal of the plurality of pedestals is in a range of and including 1 to 10 percent smaller than an area of the first surface of the corresponding one of the plurality of thermoelectric devices. 9. The thermoelectric heat exchanger component of claim 4 wherein the heat spreading lid further comprises a lip that extends from the body of the heat spreading lid around a periphery of the heat spreading lid. 10. The thermoelectric heat exchanger component of claim 9 wherein a height of the lip relative to the body of the heat spreading lid is such that, for any combination of heights of the plurality of thermoelectric devices within a predefined tolerance range, at least a predefined minimum gap is maintained between the lip of the heat spreading lid and the first surface of the circuit board, wherein the at least the predefined minimum gap is greater than zero. 11. The thermoelectric heat exchanger component of claim 10 further comprising an attach material that fills the at least the predefined minimum gap between the lip of the heat spreading lid and the first surface of the circuit board around the periphery of the heat spreading lid. 12. The thermoelectric heat exchanger component of claim 11 wherein the lip of the heat spreading lid and the attach material absorb force applied to the heat spreading lid so as to protect the plurality of thermoelectric devices. 13. The thermoelectric heat exchanger component of claim 11 wherein the attach material is an epoxy. 14. The thermoelectric heat exchanger component of claim 11 further comprising a thermal insulator preform having a hole with dimensions that correspond to dimensions of the heat spreading lid, the thermal insulator preform being positioned over the circuit board such that the heat spreading lid passes through the hole in the thermal insulator preform. 15. The thermoelectric heat exchanger component of claim 1 wherein: the plurality of thermoelectric devices are attached to a first surface of the circuit board and include a first surface opposite the first surface of the circuit board and a second surface opposite the first surface;the heat spreading lid is over the first surfaces of the plurality of thermoelectric devices that are exposed at a second surface of the circuit board through one or more holes through the circuit board;the two or more of the plurality of thermoelectric devices have different heights relative to the second surface of the circuit board; andthe thermal interface material is between the first surfaces of the plurality of thermoelectric devices and the heat spreading lid. 16. The thermoelectric heat exchanger component of claim 15 wherein the heat spreading lid comprises: a body; anda plurality of pedestals of equal heights that extend from the body toward the first surfaces of the plurality of thermoelectric devices such that each pedestal of the plurality of pedestals is aligned with a corresponding one of the plurality of thermoelectric devices;wherein the thermal interface material is between each pedestal of the plurality of pedestals and the first surface of the corresponding one of the plurality of thermoelectric devices, and the heat spreading lid is oriented such that the thickness of the thermal interface material between each pedestal of the plurality of pedestals and the first surface of the corresponding one of the plurality of thermoelectric devices, and thus a thermal interface resistance, is minimized for the plurality of thermoelectric devices. 17. The thermoelectric heat exchanger component of claim 16 wherein the thermal interface material is one of a group consisting of: solder and thermal grease. 18. The thermoelectric heat exchanger component of claim 16 wherein each pedestal of the plurality of pedestals is a parallelepiped. 19. The thermoelectric heat exchanger component of claim 16 wherein each pedestal of the plurality of pedestals is a frustum. 20. The thermoelectric heat exchanger component of claim 16 wherein an area of a surface of each pedestal of the plurality of pedestals is in a range of and including 1 to 10 percent smaller than an area of the first surface of the corresponding one of the plurality of thermoelectric devices. 21. The thermoelectric heat exchanger component of claim 16 wherein the heat spreading lid further comprises a lip that extends from the body of the heat spreading lid around a periphery of the heat spreading lid. 22. The thermoelectric heat exchanger component of claim 21 wherein a height of the lip relative to the body of the heat spreading lid is such that, for any combination of heights of the plurality of thermoelectric devices within a predefined tolerance range, at least a predefined minimum gap is maintained between the lip of the heat spreading lid and the second surface of the circuit board, wherein the at least the predefined minimum gap is greater than zero. 23. The thermoelectric heat exchanger component of claim 22 further comprising an attach material that fills the at least the predefined minimum gap between the lip of the heat spreading lid and the second surface of the circuit board around the periphery of the heat spreading lid. 24. The thermoelectric heat exchanger component of claim 23 wherein the lip of the heat spreading lid and the attach material absorb force applied to the heat spreading lid so as to protect the plurality of thermoelectric devices. 25. The thermoelectric heat exchanger component of claim 23 wherein the attach material is an epoxy. 26. The thermoelectric heat exchanger component of claim 23 further comprising a thermal insulator preform having a hole with dimensions that correspond to dimensions of the heat spreading lid, the thermal insulator preform being positioned over the circuit board such that the heat spreading lid passes through the hole in the thermal insulator preform.

이 특허에 인용된 특허 (197)

이 특허를 인용한 특허 피인용횟수: 6

IPC 상위 출원인

내보내기

상세정보
내보내기 구분	파일저장 인쇄 메일전송
구성항목	관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표IPC 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 공고번호, 공고일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표출원인, 출원인국적, 출원인주소, 발명자, 발명자E, 발명자코드, 발명자주소, 발명자 우편번호, 발명자국적, 대표IPC, IPC코드, 요약, 미국특허분류, 대리인주소, 대리인코드, 대리인(한글), 대리인(영문), 국제공개일자, 국제공개번호, 국제출원일자, 국제출원번호, 우선권, 우선권주장일, 우선권국가, 우선권출원번호, 원출원일자, 원출원번호, 지정국, Citing Patents, Cited Patents
저장형식	Text(ASCII format) Excel format PIAS분석(.xls)
메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
안내	> 총 건의 자료가 검색되었습니다. > 다운받으실 자료의 인덱스를 입력하세요. (1-10,000) > 검색결과의 순서대로 최대 10,000건 까지 다운로드가 가능합니다. > 데이타가 많을 경우 속도가 느려질 수 있습니다.(최대 2~3분 소요) > 다운로드 파일은 UTF-8 형태로 저장됩니다. 파일의 내용이 제대로 보이지 않을실 때는 웹브라우저 상단의 보기 -> 인코딩 -> 자동선택 여부를 확인하십시오 > ~ > Text(ASCII format) Excel format

과학기술 지식인프라 ScienceON

ScienceON Chatbot

연합인증

특허 상세정보

Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance

초록
▼

대표
청구항
▼

이 특허에 인용된 특허 (197)

이 특허를 인용한 특허 피인용횟수: 6

IPC 상위 출원인

과제정보

상세정보조회

원문조회

IPC 상세정보(version : 201201)

연구과제 성과물(0)

참여연구원의 다른 문헌(0)

처리중입니다.

잠시만 기다려주세요.

ScienceON Chatbot

연합인증

특허 상세정보

Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance

초록 ▼

대표청구항 ▼

이 특허에 인용된 특허 (197)

이 특허를 인용한 특허 피인용횟수: 6

IPC 상위 출원인

과제정보

상세정보조회

원문조회

IPC 상세정보(version : 201201)

연구과제 성과물(0)

참여연구원의 다른 문헌(0)

처리중입니다.

잠시만 기다려주세요.

초록
▼

대표
청구항
▼