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Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F25B-021/02
  • F25B-021/00
  • H05K-001/18
  • H05K-001/02
출원번호 US-0888847 (2013-05-07)
등록번호 US-8893513 (2014-11-25)
발명자 / 주소
  • June, M. Sean
  • Therrien, Robert Joseph
  • Yadav, Abhishek
  • Edwards, Jesse W.
출원인 / 주소
  • Phononic Device, Inc.
대리인 / 주소
    Withrow & Terranova, PLLC
인용정보 피인용 횟수 : 6  인용 특허 : 197

초록

A thermoelectric heat exchanger component includes a circuit board and multiple thermoelectric devices attached to the circuit board. Heights of at least two of the thermoelectric devices are different due to, for example, tolerances in a manufacturing process for the thermoelectric devices. The the

대표청구항

1. A thermoelectric heat exchanger component, comprising: a circuit board;a plurality of thermoelectric devices attached to the circuit board, wherein two or more of the plurality of thermoelectric devices have different heights relative to the circuit board;a heat spreading lid over the plurality o

이 특허에 인용된 특허 (197)

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  4. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Thermoelectric heat exchange system comprising cascaded cold side heat sinks.
  5. Olsson, Mattias K-O; Yadav, Abhishek; Newman, Devon, Thermoelectric heat pump with a surround and spacer (SAS) structure.
  6. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Two-phase heat exchanger mounting.
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