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Method for the manufacture of a cermet-containing bushing 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C04B-111/94
  • C22C-029/16
  • C04B-035/645
  • C04B-035/119
  • A61N-001/375
  • C22C-029/12
출원번호 US-0361398 (2012-01-30)
등록번호 US-8894914 (2014-11-25)
우선권정보 DE-10 2011 009 861 (2011-01-31)
발명자 / 주소
  • Pavlovic, Goran
출원인 / 주소
  • Heraeus Precious Metals GmbH & Co.
대리인 / 주소
    Dicke, Billig & Czaja, PLLC
인용정보 피인용 횟수 : 18  인용 특허 : 53

초록

One aspect relates to a method for the manufacture of an electrical bushing for use in a housing of an active implantable medical device. The electrical bushing includes an electrically insulating base body and an electrical conducting element. The conducting element is set-up to establish, through

대표청구항

1. A method for the manufacture of an electrical bushing for use in a housing of an active implantable medical device, whereby the electrical bushing comprises at least one electrically insulating base body and at least one electrical conducting element;whereby the conducting element is set-up to es

이 특허에 인용된 특허 (53)

  1. Dahlberg Kenneth,SEX, Active medical implant with a hermetically sealed capsule.
  2. Stevenson, Robert A., Apparatus and process for reducing the susceptability of active implantable medical devices to medical procedures such as magnetic resonance imaging.
  3. Nagata, Koji; Higashi, Yoshitaka, Cable mounting structure for electric apparatus.
  4. Seifried Lynn M. ; Lessar Joseph F. ; Wolf William D. ; Fraley Mary A. ; Tidemand Kevin K. ; Engmark David B. ; Hoch Ronald F. ; Wiklund Craig L., Capacitive filter feedthrough for implantable medical device.
  5. William D. Wolf ; James Strom ; Craig L. Wiklund ; Mary A. Fraley ; Lynn M. Seifried ; James E. Volmering ; Patrick F. Malone ; Samuel F. Haq, Capacitive filtered feedthrough array for an implantable medical device.
  6. Wolf, William D.; Strom, James; Wiklund, Craig L.; Fraley, Mary A.; Seifried, Lynn M.; Volmering, James E.; Malone, Patrick F.; Haq, Samuel F., Capacitive filtered feedthrough array for an implantable medical device.
  7. Wei George C. ; Juengst Stefan,DEX ; Thibodeau Rodrique G. ; Selverian John, Ceramic envelope device, lamp with such a device, and method of manufacture of such devices.
  8. Hing Peter (Birstall GB2) Kay Ronald (East Goscote GB2), Cermet materials.
  9. Sack Werner (Mainz DEX) Lindig Otto (Mainz DEX), Crack-resistant, heat-absorbing fusion glasses enabling low processing temperatures for the hermetic encapsulation of el.
  10. Hopper ; Jr. Albert C. (St. Petersburg FL), Direct metal brazing to cermet feedthroughs.
  11. Stevenson,Robert A.; Brendel,Richard L.; Frysz,Christine; Hussein,Haytham; Knappen,Scott; Stevenson,Ryan A., EMI filter terminal assembly with wire bond pads for human implant applications.
  12. Teske, Josef; Eck, Stefan; Frauenstein, Boris; Haas, Erich, Electrical feedthrough.
  13. Wessendorf, Kurt O.; Okandan, Murat; Stein, David J.; Yang, Pin; Cesarano, III, Joseph; Dellinger, Jennifer, Electrode array for neural stimulation.
  14. Taylor, William J.; Seifried, Lynn M.; Wolf, William D.; Ries, Andrew J.; Kast, John E., Feedthrough apparatus with noble metal-coated leads.
  15. Taylor, William John; Tischendorf, Brad C., Feedthrough assembly including a ferrule, an insulating structure and a glass.
  16. Wegrzyn, III, Thomas J.; Maierhofer, Edward J.; Rohl, James P.; VanDerlick, Stephen W.; Haasl, Benjamin J., Feedthrough assembly including sleeve and methods related thereto.
  17. Duncan Donald A. (Cambridge MA) Brown Lawrence E. (New Kensington PA), Feedthrough connector for implantable cardiac pacer.
  18. Frysz, Christine A.; Winn, Steven, Feedthrough filter capacitor assemblies having low cost terminal pins.
  19. Stevenson,Robert A., Feedthrough filter capacitor assembly with internally grounded hermetic insulator.
  20. Zhao, Jennifer J.; Litow, Micah A.; Iyer, Rajesh; Belete, Dawit Y.; Goldman, Simon E.; Knowles, Shawn D., Filtering capacitor feedthrough assembly.
  21. Zhao,Jennifer J.; Litow,Micah A.; Iyer,Rajesh; Belete,Dawit Y.; Goldman,Simon E.; Knowles,Shawn D., Filtering capacitor feedthrough assembly.
  22. Kraska Robert E. (Minneapolis MN) Lessar Joseph F. (Anoka MN), Gold based alloy composition and brazing therewith, particularly for ceramic-metal seals in electrical feedthroughs.
  23. Reisinger, Andreas; Glynn, Jeremy, Head part for an implantable medical device.
  24. Biggs, James C., Header over-molded on a feedthrough assembly for an implantable device.
  25. Lin Lifun (Hamden CT), Hermetic cerglass and cermet electronic packages.
  26. Kraska Robert E. (Minneapolis MN) Wilary Frank J. (Plymouth MN) Lessar Joseph F. (Coon Rapids MN), Hermetic electrical feedthrough assembly.
  27. Malinowski, Zdzislaw B.; Colvin, Michael S.; Halberg, Leslie I., Hermetic implantable stimulator.
  28. Byers Charles L. (Canyon Country CA) Beazell James W. (Rancho Palos Verdes CA) Schulman Joseph H. (Granada Hills CA) Rostami Ali (Santa Monica CA), Hermetically sealed ceramic and metal package for electronic devices implantable in living bodies.
  29. Stevenson,Robert A.; Brendel,Richard L.; Frysz,Christine A.; Hussein,Haytham; Dobbs,Matthew A., Hybrid spring contact system for EMI filtered hermetic seals for active implantable medical devices.
  30. Sochor, Jerzy Roman, Implantable connector with contact-containing feedthrough pins.
  31. Sochor, Jerzy Roman, Implantable connector with protected contacts.
  32. Fischbach, Adam C.; Fedor, Steve L., Implantable medical device feedthrough assembly having a coated conductor.
  33. Lim, Wist, Implantable pulse generator EMI filtered feedthru.
  34. He, Tom Xiaohai; Haller, Matthew Isaac, Implantable stimulator with integrated plastic housing/metal contacts and manufacture and use.
  35. Stevenson,Robert A.; Frysz,Christine A.; Hussein,Haytham; Brendel,Richard L., Inductor capacitor EMI filter for human implant applications.
  36. Lim,Wisit; Hawkins,Rodney J.; Sahabi,Kavous, Integrated 8-pole filtered feedthrough with backfill tube for implantable medical devices.
  37. Spadgenske,Scott A., Interconnect for implantable medical device header.
  38. Janzig, Darren A.; Lindner, Gerald G.; Paidosh, Chris J., Internal hermetic lead connector for implantable device.
  39. Wahlstrand,Carl D.; Hoegh,Thomas Barry; Hrdlicka,Gregory A.; Cross, Jr.,Thomas E.; Olsen,James M., Lead electrode for use in an MRI-safe implantable medical device.
  40. Greenberg, Robert J.; Ok, Jerry, Method and apparatus for providing hermetic electrical feedthrough.
  41. Ok, Jerry; Greenberg, Robert J., Method and apparatus for providing hermetic electrical feedthrough.
  42. Ok,Jerry; Greenberg,Robert J., Method and apparatus for providing hermetic electrical feedthrough.
  43. Knappen,Scott; Naugler,Robert; Hussein,Haytham; Shipman,Thomas; Brendel,Richard; Frysz,Christine, Method for minimizing stress in feedthrough capacitor filter assemblies.
  44. Troetzschel, Jens; Pavlovic, Goran; Manhardt, Harald; Wollenberg, Norbert; Guebler, Nicole, Method for sintering electrical bushings.
  45. Terao, Eiji, Method of manufacturing glass substrate and method of manufacturing electronic components.
  46. Troetzschel, Jens; Pavlovic, Goran; Manhardt, Harald; Guebler, Nicole, Method of producing an electrical bushing with gradient cermet.
  47. Horine David A. (Los Altos CA) Love David G. (Pleasanton CA), Methods for making high-density/long-via laminated connectors.
  48. Kinney, James; Coffed, James; Kustra, Gabriel A., Molded header connected to a medical device by lateral deformation of a sleeve/feedthrough pin sub-assembly.
  49. Coffed, James; Kinney, James; Biggs, Jr., James C.; Gray, Joseph, One-piece header assembly for an implantable medical device and methods for making same.
  50. Zhang,Jindong; Newnham,Robert E., Process for fabricating hollow electroactive devices.
  51. Stevenson, Robert A.; Haskell, Donald K.; Brendel, Richard L., Process for manufacturing an EMI filter feedthrough terminal assembly.
  52. Scherer Fridolin (Untersiggenthal CH), Vacuum-tight metal-ceramic soldered joint.
  53. Horiuchi Michio,JPX ; Takeuchi Yukiharu,JPX, Wiring substrate having vias.

이 특허를 인용한 특허 (18)

  1. Specht, Heiko; Markham, Jacob; Pavlovic, Goran; Hausch, Ulrich, Capacitor and method to manufacture the capacitor.
  2. Specht, Heiko; Glynn, Jeremy, Ceramic bushing for an implantable medical device.
  3. Reisinger, Andreas, Ceramic bushing with filter.
  4. Reisinger, Andreas, Ceramic bushing with filter.
  5. Markham, Jacob; Hausch, Ulrich; Pavlovic, Goran, Ceramic feedthrough brazed to an implantable medical device housing.
  6. Markham, Jacob; Hausch, Ulrich, Direct integration of feedthrough to implantable medical device housing by sintering.
  7. Markham, Jacob; Hausch, Ulrich, Direct integration of feedthrough to implantable medical device housing using a gold alloy.
  8. Markham, Jacob; Hausch, Ulrich, Direct integration of feedthrough to implantable medical device housing with ultrasonic welding.
  9. Markham, Jacob; Hausch, Ulrich, Direct integration of feedthrough to implantable medical device housing with ultrasonic welding.
  10. Markham, Jacob; Hausch, Ulrich, Directly integrated feedthrough to implantable medical device housing.
  11. Kempf, Mark; Reisinger, Andreas, Electrical bushing with cermet-containing connecting element for an active implantable medical device.
  12. Markham, Jacob; Hausch, Ulrich, Feedthrough with integrated brazeless ferrule.
  13. Reisinger, Andreas; Glynn, Jeremy, Head part for an implantable medical device.
  14. Kempf, Mark; Pavlovic, Goran, Implantable device having an integrated ceramic bushing.
  15. Markham, Jacob; Hausch, Ulrich; Pavlovic, Goran, Laser welding a feedthrough.
  16. Markham, Jacob; Hausch, Ulrich; Pavlovic, Goran, Method of coupling a feedthrough assembly for an implantable medical device.
  17. Pavlovic, Goran; Glynn, Jeremy, Method of forming a cermet-containing bushing for an implantable medical device having a connecting layer.
  18. Markham, Jacob; Hausch, Ulrich, Method of forming feedthrough with integrated brazeless ferrule.
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