Methods and materials for anchoring gapfill metals
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B32B-015/04
B32B-003/30
출원번호
US-0404274
(2012-02-24)
등록번호
US-8895441
(2014-11-25)
발명자
/ 주소
Kolics, Artur
출원인 / 주소
Lam Research Corporation
대리인 / 주소
Beyer Law Group LLP
인용정보
피인용 횟수 :
0인용 특허 :
21
초록▼
One aspect of the present invention includes a method of fabricating an electronic device. According to one embodiment, the method comprises providing a substrate having dielectric oxide surface areas adjacent to electrically conductive surface areas, chemically bonding an anchor compound with the d
One aspect of the present invention includes a method of fabricating an electronic device. According to one embodiment, the method comprises providing a substrate having dielectric oxide surface areas adjacent to electrically conductive surface areas, chemically bonding an anchor compound with the dielectric oxide surface areas so as to form an anchor layer, initiating the growth of a metal using the electrically conductive surface areas and growing the metal so that the anchor layer also bonds with the metal. The anchor compound has at least one functional group capable of forming a chemical bond with the oxide surface and has at least one functional group capable of forming a chemical bond with the metal. Another aspect of the present invention is an electronic device. A third aspect of the present invention is a solution comprising the anchor compound.
대표청구항▼
1. A method of fabricating an electronic device, the method comprising: providing a substrate having dielectric oxide surface areas adjacent to electrically conductive surface areas;chemically bonding an anchor compound with the dielectric oxide surface areas so as to form an anchor layer;initiating
1. A method of fabricating an electronic device, the method comprising: providing a substrate having dielectric oxide surface areas adjacent to electrically conductive surface areas;chemically bonding an anchor compound with the dielectric oxide surface areas so as to form an anchor layer;initiating the growth of a metal using the electrically conductive surface areas and growing the metal so that the anchor layer bonds with the metal,wherein the anchor compound comprises an inorganic oxoanion having the generic formula AXOYZ- wherein, A is a chemical element, O is oxygen, X is an integer, Y is an integer, and Z is an integer. 2. The method of claim 1, wherein the anchor compound has at least one functional group capable of forming a chemical bond with the oxide surface and having at least one functional group capable of forming a chemical bond with the metal. 3. The method of claim 1, wherein the anchor compound comprises an inorganic oxoanion, an amine, an imine, a cyanide, a functional group that forms complexes with ions of the metal, a functional group that adsorbs strongly on the metal, and or combinations thereof. 4. The method of claim 1, wherein the anchor compound comprises phosphate, phosphite, or phosphonate. 5. The method of claim 1, further comprising making the surface of the metallization contacts substantially oxide free prior to the chemically bonding an anchor compound with the dielectric oxide. 6. The method of claim 1, wherein the dielectric oxide is a surface oxide formed on a dissimilar material. 7. The method of claim 1, wherein the chemically bonding an anchor compound with the dielectric oxide surface areas is a dry chemical process using a gas comprising the anchor compound. 8. The method of claim 1, wherein chemically bonding an anchor compound with the dielectric oxide surface areas is a wet chemical process using a liquid solution comprising the anchor compound. 9. The method of claim 8, wherein the liquid solution further comprises dimethylsulfoxide, formamide, acetonitrile, alcohol, or mixtures thereof. 10. The method of claim 1, wherein the oxide surface comprises at least one selected from the group consisting of SiO2, SiOC, SiOCH, SiON, SiOCN, SiOCHN, Ta2O5, and TiO2. 11. The method of claim 1, wherein the gapfill metal comprises cobalt, copper, gold, iridium, nickel, osmium, palladium, platinum, rhenium, ruthenium, rhodium, silver, tin, zinc, electrolessly plated alloys, or mixtures thereof. 12. A method of fabricating an electronic device, the method comprising: providing a substrate having dielectric oxide surface areas adjacent to electrically conductive surface areas;chemically bonding an anchor compound with the dielectric oxide surface areas so as to form an anchor layer;initiating the growth of a metal using the electrically conductive surface areas and growing the metal so that the anchor layer bonds with the metal,wherein the anchor compound comprises mono-alkoxy silane, di-alkoxy silane, or tri-alkoxy silane and at least one from the group consisting of an amine group, an imine group, a carboxylate group, a cyanide group, a phosphate group, a phosphite group, a phosphonate group, and an epoxy group. 13. The method of claim 12, wherein the anchor compound has at least one functional group capable of forming a chemical bond with the oxide surface and having at least one functional group capable of forming a chemical bond with the metal. 14. The method of claim 12, wherein the anchor compound comprises an inorganic oxoanion, an amine, an imine, a cyanide, a functional group that forms complexes with ions of the metal, a functional group that adsorbs strongly on the metal, and or combinations thereof. 15. The method of claim 12, wherein the anchor compound comprises phosphate, phosphate, or phosphonate. 16. The method of claim 12, further comprising making the surface of the metallization contacts substantially oxide free prior to the chemically bonding an anchor compound with the dielectric oxide. 17. The method of claim 12, wherein the dielectric oxide is a surface oxide formed on a dissimilar material. 18. The method of claim 12, wherein the chemically bonding an anchor compound with the dielectric oxide surface areas is a dry chemical process using a gas comprising the anchor compound. 19. The method of claim 12, wherein chemically bonding an anchor compound with the dielectric oxide surface areas is a wet chemical process using a liquid solution comprising the anchor compound. 20. The method of claim 19, wherein the liquid solution further comprises dimethylsulfoxide, formamide, acetonitrile, alcohol, or mixtures thereof. 21. The method of claim 12, wherein the oxide surface comprises at least one selected from the group consisting of SiO2, SiOC, SiOCH, SiON, SiOCN, SiOCHN, Ta2O5, and TiO2. 22. The method of claim 12, wherein the gapfill metal comprises cobalt, copper, gold, iridium, nickel, osmium, palladium, platinum, rhenium, ruthenium, rhodium, silver, tin, zinc, electrolessly plated alloys, or mixtures thereof. 23. A method of fabricating an electronic device, the method comprising: providing a substrate having dielectric oxide surface areas adjacent to electrically conductive surface areas;chemically bonding an anchor compound with the dielectric oxide surface areas so as to form an anchor layer;initiating the growth of a metal using the electrically conductive surface areas and growing the metal so that the anchor layer bonds with the metal, wherein the anchor compound has the general formula (R1—O)V-nMGn where M is germanium, hafnium, indium, silicon, tantalum, tin, titanium, or tungsten;G is a functional group capable of forming the chemical bond with the metal;R1—O is the functional group capable of forming the chemical bond with the oxide surface, O is oxygen;V is the valence of M; andn is an integer from 1 to V−1. 24. The method of claim 23, wherein R1 is an alkyl group, M is silicon, and G is an alkylamine. 25. The method of claim 23, wherein the anchor compound has at least one functional group capable of forming a chemical bond with the oxide surface and having at least one functional group capable of forming a chemical bond with the metal. 26. The method of claim 23, wherein the anchor compound comprises an inorganic oxoanion, an amine, an imine, a cyanide, a functional group that forms complexes with ions of the metal, a functional group that adsorbs strongly on the metal, and or combinations thereof. 27. The method of claim 23, wherein the anchor compound comprises phosphate, phosphate, or phosphonate. 28. The method of claim 23, further comprising making the surface of the metallization contacts substantially oxide free prior to the chemically bonding an anchor compound with the dielectric oxide. 29. The method of claim 23, wherein the dielectric oxide is a surface oxide formed on a dissimilar material. 30. The method of claim 23, wherein the chemically bonding an anchor compound with the dielectric oxide surface areas is a dry chemical process using a gas comprising the anchor compound. 31. The method of claim 23, wherein chemically bonding an anchor compound with the dielectric oxide surface areas is a wet chemical process using a liquid solution comprising the anchor compound. 32. The method of claim 31, wherein the liquid solution further comprises dimethylsulfoxide, formamide, acetonitrile, alcohol, or mixtures thereof. 33. The method of claim 31, wherein the oxide surface comprises at least one selected from the group consisting of SiO2, SiOC, SiOCH, SiON, SiOCN, SiOCHN, Ta2O5, and TiO2. 34. The method of claim 23, wherein the gapfill metal comprises cobalt, copper, gold, iridium, nickel, osmium, palladium, platinum, rhenium, ruthenium, rhodium, silver, tin, zinc, electrolessly plated alloys, or mixtures thereof.
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