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특허 상세정보

Methods and materials for anchoring gapfill metals

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) B32B-015/04    B32B-003/30   
미국특허분류(USC) 438/678; 257/E21.179; 257/E21.479; 427/123
출원번호 US-0404274 (2012-02-24)
등록번호 US-8895441 (2014-11-25)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Beyer Law Group LLP
인용정보 피인용 횟수 : 0  인용 특허 : 21
초록

One aspect of the present invention includes a method of fabricating an electronic device. According to one embodiment, the method comprises providing a substrate having dielectric oxide surface areas adjacent to electrically conductive surface areas, chemically bonding an anchor compound with the dielectric oxide surface areas so as to form an anchor layer, initiating the growth of a metal using the electrically conductive surface areas and growing the metal so that the anchor layer also bonds with the metal. The anchor compound has at least one functio...

대표
청구항

1. A method of fabricating an electronic device, the method comprising: providing a substrate having dielectric oxide surface areas adjacent to electrically conductive surface areas;chemically bonding an anchor compound with the dielectric oxide surface areas so as to form an anchor layer;initiating the growth of a metal using the electrically conductive surface areas and growing the metal so that the anchor layer bonds with the metal,wherein the anchor compound comprises an inorganic oxoanion having the generic formula AXOYZ- wherein, A is a chemical el...

이 특허에 인용된 특허 (21)

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