IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0464077
(2012-05-04)
|
등록번호 |
US-8899786
(2014-12-02)
|
발명자
/ 주소 |
- Moghal, Khurram Zeshan
- Winters, Philip Dean
- Nimma, Sridhar Reddy
|
출원인 / 주소 |
- Cooper Technologies Company
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
7 인용 특허 :
8 |
초록
▼
A light module includes a cover, a circuit board, a gasket, a bottom covering, and an optional optic assembly. The cover includes an inner and an outer wall extending outwardly from the cover, where the outer wall surrounds the inner wall and forms a groove therebetween. The circuit board is positio
A light module includes a cover, a circuit board, a gasket, a bottom covering, and an optional optic assembly. The cover includes an inner and an outer wall extending outwardly from the cover, where the outer wall surrounds the inner wall and forms a groove therebetween. The circuit board is positioned within the inner wall's profile and includes a plurality of LEDs. The gasket is disposed within the groove. The bottom covering is positioned adjacent to the circuit board and is coupled to the cover. The gasket provides a seal between the cover and the bottom covering. The optic assembly is disposed within the inner wall's profile and between the cover and the circuit board. The optic assembly includes one or more apertures and one or more optics disposed around at least some of the apertures. Each optic is aligned with one or more LEDs.
대표청구항
▼
1. A light module, comprising: a cover plate comprising: a first surface;an opposing second surface;an inner wall extending orthogonally out from the second surface; andan outer wall extending orthogonally out from the second surface and surrounding the inner wall, wherein the inner and outer walls
1. A light module, comprising: a cover plate comprising: a first surface;an opposing second surface;an inner wall extending orthogonally out from the second surface; andan outer wall extending orthogonally out from the second surface and surrounding the inner wall, wherein the inner and outer walls define a groove formed therebetween;a circuit board comprising a plurality of light emitting diodes (LEDs) coupled thereon, the circuit board being disposed within the profile of the inner wall, the LEDs being oriented to emit light towards the cover plate;a gasket material disposed within the groove; anda bottom covering disposed adjacent to the circuit board and coupled to the cover plate, wherein the bottom covering comprises a first channel extending therethrough,wherein the gasket material provides a seal between the cover plate and the bottom covering, andwherein the circuit board comprises a second channel extending therethrough and vertically aligned with the first channel when the circuit board is positioned adjacent to the bottom covering, and a compression grommet coupled to at least one of the first channel and the second channel, the compression grommet allowing one or more electrical wires to be inserted therethrough and providing a seal against the respective first and second channels. 2. The light module of claim 1, wherein the cover plate further comprises one or more first openings formed therein and positioned outside the profile of the outer wall, and wherein the bottom covering comprises one or more second openings formed therein, the second openings being vertically aligned with the first openings when the bottom covering is coupled to the cover plate, the first and second openings configured to receive a coupling device to couple the bottom covering to the cover plate. 3. The light module of claim 1, wherein the cover plate and the bottom covering are substantially square and the inner wall and the circuit board are substantially square shaped with one or more chamfered corners. 4. The light module of claim 1, wherein the bottom covering is fabricated using at least one of an aluminum material, a metal alloy material, some other metal material. 5. The light module of claim 1, wherein the plurality of LEDs comprise an array of LED die packages. 6. The light module of claim 1, wherein the cover plate further comprises one or more lenses integrally formed therein, each lens being vertically aligned with at least one LEDS. 7. The light module of claim 1, wherein the circuit board further comprises a guide aperture, and wherein the cover plate further comprises a guide pin to be inserted into the guide aperture. 8. A light module, comprising: a cover plate comprising: a first surface;a second opposing surface,a groove disposed in the second surface and comprising an inner wall; andat least one first opening extending through the cover plate;an optic assembly disposed within the profile of the inner wall and comprising: one or more second openings formed therethrough; andat least one lens coupled to the optic assembly, each lens disposed over at least one of the second openings and extending through at least a portion of the respective first opening,a circuit board comprising a plurality of light emitting diodes (LEDs) coupled thereon, the circuit board disposed within the profile of the inner wall and adjacent to the optic assembly, the LEDs being oriented to emit light into the respective lens;a gasket material disposed within the groove; anda bottom covering being positioned adjacent to the circuit board and coupled to the cover plate through apertures disposed outside of a perimeter of the groove,wherein the gasket material provides an environmental seal between the cover plate and the bottom covering. 9. The light module of claim 8, wherein the optic assembly comprises: an adhesive layer comprising: a gas-permeable layer comprising one or more apertures extending therethrough;a first adhesive material coupled to one surface of the gas-permeable layer; anda second adhesive material coupled to an opposite surface of the gas-permeable layer;a second material layer coupled to the first adhesive material, the second material layer comprising one or more second apertures formed therethrough, the second apertures being vertically aligned with the respective first apertures and surrounding the perimeter of the respective first apertures when the second material is coupled to the adhesive layer, a portion of the adhesive layer being exposed within the perimeter of the second apertures; andat least one lens coupled to the adhesive layer, a portion of each lens being disposed on the adhesive layer through the respective second aperture. 10. The light module of claim 9, wherein the circuit board comprises a driver coupled thereon, and wherein the optic assembly further comprises one or more caps being coupled to the adhesive layer through one or more second apertures, the caps being disposed over the driver when the optic assembly is positioned adjacent to the circuit board. 11. The light module of claim 8, wherein the plurality of LEDs comprise an array of LED die packages. 12. The light module of claim 8, wherein each of the circuit board and the optic assembly further comprises a guide aperture, and wherein the cover plate further comprises a guide pin to be inserted into the guide apertures. 13. The light module of claim 8, wherein the optic assembly comprises an adhesive layer and a second material layer. 14. The light module of claim 13, wherein the adhesive layer comprises: a gas-permeable layer;a first adhesive material coupled to one surface of the gas-permeable layer; anda second adhesive material coupled to an opposite surface of the gas-permeable layer. 15. The light module of claim 13, wherein the circuit board comprises a driver coupled thereon, and wherein the optic assembly further comprises one or more caps being coupled to the adhesive layer through one or more second apertures, the caps being disposed over the driver when the optic assembly is positioned adjacent to the circuit board. 16. A method for assembling a light module, comprising: providing a cover plate comprising: a first surface;an opposing second surface;an inner wall extending orthogonally out from the second surface;an outer wall extending orthogonally out from the second surface and surrounding the inner wall, the inner and outer walls defining a groove formed therebetween; andone or more first openings extending from the first surface to the second surface;placing an optic assembly within the profile of the inner wall, the optic assembly comprising: a top surface;a bottom surface;one or more second openings extending from the top surface to the bottom surface; andat least one lens coupled to the top surface and disposed over one or more of the second openings, at least a portion of each lens being inserted through at least a portion of the respective first opening;placing a circuit board comprising a plurality of light emitting diodes (LEDs) coupled thereon adjacent to the optic assembly and within the profile of the inner wall, the LEDs being oriented to emit light into the respective lens;placing a gasket material within the groove;positioning a bottom covering adjacent the circuit board; andcoupling the bottom covering to the cover plate,wherein the gasket material provides an environmental seal between the cover plate and the bottom covering. 17. The method of claim 16, wherein the circuit board further comprises a driver coupled thereon, and wherein the optic assembly further comprises one or more caps being coupled to the top surface and disposed over one or more of the second openings, the caps being disposed over the driver when the optic assembly is positioned adjacent to the circuit board. 18. The method of claim 16, wherein the plurality of LEDs comprise an array of LED die packages. 19. The method of claim 16, wherein each of the circuit board and the optic assembly further comprises a guide aperture formed therethrough, and wherein the cover plate further comprises a guide pin that is inserted into the guide apertures. 20. A light module, comprising: a cover plate comprising: an outer surface;an inner surface;a groove disposed in the inner surface and comprising an inner wall;a plurality of light emitting diode (LED) apertures; anda first plurality of coupling apertures;a bottom covering disposed adjacent to a circuit board and comprising a second plurality of coupling apertures, wherein the bottom covering comprises a first channel extending therethrough;the circuit board comprising a surface defined by an outer perimeter and a plurality of LEDs coupled to the surface, the circuit board being disposed between the cover plate and the bottom covering and within the profile of the cover plate, the circuit board comprising a second channel extending therethrough and vertically aligned with the first channel when the circuit board is positioned adjacent to the bottom covering;a compression grommet coupled to at least one of the first channel and the second channel, the compression grommet allowing one or more electrical wires to be inserted therethrough and providing a seal against the respective first and second channels;a gasket material disposed in the groove, wherein the gasket material provides an environmental seal between the cover plate and the bottom covering; anda plurality of fastening devices, each fastening device extending at least partially through one of the first plurality of coupling apertures and one of the second plurality of coupling apertures to couple the bottom covering to the cover plate.
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