초록 ▼

In various embodiments of the present invention, a thermoelectric cooling device with a thermoelectric device, heat pipe and a heat sink is provided. The thermoelectric device is connected to a chamber through a metal standoff. The chamber contains a fluid that needs to be cooled. The metal standoff

In various embodiments of the present invention, a thermoelectric cooling device with a thermoelectric device, heat pipe and a heat sink is provided. The thermoelectric device is connected to a chamber through a metal standoff. The chamber contains a fluid that needs to be cooled. The metal standoff has a shape, e.g. a bevel shape, to minimize heat leakage into the fluid. The heat pipes are preferably connected to the thermoelectric device with a Thermal Interface Material (TIM). In one embodiment, the heat pipes are attached to the thermoelectric device through screws which have an insulating standoff so as to minimize heat leakage into the fluid. In another embodiment of the present invention, two stage thermoelectric cooling devices with multiple heat pipes and common heat sink are provided to cool the fluid.

대표청구항 ▼

1. A thermoelectric cooling device for cooling a fluid present in a chamber, the thermoelectric cooling device comprising: a thermoelectric device, the thermoelectric device cooling the fluid;a metal standoff connected to a cold side of the thermoelectric device, wherein the metal standoff has a geo

1. A thermoelectric cooling device for cooling a fluid present in a chamber, the thermoelectric cooling device comprising: a thermoelectric device, the thermoelectric device cooling the fluid;a metal standoff connected to a cold side of the thermoelectric device, wherein the metal standoff has a geometry configured to reduce parasitic heat leakage;one or more heat pipes present at a hot side of the thermoelectric device, wherein the one or more heat pipes transfer heat from the hot side of the thermoelectric device;a heat sink connected to the one or more heat pipes, the heat sink being configured to transfer heat extracted by the thermoelectric device to ambient through the one or more heat pipes; andone or more plates configured to hold the one or more heat pipes to the hot side of the thermoelectric device. 2. The thermoelectric cooling device according to claim 1 further comprising one or more screws to hold the one or more heat pipes to the hot side of the thermoelectric device and the chamber. 3. The thermoelectric cooling device according to claim 2, wherein the one or more screws comprise one or more insulating standoffs or grommets. 4. The thermoelectric cooling device according to claim 1 further comprising a cold sink connected to the metal standoff, the cold sink being configured to facilitate transfer heat from the fluid to the thermoelectric device. 5. The thermoelectric cooling device according to claim 1, wherein the metal standoff geometry is bevel shaped. 6. The thermoelectric cooling device according to claim 1, wherein the metal standoff geometry has a higher cross-sectional area at its ends than at its center. 7. The thermoelectric cooling device according to claim 1, wherein the metal standoff comprises a phase change material. 8. The thermoelectric cooling device according to claim 1, wherein the metal standoff is a magnetic standoff and at least one of the one or more plates is a magnetic plate. 9. The thermoelectric cooling device according to claim 8, wherein the magnetic standoff is made of a magnetic material and the magnetic plate is a magnet. 10. The thermoelectric cooling device according to claim 8, wherein the magnetic standoff is a magnet and the magnetic plate is made of a magnetic material. 11. The thermoelectric cooling device according to claim 1, wherein at least one of the one or more heat pipes comprises a working fluid, an adiabatic section and a condenser section, and wherein the one or more heat pipes comprises an evaporation section common to at least two of the one or more heat pipes. 12. The thermoelectric cooling device according to claim 11 wherein the one or more heat pipes act as thermal diodes. 13. The thermoelectric cooling device according to claim 1, wherein spaces in the thermoelectric cooling device are filled with at least one of polyurethane foam, styrofoam and aerogel. 14. A thermoelectric cooling device for cooling a fluid, the fluid being present in a chamber, wherein the thermoelectric cooling device comprises: a two stage thermoelectric device to cool the fluid, the two stage thermoelectric device comprising a first thermoelectric device and a second thermoelectric device, the first thermoelectric device and the second thermoelectric device being thermally connected;a metal standoff connected to a cold side of the first thermoelectric device; anda first set of heat pipes, wherein the first set of heat pipes is configured to remove heat from the two stage thermoelectric device, and wherein the first set of heat pipes is present between the first thermoelectric device and the second thermoelectric device. 15. The thermoelectric cooling device according to claim 14 further comprising a common heat sink attached to the first set of heat pipes, wherein the common heat sink is configured to transfer heat from the first set of heat pipes to ambient. 16. The thermoelectric cooling device according to claim 14 further comprising a secondary heat sink attached to a hot side of the second thermoelectric device, wherein the secondary heat sink is configured to transfer heat from the second thermoelectric device to ambient. 17. The thermoelectric cooling device according to claim 14 further comprising a second set of heat pipes connected to a hot side of the second thermoelectric device, wherein the second set of heat pipes is configured to remove heat from the hot side of the second thermoelectric device and to act as thermal diodes. 18. The thermoelectric cooling device according to claim 17 further comprising a common heat sink attached to the second set of heat pipes, wherein the common heat sink is configured to transfer heat from the second set of heat pipes to ambient. 19. The thermoelectric cooling device according to claim 14 further comprising a switching circuit to operate the first thermoelectric device and the second thermoelectric device. 20. The thermoelectric cooling device according to claim 14 further comprising a heat sink fan configured to dissipate heat ejected by a common heat sink and a secondary heat sink to ambient. 21. The thermoelectric cooling device according to claim 14, wherein cooling power of the first thermoelectric device is more than cooling power of the second thermoelectric device. 22. The thermoelectric cooling device according to claim 14, wherein the first thermoelectric device and the second thermoelectric device are thermally connected in series. 23. The thermoelectric cooling device according to claim 14, wherein the first thermoelectric device and the second thermoelectric device are thermally connected in parallel. 24. The thermoelectric cooling device according to claim 14, wherein the first thermoelectric device comprises a plurality of the second thermoelectric devices. 25. The thermoelectric cooling device according to claim 1, wherein the chamber is a refrigerator. 26. The thermoelectric cooling device according to claim 25, wherein spaces in the thermoelectric cooling device are filled with at least one of polyurethane foam, styrofoam and aerogel. 27. The thermoelectric cooling device according to claim 14, wherein the chamber is a refrigerator. 28. A thermoelectric cooling device for cooling a fluid present in a chamber, the thermoelectric cooling device comprising: a thermoelectric device, the thermoelectric device cooling the fluid;a metal standoff connected to a cold side of the thermoelectric device, wherein the metal standoff is a magnetic standoff and at least one of the one or more plates is a magnetic plate;one or more heatpipes present at a hot side of the thermoelectric device, wherein the one or more heat pipes transfer heat from the hot side of the thermoelectric device;a heat sink connected to the one or more heat pipes, the heat sink being configured to transfer heat extracted by the thermoelectric device to ambient through the one or more heat pipes; andone or more plates configured to hold the one or more heat pipes to the hot side of the thermoelectric device. 29. The thermoelectric cooling device according to claim 28 further comprising a cold sink connected to the metal standoff, the cold sink being configured to facilitate transfer heat from the fluid to the thermoelectric device. 30. The thermoelectric cooling device according to claim 28, wherein the magnetic standoff is made of one of a magnetic material and a magnet, and the magnetic plate is made of the other of the magnetic material and the magnet. 31. The thermoelectric cooling device according to claim 28, wherein at least one of the one or more heat pipes comprises a working fluid, an adiabatic section and a condenser section, and wherein the one or more heat pipes comprises an evaporation section common to at least two of the one or more heat pipes. 32. The thermoelectric cooling device according to claim 30 wherein the one or more heat pipes act as thermal diodes. 33. A thermoelectric cooling device for cooling a fluid, the fluid being present in a chamber, wherein the thermoelectric cooling device comprises: a two stage thermoelectric device to cool the fluid, the two stage thermoelectric device comprising a first thermoelectric device and a second thermoelectric device, the first thermoelectric device and the second thermoelectric device being thermally connected;a metal standoff connected to a cold side of the first thermoelectric device;a first set of heat pipes, wherein the first set of heat pipes is configured to remove heat from the two stage thermoelectric device; anda second set of heat pipes connected to a hot side of the second thermoelectric device, wherein the second set of heat pipes is configured to remove heat from the hot side of the second thermoelectric device and to act as thermal diodes. 34. The thermoelectric cooling device according to claim 33, wherein the first set of heat pipes is present between the first thermoelectric device and the second thermoelectric device. 35. The thermoelectric cooling device according to claim 33 further comprising a common heat sink attached to the first set of heat pipes, wherein the common heat sink is configured to transfer heat from the first set of heat pipes to ambient. 36. The thermoelectric cooling device according to claim 33 further comprising a secondary heat sink attached to a hot side of the second thermoelectric device, wherein the secondary heat sink is configured to transfer heat from the second thermoelectric device to ambient. 37. The thermoelectric cooling device according to claim 33 further comprising a second set of heat pipes connected to a hot side of the second thermoelectric device, wherein the second set of heat pipes is configured to remove heat from the hot side of the second thermoelectric device and to act as thermal diodes. 38. The thermoelectric cooling device according to claim 33 further comprising a common heat sink attached to the second set of heat pipes, wherein the common heat sink is configured to transfer heat from the second set of heat pipes to ambient. 39. The thermoelectric cooling device according to claim 33 further comprising a switching circuit to operate the first thermoelectric device and the second thermoelectric device. 40. The thermoelectric cooling device according to claim 33 further comprising a heat sink fan configured to dissipate heat ejected by a common heat sink and a secondary heat sink to ambient. 41. The thermoelectric cooling device according to claim 33, wherein cooling power of the first thermoelectric device is more than cooling power of the second thermoelectric device. 42. The thermoelectric cooling device according to claim 33, wherein the first thermoelectric device and the second thermoelectric device are thermally connected in series. 43. The thermoelectric cooling device according to claim 33, wherein the first thermoelectric device and the second thermoelectric device are thermally connected in parallel. 44. The thermoelectric cooling device according to claim 33, wherein the first thermoelectric device comprises a plurality of the second thermoelectric devices.