[특허]Flexible circuit formation

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IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	C23C-018/30 C23C-018/20 C23C-018/16 H05K-003/18 H05K-001/02 H05K-001/03
출원번호	US-0779867 (2010-05-13)
등록번호	US-8911608 (2014-12-16)
발명자 / 주소	Sharma, Sunity Dhau, Jaspreet Singh
출원인 / 주소	SRI International
대리인 / 주소	McDonnell Boehnen Hulbert & Berghoff LLP
인용정보	피인용 횟수 : 0 인용 특허 : 45

초록 ▼

The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates

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1. A method for producing one or more conductive lines on a substrate, the method comprising: depositing a palladium precursor solution onto the substrate, wherein the palladium precursor solution includes at least palladium propionate, amyl acetate and cyclopentylamine;exposing the palladium precursor solution to conditions that promote evaporation of the amyl acetate to leave a palladium precursor on the substrate;decomposing the palladium precursor to leave a pattern of active palladium having a valence that is approximately zero, wherein the active palladium is substantially monatomically disposed on the substrate in the form of single isolated atoms; anddepositing a metal atop the pattern of active palladium on the substrate to form one or more conductive lines. 2. The method of claim 1, wherein the substrate is flexible. 3. The method of claim 1, wherein the substrate is non-flat. 4. The method of claim 1, wherein the substrate is included in the housing of a portable electronics device. 5. The method of claim 1, wherein the metal is deposited using an electroless plating process that forms the one or more conductive lines. 6. The method of claim 5, further comprising: electroplating additional metal onto the one or more conductive lines formed during the electroless plating process. 7. The method of claim 1, wherein the metal includes copper. 8. The method of claim 1, wherein depositing the palladium precursor solution onto the substrate includes patterning the palladium precursor solution to substantially resemble the active palladium pattern. 9. The method of claim 1, wherein the palladium precursor solution is deposited onto the substrate using a printing process that permits spatial control in response to a signal. 10. The method of claim 1, wherein the active palladium is patterned when the palladium precursor is altered to produce the active palladium. 11. The method of claim 1, wherein the step of depositing a metal includes generating a chemical reaction between the metal and a substantial amount of said pattern of active palladium. 12. The method of claim 11, wherein said chemical reaction includes a precipitation reaction. 13. The method of claim 11, wherein said chemical reaction includes an oxidation-reduction reaction. 14. A method of forming an electrically conductive circuit on a substrate, the method comprising: depositing a palladium precursor solution on the substrate, wherein the palladium precursor solution includes at least palladium propionate, amyl acetate and cyclopentylamine;exposing the palladium precursor solution to one or more conditions that promote evaporation of the amyl acetate to leave a palladium precursor on the substrate;decomposing the palladium precursor to leave a pattern of active palladium that is substantially monatomically disposed on the substrate, wherein the active palladium has approximately a zero valence; anddepositing a metal onto the active palladium on the substrate to form the electrically conductive circuit. 15. The method of claim 14, wherein the substrate is flexible. 16. The method of claim 14, wherein said step of depositing the palladium precursor onto the substrate includes patterning the palladium precursor solution. 17. The method of claim 14, wherein the palladium precursor solution is deposited onto the substrate using a printing process that permits spatial control in response to a signal.

이 특허에 인용된 특허 (45)

Brummett Charles Roscoe (Harrisburg PA) Shaak Ray Ned (Lebanon PA) Andrews Daniel Marshall (Harrisburg PA), Catalyst for electroless deposition of metals.
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Tsou, Yu-Min; Manor, Edmond L., Catalytic powder and electrode made therewith.
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Anschel Morris (Carmel NY) Shear Stephen Anthony (Greenfield Park NY), Catalytic surface preparation for electroless plating.
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Schadt Mark J. (Vestal NY) Viehbeck Alfred (Stormville NY), Conditioning of a polymeric substrate.
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Sharma, Sunity K.; Fornasiero, Francesco; Dhau, Jaspreet Singh, Conductive pattern formation.
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Sharma Sunity ; Annavajjula Durga ; Bhasin Kuldip,INX ; Narang Subhash ; Nigam Asutosh, Deposition of substances on a surface.
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Sharma Sunity Kumar ; Bhasin Kuldip Kumar ; Narang Subhash C., Direct deposition of a gold layer.
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Sharma Sunity Kumar ; Bhasin Kuldip Kumar ; Narang Subhash C. ; Nigam Asutosh, Direct deposition of palladium.
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Subramanian Somasundaram (Melvindale MI) Watkins William L. H. (Toledo OH) Chattha Mohinder S. (Northville MI), Dispersion enhanced PT group metal catalysts and method of making the catalysts.
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Gandikota, Srinivas; McGuirk, Chris R.; Padhi, Deenesh; Malik, Muhammad Atif; Ramanathan, Sivakami; Dixit, Girish A.; Cheung, Robin, Electroless deposition method over sub-micron apertures.
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McConnell Christopher F. ; Verhaverbeke Steven, Electroless metal deposition of electronic components in an enclosable vessel.
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Harkness Brian, Electroless metal deposition on silyl hydride functional resin.
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Cane Frank N. (3058 Plumstead Way San Jose CA 95148), Electroless plating process for the manufacture of printed circuit boards.
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Kenzo Hanawa JP; Kazuaki Takahashi JP, Fine copper powder and process for producing the same.
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Sharma, Sunity; Dhau, Jaspreet Singh, Flexible circuit chemistry.
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Sharma, Sunity; Dhau, Jaspreet Singh, Flexible circuits.
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Sharma, Sunity; Dhau, Jaspreet Singh, Flexible circuits.
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Canestaro Michael J. (Endicott NY) Summa William J. (Endwell NY), Flexible electrical connection and method of making same.
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Huber Mortimer J. (St. Paul MN), Flexible masking tape.
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Baumgartner Charles E. (Schenectady NY) Scott Lisa R. (Chicago IL), Halogenated polyimide composition having improved adhesion characteristic and articles obtained therefrom.
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Leech Edward J. (Oyster Bay NY) Russo Frank D. (West Sayville NY), High resolution screen printable resists.
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Haubrich, Scott; Kunze, Klaus; Dunphy, James C; Gudeman, Chris; Rockenberger, Joerg; Zurcher, Fabio; Sleiman, Nassrin; Takashima, Mao; Spindt, Chris, Interface layer for the fabrication of electronic devices.
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Narang,Subhash; Ventura,Susanna; Sharma,Sunity, Metal/active oxygen batteries.
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Palmans, Roger; Lantasov, Yuri, Method for copper plating deposition.
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Lee, David M.; Francomacaro, Arthur S.; Lehtonen, Seppo J.; Charles, Jr., Harry K., Method for electroless gold plating of conductive traces on printed circuit boards.
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Polichette Joseph (South Farmingdale NY) Leech Edward J. (Oyster Bay NY), Method for the production of radiant energy imaged printed circuit boards.
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Sharma Suniti K. (Redwood City CA) Ventura Susanna C. (Mountain View CA) Narang Subhash C. (Redwood City CA), Method of forming patterned oxide superconducting films.
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Wright Robin E. (Dakota MN) Chou Hsin H. (Woodbury MN), Method of making a colloidal palladium and/or platinum metal dispersion.
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Sharma, Sunity; Narang, Subhash; Bhasin, Kuldip; Sharma, Madan Lal, Method of producing and depositing a metal film.
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Lap Chan ; Fong Yau Li SG; Hou Tee Ng SG, Method to deposit a seeding layer for electroless copper plating.
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Coleman,James P.; McGrath,Martin P.; Liu,Fuchen; Arhancet,Juan, Oxidation catalyst and process.
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Lovie John R. (New Providence NJ) Somers Gerardus A. (Schayk NLX) Hendriks Jan J. M. (Sint Oedenrode NLX), Palladium and palladium alloy plating.
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Brady Michael J. (Brewster NY) Buchwalter Stephen L. (Wappingers Falls NY) Gambino Richard J. (Yorktown Heights NY) Goldberg Martin J. (Mahopac NY) Lee Kam L. (Putnam Valley NY) Viehbeck Alfred (Stor, Patterned deposition of metals via photochemical decomposition of metal-oxalate complexes.
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Zeblisky Rudolph J. (Hauppauge NY), Precious metal sensitizing solutions.
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Yuan Benzhen,JPX ; Asai Motoo,JPX, Pretreating solution for electroless plating, electroless plating bath and electroless plating process.
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Narang, Subhash, Printing of electronic circuits and components.
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Walsh Daniel P. (Peabody MA), Process for forming polyimide-metal laminates.
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Lynch Thomas J. ; Agnihotri Ram K. ; Engle Paul F. ; Banks Roger T. ; Barnes Ronald B. ; Hennenhoefer Earl ; Lerch Russell T. ; O'Shea Thomas ; Yavor John, Process for low density additive flexible circuits and harnesses.
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Boyko, Christina M.; Day, Robert J.; Stauffer, Kristen A., Process for manufacturing a printed wiring board.
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Bach Wolf (Southbury CT) Ferrier Donald R. (Thomaston CT) Kukanskis Peter E. (Woodbury CT) Williams Ann S. (Southbury CT) Senechal Mary J. (Canton CT), Process for metallizing non-conductive substrates.
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Sirinyan Kirkor (Bergisch Gladbach) Dederichs Reinhold (Leverkusen) Merten Rudolf (Leverkusen) von Gizycki Ulrich (Leverkusen) Wolf Gerhard-Dieter (Dormagen DEX) Williams John L. (McMurray PA), Process for metallizing substrate surfaces.
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Narang Subhash C. ; Ventura Susanna C. ; Sharma Sunity ; Stotts John S., Rapid prototyping using multiple materials.
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Dhau, Jaspreet Singh; Sharma, Sunity K., Reduced porosity copper deposition.
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Matuzaki Isao (Nagano JPX) Tonoki Kenzi (Yuki JPX) Ishibashi Takehiko (Oyama JPX) Yokono Haruki (Yuki JPX), Sensitizing agent for electroless plating and method for sensitizing substrate with the agent.
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Sofranko, John A.; Gaffney, Anne M., Synthesis of oxalate esters by the oxidative carbonylation of alcohols with a heterogeneous manganese promoted Pd-V-P catalyst.
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