Electronic device cooling with microjet impingement and method of assembly
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01L-023/34
F28F-013/18
H01L-023/473
출원번호
US-0709469
(2012-12-10)
등록번호
US-8912643
(2014-12-16)
발명자
/ 주소
de Bock, Hendrik Pieter Jacobus
Weaver, Jr., Stanton Earl
Bahadur, Raj
Browne, Eric Ayres
Mandrusiak, Gary Dwayne
출원인 / 주소
General Electric Company
대리인 / 주소
Darling, John P.
인용정보
피인용 횟수 :
4인용 특허 :
16
초록▼
An integrated circuit device including a die with a substrate with a first surface and a second surface opposite the first surface is provided. The die includes at least one circuit element positioned on the first surface. Formed on the second surface, is a wetting feature that includes an array of
An integrated circuit device including a die with a substrate with a first surface and a second surface opposite the first surface is provided. The die includes at least one circuit element positioned on the first surface. Formed on the second surface, is a wetting feature that includes an array of spaced-apart nanoscale structures and/or an array of spaced-apart microscale structures. The wetting feature also includes a wettability coating applied to at least a portion of the second surface. The integrated circuit device includes a spacer coupled to the die adjacent to the second surface. In addition, an injector plate is coupled to the spacer. The injector plate includes at least one microjet and at least one exit hole defined through the injector plate. The at least one exit hole is positioned adjacent to the at least one microjet.
대표청구항▼
1. An integrated circuit device, comprising: a die having a substrate including a first surface and a second surface opposite said first surface, said die including at least one circuit element positioned on said first surface, said second surface including a wetting feature comprising: at least one
1. An integrated circuit device, comprising: a die having a substrate including a first surface and a second surface opposite said first surface, said die including at least one circuit element positioned on said first surface, said second surface including a wetting feature comprising: at least one of an array of spaced-apart nanoscale structures and an array of spaced-apart microscale structures formed on at least a portion of said second surface; anda wettability coating covering at least a portion of said second surface;a spacer coupled to said die adjacent said second surface; andan injector plate coupled to said spacer, said injector plate comprising: at least one microjet defined therethrough; andat least one exit hole defined therethrough, wherein said at least one exit hole is adjacent said at least one microjet. 2. The integrated circuit device in accordance with claim 1, wherein said at least one microjet is positioned opposite said at least one circuit element positioned on said first surface. 3. The integrated circuit device in accordance with claim 1, wherein said injector plate further comprises an array of said at least one microjet and an array of said at least one exit hole. 4. The integrated circuit device in accordance with claim 1, wherein said wettability coating comprises at least one of a metallic compound and a ceramic compound. 5. The integrated circuit device in accordance with claim 1, wherein said spaced-apart nanoscale structures further comprises an array of nanospring patterned channels. 6. The integrated circuit device in accordance with claim 1, further comprising a flow channel plate coupled to said injector plate, said flow channel plate including at least one inlet channel coupled in flow communication with said at least one microjet and at least one outlet channel coupled in flow communication with said at least one exit hole. 7. The integrated circuit device in accordance with claim 6, further comprising a manifold baseplate coupled to said flow channel plate, said manifold baseplate including an inlet reservoir coupled in flow communication with said at least one inlet channel and an outlet reservoir coupled in flow communication with said at least one outlet channel. 8. The integrated circuit device in accordance with claim 7, wherein said die, said spacer, said injector plate, said flow channel plate, and said manifold baseplate are coupled in a hermetically sealed fluid circulation path. 9. A cooling system for an integrated circuit device, said cooling system comprising: a substrate having a surface with a wetting feature comprising: at least one of an array of spaced-apart nanoscale structures and an array of spaced-apart microscale structures formed on at least a portion of said surface; anda wettability coating covering at least a portion of said surface;a spacer coupled to said substrate adjacent said surface;an injector plate coupled to said spacer, said injector plate comprising: at least one microjet defined therethrough; andat least one exit hole defined therethrough, wherein said at least one exit hole is adjacent said microjet;a flow channel plate coupled to said injector plate, said flow channel plate including at least one inlet channel coupled in flow communication with said at least one microjet; anda manifold baseplate coupled to said flow channel plate, said manifold baseplate including an inlet reservoir coupled in flow communication with said at least one inlet channel. 10. The cooling system in accordance with claim 9, wherein said substrate, said spacer, said injector plate, said flow channel plate, and said manifold baseplate are coupled in a hermetically sealed fluid circulation path. 11. The cooling system in accordance with claim 9, wherein said injector plate further comprises an array of said at least one microjet. 12. The cooling system in accordance with claim 11, wherein each microjet of said array has a diameter between about 40 micrometers and about 180 micrometers. 13. The cooling system in accordance with claim 9, wherein said wettability coating comprises at least one of a metallic compound and a ceramic compound. 14. The cooling system in accordance with claim 13, wherein said spaced-apart nanoscale structures further comprises an array of nanospring patterned channels. 15. The cooling system in accordance with claim 9, further comprising at least one outlet channel defined within said flow channel plate and coupled in flow communication with said at least one exit hole. 16. The cooling system in accordance with claim 15, further comprising an outlet reservoir defined within said manifold baseplate and coupled in flow communication with said at least one outlet channel. 17. A method comprising: forming a wetting feature on a surface of a substrate of a die, including: forming at least one of an array of spaced-apart nanoscale structures and an array of spaced-apart microscale structures on at least a portion of the surface; andapplying a wettability coating to at least a portion of the surface;coupling a spacer to the die adjacent the surface; andcoupling an injector plate to the spacer, wherein the injector plate includes at least one microjet defined through the injector plate and at least one exit hole defined through the injector plate, wherein the at least one exit hole is positioned adjacent the at least one microjet. 18. The method in accordance with claim 17, wherein applying a wettability coating comprises applying at least one of a metallic compound and a ceramic compound to the at least a portion of the surface. 19. The method in accordance with claim 17, wherein forming at least one of an array of spaced-apart nanoscale structures comprises forming an array of nanospring patterned channels. 20. The method in accordance with claim 17, wherein the injector plate includes an array of the at least one microjet, wherein each microjet of the array has a diameter between about 40 micrometers and about 180 micrometers.
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