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An interdigitated cellular cushioning system includes an array of void cells protruding from each of two binding layers interdigitated between the two binding layers. Peaks of each of the void cells are attached to the opposite binding layer forming the interdigitated cellular cushioning system. The

An interdigitated cellular cushioning system includes an array of void cells protruding from each of two binding layers interdigitated between the two binding layers. Peaks of each of the void cells are attached to the opposite binding layer forming the interdigitated cellular cushioning system. The interdigitated cellular cushioning system may be used to absorb and distribute a source of kinetic energy incident on the interdigitated cellular cushioning system (e.g., an impact or explosion) so that the amount of force transmitted through the interdigitated cellular cushioning system is low enough that it does not cause injury to personnel or damage to personnel and/or equipment adjacent the interdigitated cellular cushioning system.

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1. An interdigitated cellular cushioning system comprising: a first sheet of resilient material including a first binding layer and a first array of void cells protruding from the first binding layer, wherein each of the void cells has a wall; anda second sheet of resilient material including a seco

1. An interdigitated cellular cushioning system comprising: a first sheet of resilient material including a first binding layer and a first array of void cells protruding from the first binding layer, wherein each of the void cells has a wall; anda second sheet of resilient material including a second binding layer and a second array of void cells protruding from the second binding layer, wherein each of the void cells has a wall, with the walls of the second array of void cells unique from the walls of the first array of void cells, the void cells are configured to monotonically collapse under a load, wherein a peak of each void cell in the first array contacts the second binding layer and a peak of each void cell in the second array contacts the first binding layer, and wherein at least one void cell in the first array is attached to the second binding layer and at least one void cell in the second array is attached to the first binding layer. 2. The interdigitated cellular cushioning system of claim 1, further comprising: a third sheet of resilient material including a third binding layer and a third array of void cells protruding from the third binding layer; anda fourth sheet of resilient material including a fourth binding layer and a fourth array of void cells protruding from the fourth binding layer, wherein a peak of each void cell in the third array contacts the fourth binding layer and a peak of each void cell in the fourth array contacts the third binding layer, and wherein at least one void cell in the third array is attached to the fourth binding layer, at least one void cell in the fourth array is attached to the third binding layer, and the second binding layer is attached to the third binding layer. 3. The interdigitated cellular cushioning system of claim 2, wherein the void cells in the first array are aligned with the void cells in the fourth array and the void cells in the second array are aligned with the void cells in the third array. 4. The interdigitated cellular cushioning system of claim 3, wherein the peak of the at least one void cell in the first array, the second binding layer, the third binding layer, and the peak of the at least one void cell in the fourth array are attached together. 5. The interdigitated cellular cushioning system of claim 1, wherein the void cells are hemiellipsoidal. 6. The interdigitated cellular cushioning system of claim 1, wherein each void cell in the first array is attached to the second binding layer and each void cell in the second array is attached to the first binding layer. 7. The interdigitated cellular cushioning system of claim 1, wherein at least one void cell in the first array is welded to the second binding layer and at least one void cell in the second array is welded to the first binding layer. 8. The interdigitated cellular cushioning system of claim 1, wherein the void cells in the first array of void cells are spaced equally from the void cells in the second array of void cells. 9. The interdigitated cellular cushioning system of claim 1, wherein resilient material at a base of at least one void cell is thinner than material at a peak of the void cell. 10. The interdigitated cellular cushioning system of claim 1, wherein each of the void cells are configured to collapse without contacting adjacent void cells. 11. The interdigitated cellular cushioning system of claim 1, wherein at least one of the first binding layer and the second binding layer is configured to conform to a curved surface. 12. The interdigitated cellular cushioning system of claim 1, wherein the first array of void cells are configured to collapse at a different rate than the second array of void cells. 13. The interdigitated cellular cushioning system of claim 1, wherein the void cells are configured to collapse uniformly. 14. A method of absorbing kinetic energy comprising: monotonically collapsing a first sheet of resilient material including a first binding layer and a first array of void cells protruding from the first binding layer, wherein each of the void cells has a wall;monotonically collapsing a second array of void cells protruding from a second binding layer of a second sheet of resilient material, wherein each of the void cells has a wall, with the walls of the second array of void cells unique from the walls of the first array of void cells, without collapsing the second binding layer, wherein a peak of each void cell in the first array contacts the second binding layer and a peak of each void cell in the second array contacts the first binding layer, and wherein at least one void cell in the first array is attached to the second binding layer and at least one void cell in the second array is attached to the first binding layer. 15. The method of claim 14, further comprising: monotonically collapsing a third sheet of resilient material including a third binding layer and a third array of void cells protruding from the third binding layer; andmonotonically collapsing a fourth sheet of resilient material including a fourth binding layer and a fourth array of void cells protruding from the fourth binding layer, wherein a peak of each void cell in the third array contacts the fourth binding layer and a peak of each void cell in the fourth array contacts the third binding layer, and wherein at least one void cell in the third array is attached to the fourth binding layer, at least one void cell in the fourth array is attached to the third binding layer, and the second binding layer is attached to the third binding layer. 16. A method of manufacturing an interdigitated cellular cushioning system comprising: molding a first sheet of resilient material into a first binding layer with a first array of void cells protruding from the first binding layer;molding a second sheet of resilient material into a second binding layer with a second array of void cells protruding from the second binding layer;molding a third sheet of resilient material into a third binding layer with a third array of void cells protruding from the third binding layer;molding a fourth sheet of resilient material into a fourth binding layer with a fourth array of void cells protruding from the fourth binding layer; andwelding a peak of a void cell in the first array to the second binding layer, the third binding layer, and a peak of a void cell in the fourth array. 17. The method of claim 16, further comprising: welding a peak of a void cell in the first array to the second binding layer and a peak of a void cell in the second array to the first binding layer; andwelding a peak of a void cell in the third array to the fourth binding layer and a peak of a void cell in the fourth array to the third binding layer. 18. The method of claim 16, further comprising: arranging peaks of each void cell in the first array in contact with the second binding layer and peaks of each void cell in the second array in contact with the first binding layer; andarranging peaks of each void cell in the third array in contact with the fourth binding layer and peaks of each void cell in the fourth array in contact with the third binding layer. 19. The method of claim 16, further comprising: aligning the void cells in the first array with the void cells in the fourth array and the void cells in the second array with the void cells in the third array. 20. An interdigitated cellular cushioning system comprising: a first sheet of resilient material including a first binding layer and a first array of hemiellipsoidal void cells each having a wall protruding from the first binding layer; anda second sheet of resilient material including a second binding layer and a second array of hemiellipsoidal void cells each having a wall protruding from the second binding layer, the walls of the second array of hemiellipsoidal void cells being unique from the walls fo the first array of hemiellipsoidal void cells, wherein the void cells have thinner resilient material at a base of each of the void cells than at a peak of each of the void cells, wherein the void cells are configured to monotonically collapse under a load, wherein a peak of each void cell in the first array contacts the second binding layer and a peak of each void cell in the second array contacts the first binding layer, wherein at least one void cell in the first array is attached to the second binding layer and at least one void cell in the second array is attached to the first binding layer, and wherein the void cells in the first array of void cells are spaced equally from the void cells in the second array of void cells. 21. The interdigitated cellular cushioning system of claim 20, further comprising: a third sheet of resilient material including a third binding layer and a third array of hemiellipsoidal void cells protruding from the third binding layer; anda fourth sheet of resilient material including a fourth binding layer and a fourth array of hemiellipsoidal void cells protruding from the fourth binding layer, wherein a peak of each void cell in the third array contacts the fourth binding layer and a peak of each void cell in the fourth array contacts the third binding layer, wherein at least one void cell in the third array is attached to the fourth binding layer, at least one void cell in the fourth array is attached to the third binding layer, and the second binding layer is attached to the third binding layer, and wherein the void cells in the first array of void cells are spaced equally from the void cells in the second array of void cells. 22. The interdigitated cellular cushioning system of claim 1, wherein the first array of void cells is contiguous with the first binding layer and the second array of void cells is contiguous with the second binding layer. 23. The method of claim 14, wherein the first array of void cells is contiguous with the first binding layer and the second array of void cells is contiguous with the second binding layer. 24. The interdigitated cellular cushioning system of claim 20, wherein the first array of void cells is contiguous with the first binding layer and the second array of void cells is contiguous with the second binding layer.