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Compact two sided cold plate with threaded inserts

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) F28F-007/00    F28F-009/26    F28F-003/12    F28F-003/14    F28F-009/02    H05K-007/20   
미국특허분류(USC) 165/080.4; 165/144; 165/168; 165/170
출원번호 US-0748576 (2010-03-29)
등록번호 US-8931546 (2015-01-13)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Carlson, Gaskey & Olds, P.C.
인용정보 피인용 횟수 : 1  인용 특허 : 24
초록

A structural cold plate assembly includes a support structure including first and second opposite sides supporting corresponding cold plates and an insert. The insert defines a portion of a fluid passage through the support structure and secures the cold plate to the support structure.

대표
청구항
▼

1. A cold plate assembly comprising: a support structure including first and second opposite sides, wherein the support structure includes a mounting portion disposed between the first and second opposite sides;a first cold plate and a second cold plate, the first cold plate mounted to the first side of the support structure and the second cold plate disposed on the second side of the support structure; anda first insert and a second insert, the first insert extending through the first cold plate and threaded into the mounting portion from the first side...

이 특허에 인용된 특허 (24)

  1. Zywiak, Thomas; Bruno, Louis J.; Drew, Diane; Christians, Douglas L.. Aircraft galley chiller system. USP2009047523622.
  2. Zywiak,Thomas; Bruno,Louis J.; Drew,Diane; Christians,Douglas L.. Aircraft galley chiller system. USP2006047024874.
  3. Brewer,Richard Grant; Upadhya,Girish; Zhou,Peng; McMaster,Mark; Tsao,Paul. Apparatus and method of efficient fluid delivery for cooling a heat producing device. USP2007037188662.
  4. Kenny,Thomas; McMaster,Mark; Lovette,James. Apparatus and method of forming channels in a heat-exchanging device. USP2006037017654.
  5. Zaffetti,Mark; Stephens,Kurt. Apparatus for reducing thermal fatigue in heat exchanger cores. USP2008047353864.
  6. Haltiner, Jr., Karl J.; Kelly, Sean M.. Co-flow anode/cathode supply heat exchanger for a solid-oxide fuel cell assembly. USP2005116967064.
  7. Belady Christian L. ; Cromwell S. Daniel. Cold plate arrangement for cooling processor and companion voltage regulator. USP2001026191945.
  8. Ciaccio Michael P. (Rockford IL). Cold plate for cooling electronics. USP1992025088005.
  9. Hamner Larry D. (Palm City FL). Cooled bolting arrangement. USP1992075129447.
  10. Vogel Xaver (Turgi CHX). Cooling body for the liquid cooling of high-power semiconductor components. USP1986094614227.
  11. Dubelloy Jean-Luc (Bron FRX). Cooling device for power electronic components. USP1996035495889.
  12. Cosley,Michael R.; Fischer,Richard L.. Cooling system for densely packed electronic components. USP2007087258161.
  13. Cesaroni Anthony J. (33 Davisbrooke Dr. Agincourt ; Ontario CAX M1T 2H6). Headers for thermoplastic panel heat exchangers. USP1989104871017.
  14. Fujita,Takashi; Sasaki,Yoshihiro; Takahashi,Torahide. Heat exchanger. USP2006037011149.
  15. Chu Richard C. (Poughkeepsie NY) Ellsworth ; Jr. Michael J. (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY) Vader David T. (New Paltz NY). Intersecting flow network for a cold plate cooling system. USP1993125269372.
  16. Wilson,Michael J.; Wattelet,Jonathan; Lightner,Donald; DeKeuster,Richard; Dubble,Ernest H.; Baldassarre,Gregg J.. Liquid cooled heat sink with cold plate retention mechanism. USP2006127149087.
  17. Kenny,Thomas W.; Munch,Mark; Zhou,Peng; Shook,James Gill; Upadhya,Girish; Goodson,Kenneth; Corbin,Dave; McMaster,Mark; Lovette,James. Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device. USP2006027000684.
  18. David J. Koenen. Method and apparatus for tooless mating of liquid cooled cold plate with tapered interposer heat sink. USP2002026349035.
  19. Sutrina, Thomas. Multiple semiconductor containing package having a heat sink core. USP1985124562512.
  20. Olson Robert Leo. Multiple tile scaleable cooling system for semiconductor components. USP1999075923533.
  21. Army, Jr.,Donald E.; Christians,Douglas L.; Peacos, III,Frederick. Pack and a half condensing cycle pack with combined heat exchangers. USP2007037188488.
  22. Lauro Fernand (Grenoble FRX) Manon Bernard (Grenoble FRX) Marie Gerard (Eybens FRX). Plate-type heat exchangers. USP1983084398596.
  23. Nakanishi, Raita; Kawamura, Toshiaki. Power semiconductor module, and power semiconductor device having the module mounted therein. USP2009077564129.
  24. Lutfy, Gary J.. Semiconductor package with internal heat exchanger. USP1985124559580.

이 특허를 인용한 특허 피인용횟수: 1

  1. Arvelo, Amilcar R.; Campbell, Levi A.; Ellsworth, Jr., Michael J.; McKeever, Eric J.; Snider, Richard P.. Thermal transfer structure(s) and attachment mechanism(s) facilitating cooling of electronics card(s). USP2016119497888.

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