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Configurable vertical integration 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01R-031/00
  • G01R-031/02
  • G01R-027/28
  • G01R-031/28
  • G01R-031/3185
  • G11C-029/18
  • H01L-021/66
  • H01L-025/065
출원번호 US-0800803 (2013-03-13)
등록번호 US-8933715 (2015-01-13)
발명자 / 주소
  • Leedy, Glenn J.
출원인 / 주소
  • Elm Technology Corporation
대리인 / 주소
    Useful Arts IP
인용정보 피인용 횟수 : 1  인용 특허 : 38

초록

The Configurable Vertical Integration CVI invention pertains to methods and apparatus for the enhancement of yields of 3D or stacked integrated circuits and herein referred to as a CVI Integrated Circuit CVI IC. The CVI methods require no testing of circuit layer components prior to their fabricatio

대표청구항

1. A method of information processing using a stacked integrated circuit comprising a self-organizing network formed by a plurality of control circuit portions, a plurality of information bus circuit portions, and a plurality of processing circuit portions, the method comprising: the self-organizing

이 특허에 인용된 특허 (38)

  1. Schoenfeld,Aaron M.; Dermott,Ross E., Circuit and method for controlling a clock synchronizing circuit for low power refresh operation.
  2. Suh, Min Suk; Lee, Seung Hyun, Cube semiconductor package composed of a plurality of stacked together and interconnected semiconductor chip modules.
  3. Chen, Jei-Ming; Chiang, Yi-Fang; Liu, Chih-Chien, Damascene interconnect with bi-layer capping film.
  4. Park ; Kyu C. ; Weitzman ; Elizabeth J., Glass layer fabrication.
  5. Carson John C. (Corona del Mar CA), Hardware for electronic neural network.
  6. Cole ; Jr. Herbert S. (Burnt Hills NY) Rose James W. (Guilderland NY), High density interconnect structure including a spacer structure and a gap.
  7. Solomon, Neal, IP cores in reconfigurable three dimensional integrated circuits.
  8. Flautner, Krisztian; Aitken, Robert Campbell; Hill, Stephen John, Integrated circuit with multiple layers of circuits.
  9. Solomon, Neal, Interconnect architecture in three dimensional network on a chip.
  10. Howell Wayne John ; Kresge John Steven ; Stone David Brian ; Wilcox James Robert, Method and apparatus for directing the input/output connection of integrated circuit chip cube configurations.
  11. Corrie Brian L. (Gaston OR) Blouke Morley M. (Beaverton OR) Heidtmann Denis L. (Portland OR), Method of treating an integrated circuit.
  12. Yinon Degani ; Thomas Dixon Dudderar ; King Lien Tai, Multi-chip ball grid array IC packages.
  13. Baker Robert Grover ; Bertin Claude Louis ; Howell Wayne John ; Mosley Joseph Michael, Multi-view imaging apparatus.
  14. Voldman Steven Howard (50 Loomis St. Burlington VT 05401) Bakeman ; Jr. Paul Evans (3 Bedford Green South Burlington VT 05403), Multichip semiconductor structures with interchip electrostatic discharge protection, and fabrication methods therefore.
  15. Klecka,Mark; Khadiri,Kamal; Patti,Robert; Wilson,Derrick Brent; Hoyman,Lee; Tyda,Bruce, Network with programmable interconnect nodes adapted to large integrated circuits.
  16. Li, Jian; VanderWiel, Steven P.; Zhang, Lixin, On-chip networks for flexible three-dimensional chip integration.
  17. Bruel Michel (Veurey FRX), Process for the production of thin semiconductor material films.
  18. Huppenthal,Jon M.; Guzy,D. James, Reconfigurable processor module comprising hybrid stacked integrated circuit die elements.
  19. Schuetz, Roland, Reconfiguring through silicon vias in stacked multi-die packages.
  20. Solomon, Neal, Reprogrammable three dimensional field programmable gate arrays.
  21. Solomon, Neal, Selective access memory circuit.
  22. Starzyk,Janusz A., Self-organizing data driven learning hardware with local interconnections.
  23. Akram, Salman; Brooks, Jerry M., Semiconductor assembly of stacked substrates and multiple semiconductor dice.
  24. Matsumoto Miki (Ohme JPX) Kawamoto Hiroshi (Kodaira JPX), Semiconductor integrated circuit having self-check and self-repair capabilities.
  25. Hayakawa Toshiro (Nara JPX) Miyauchi Nobuyuki (Tenri JPX) Yano Seiki (Kashihara JPX) Suyama Takahiro (Tenri JPX), Semiconductor laser.
  26. Furuyama Tohru (Tokyo JPX), Semiconductor memory.
  27. Bertin Claude L. (South Burlington VT) Hedberg Erik L. (Essex Junction VT) Howell Wayne J. (South Burlington VT), Semiconductor stack structures and fabrication/sparing methods utilizing programmable spare circuit.
  28. Mizuno Masahiro (Kanagawa JPX) Fujita Takashi (Kanagawa JPX) Baba Hiroshi (Kanagawa JPX) Hama Keizo (Kanagawa JPX), Semiconductor storage system including defective bit replacement.
  29. Degani, Yinon; Dudderar, Thomas Dixon; Sun, Liguo; Zhao, Meng, Stacked module package.
  30. Pagani, Alberto, Testing integrated circuits.
  31. Pagani, Alberto, Testing integrated circuits using few test probes.
  32. Bartley, Gerald K.; Hoover, Russell Dean; Johnson, Charles Luther; VanderWiel, Steven Paul, Thermal enhancement for multi-layer semiconductor stacks.
  33. Solomon, Neal, Three dimensional integrated circuits and methods of fabrication.
  34. Solomon, Neal, Three dimensional memory in a system on a chip.
  35. Cher, Chen-Yong; Kursun, Eren; Maier, Gary W.; Robertazzi, Raphael Peter, Three-dimensional (3D) stacked integrated circuit testing.
  36. Farrar, Paul A., Three-dimensional multichip module.
  37. Bertin Claude L. (South Burlington) Farrar ; Sr. Paul A. (South Burlington) Kalter Howard L. (Colchester) Kelley ; Jr. Gordon A. (Essex Junction) van der Hoeven Willem B. (Jericho) White Francis R. (, Three-dimensional multichip packages and methods of fabrication.
  38. Gillingham, Peter B., Using interrupted through-silicon-vias in integrated circuits adapted for stacking.

이 특허를 인용한 특허 (1)

  1. Lin, Chrong Jung; King, Ya-Chin, Three-dimensional integrated circuit and method of transmitting data within a three-dimensional integrated circuit.
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