초록 ▼

A low profile ultrasonic emitter comprises a support member operable to support an ultrasonic emittive material, the support member including a plurality of support ribs, each support rib being spaced from adjacent support ribs and extending longitudinally along the support member. An ultrasonic emi

A low profile ultrasonic emitter comprises a support member operable to support an ultrasonic emittive material, the support member including a plurality of support ribs, each support rib being spaced from adjacent support ribs and extending longitudinally along the support member. An ultrasonic emittive film is coupled to upper portions of the support ribs so as to be carried by the support member. A first electric lead is coupled to a first face of the emittive film and a second electric lead coupled to an opposing face of the emittive film. The first and second leads are coupled to their respective faces adjacent one another but staggered from one another so as to not overlap one another when the film is positioned between the leads.

대표청구항 ▼

1. A low profile ultrasonic emitter, comprising: a support member operable to support an ultrasonic emittive material, the support member including a plurality of support ribs, each support rib being spaced from adjacent support ribs and extending along the support member, the support member includi

1. A low profile ultrasonic emitter, comprising: a support member operable to support an ultrasonic emittive material, the support member including a plurality of support ribs, each support rib being spaced from adjacent support ribs and extending along the support member, the support member including at least one wrap edge around which an emittive film can be wrapped, the wrap edge including a rounded profile, and an upper planar portion and a lower planar portion on opposing sides of the support member, each of the upper planar portion and the lower planar portion being positioned adjacent to the rounded profile;an ultrasonic emittive film coupled to upper portions of the support ribs so as to be carried by the support member;a first electric lead in contact with a first face of the emittive film; anda second electric lead in contact with an opposing face of the emittive film;the first electric lead and the second electric lead being in contact with the first face and the second face, respectively, at staggered locations so as to not overlap one another when the film is contacting the leads;wherein at least one of the first and second leads extends parallel to the rounded profile and is positioned between the emittive film and one of: i) the upper planar portion of the wrap edge and ii) the lower planar portion of the wrap edge. 2. The emitter of claim 1, wherein one of the first and second leads is in contact with the film atop the upper planar portion of the wrap edge, and an other of the first and second leads is in contact with the film atop the lower planar portion of the wrap edge. 3. The emitter of claim 1, wherein the first and second emittive leads are coupled on opposing sides of the emittive film and are positioned adjacent one another atop only one of: i) the upper planar portion of the wrap edge and ii) the lower planar portion of the wrap edge. 4. The emitter of claim 1, wherein the leads extend along, and make electrical contact with, substantially an entire length of the emittive film. 5. A method of forming a low profile parametric emitter, comprising: obtaining a support member operable to support an ultrasonic emittive material, the support member including a plurality of support ribs, each support rib being spaced from adjacent support ribs and extending along the support member, the support member having an ultrasonic emittive film coupled to upper portions of the support ribs so as to be carried by the support member, the support member including at least one wrap edge around which an emittive film can be wrapped, the wrap edge including a rounded profile, and an upper planar portion and a lower planar portion on opposing sides of the support member, each of the upper planar portion and the lower planar portion being positioned adjacent to the rounded profile;positioning a first electric lead in contact with a first face of the emittive film;positioning a second electric lead in contact with an opposing face of the emittive film;orienting the first electric lead and the second electric lead so as to be in contact with the first face and the second face, respectively, at staggered locations so as to not overlap one another when the film is positioned between the leads; andpositioning at least one of the first and second leads such that it extends parallel to the rounded profile and is positioned between the emittive film and one of: i) the upper planar portion of the wrap edge and ii) the lower planar portion of the wrap edge. 6. The method of claim 5, wherein one of the first and second leads is in contact with the emittive film atop the upper planar portion of the wrap edge, and an other of the first and second leads is in contact with the emittive film atop the lower planar portion of the wrap edge. 7. The method of claim 5, wherein the first and second leads are coupled on opposing sides of the emittive film and are positioned adjacent one another atop only one of: i) the upper planar portion of the wrap edge and ii) the lower planar portion of the wrap edge.