IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0243016
(2011-09-23)
|
등록번호 |
US-8937255
(2015-01-20)
|
발명자
/ 주소 |
|
출원인 / 주소 |
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
2 인용 특허 :
7 |
초록
▼
A method for electrically interconnecting two substrates, each having a corresponding set of preformed electrical contacts, the substrates comprising an electronic circuit, and the resulting module, is provided. A liquid curable adhesive is provided over the set of contacts of a first substrate, and
A method for electrically interconnecting two substrates, each having a corresponding set of preformed electrical contacts, the substrates comprising an electronic circuit, and the resulting module, is provided. A liquid curable adhesive is provided over the set of contacts of a first substrate, and the set of electrical contacts of the second substrate is aligned with the set of electrical contacts of the first substrate. The sets of electrical contacts of the first and second substrate are compressed to displace the liquid curable adhesive from the inter-contact region, and provide electrical communication between the respective sets of electrical contacts. The liquid curable adhesive is then cured to form a solid matrix which maintains a relative compression between the respective sets of electrical contacts. One embodiment of the module comprises a high-speed superconducting circuit which operates at cryogenic temperatures.
대표청구항
▼
1. A module having electrical interconnections along predefined paths between at least two substrates, at least one of the substrates comprising a functional superconducting electronic device, comprising: first and second substrates, each having corresponding sets of predefined electrical contacts;
1. A module having electrical interconnections along predefined paths between at least two substrates, at least one of the substrates comprising a functional superconducting electronic device, comprising: first and second substrates, each having corresponding sets of predefined electrical contacts; anda cured adhesive surrounding the sets of predefined electrical contacts,wherein the corresponding sets of predefined electrical contacts are not thermally welded together, said cured adhesive comprising a stable solid matrix adhering to the first and second substrates and being configured to maintain mutual compression and electrical conductivity between the corresponding sets of predefined electrical contacts over the entire temperature range from +50 C to −175 C. 2. The module according to claim 1, wherein the cured adhesive comprises an epoxy adhesive. 3. The module according to claim 1, wherein the cured adhesive comprises an adhesive which is configured to maintain its mechanical integrity down to cryogenic temperatures, has a positive coefficient of thermal expansion, and a corresponding uncured adhesive has a viscosity at 20 C of less than about 1000 cp. 4. The module according to claim 1, wherein the cured adhesive is substantially unfilled. 5. The module according to claim 1, wherein the cured adhesive is cured while maintained under a pressure between the first and second substrates of between about 5-100 gm per set of contacts. 6. The module according to claim 1, wherein at least one set of predefined contacts comprises a plastically deformable metal, and wherein a sufficient pressure is applied between the first and second substrates to plastically deform the metal on each of the at least one set of predefined contacts. 7. The module according to claim 1, wherein the sets of contacts comprises at least 20 contacts each, and wherein each of the contacts of the respective sets forms a conductive path between the first and second substrate. 8. The module according to claim 1, wherein the cured adhesive is produced as a result of a curing process during which a corresponding uncured adhesive shrinks to provide a prestress. 9. The module according to claim 1 wherein the first and second substrates have matched coefficients of thermal expansion, and the cured adhesive has a substantially mismatched coefficient of thermal expansion with respect to the first and second substrates. 10. The module according to claim 1, wherein the cure adhesive is removable from the first and second substrates substantially without damage to the at least one of the substrates comprising the functional superconducting electronic device. 11. The module according to claim 1, wherein the functional superconducting electronic circuit comprises a superconducting integrated circuit device. 12. The module according to claim 1, wherein the functional superconducting electronic circuit comprises at least one rapid single flux quantum gate. 13. An electronic module, comprising: at least one electronic device substrate, each comprising a functional superconducting electronic device, and having an array of predefined electrical contact regions;an interconnection substrate, having an array of complementary predefined electrical contact regions, wherein elements of the array of predefined electrical contact regions of the at least one electronic device substrate are electrically communicative with elements of the respective array of the complementary predefined electrical contact regions;a cured liquid adhesive surrounding the set of predefined electrical contact regions and complementary predefined electrical contact regions to hold the set of predefined electrical contact regions and complementary predefined electrical contact regions in alignment;wherein the set of predefined electrical contact regions and complementary predefined electrical contact regions are maintained in mutual compression as a result of a prestress induced by the cured liquid adhesive and are not thermally welded together, said cured adhesive comprising a stable solid matrix adhering to a respective electronic device substrate and the interconnection substrate, and being configured to and to maintain electrical conductivity between the corresponding sets of predefined electrical contacts over entire temperature range from +50 C to −175 C, wherein at least one of the set of predefined electrical contact regions and the set of complementary predefined electrical contact regions comprises a conductive metal which is deformed by a pressure without melting prior to curing, and which excludes cured liquid adhesive from an intercontact zone between the set of predefined electrical contact regions and the set of complementary predefined electrical contact regions. 14. The electronic module according to claim 13, wherein the cured liquid adhesive is configured to be cured at a temperature of less than about 100 C during curing, in a process having a maximum process temperature less than about 120 C. 15. The electronic module according to claim 13, wherein the cured liquid adhesive comprises an epoxy adhesive which is configured to shrink during curing, and has a positive coefficient of thermal expansion after curing. 16. The electronic module according to claim 15, wherein the interconnection substrate and the electronic device substrate have matched coefficients of thermal expansion, and the cured liquid adhesive has a substantially mismatched coefficient of thermal expansion with respect to the interconnection substrate and the electronic device substrate. 17. The electronic module according to claim 13, wherein the conductive metal which is deformed by a pressure without melting prior to curing is subjected to a compression during curing of between about 5-100 gm per contact pair, to deform the conductive metal. 18. The electronic module according to claim 13, wherein the superconducting electronic device comprises a plurality of rapid single flux quantum gates. 19. The electronic module according to claim 13, wherein the at least one electronic device substrate comprises at least two electronic device substrates, and the interconnection substrate has at least two arrays of complementary predefined electrical contact regions, wherein elements of the array predefined electrical contact regions of a respective electronic device substrate are electrically communicative with elements of the array of the complementary predefined electrical contact regions. 20. The electronic module according to claim 19, wherein the set of predefined electrical contact regions and complementary predefined electrical contact regions are configured for electrical communication of electrical pulses representing bits of a digital signal, having a bit error rate maintained at a level less than 5×10−14. 21. The electronic module according to claim 19, wherein: at least two of the electronic device substrates are configured to electrically communicate through the interconnection substrate,the cured liquid adhesive is formed by dispensing a cryogenically stable liquid curable adhesive over at least one exposed array of predefined electrical contact regions, in a layer less than about 100 microns thick, and having a viscosity less than about 10,000 cp,the liquid curable adhesive is distributed over a bonding area encompassing the at least one array of predefined electrical contact regions without voids,the set of exposed array of predefined electrical contact regions of the interconnection substrate is aligned with the complementary array of predefined electrical contact regions and compressed, the liquid curable adhesive over the array of predefined electrical contact regions being displaced from locations where the exposed sets of contacts of the array of predefined electrical contact regions and the complementary array of predefined electrical contact regions are aligned, to permit electrical communication between the respective aligned array of predefined electrical contact regions and complementary array of predefined electrical contact regions, the liquid curable adhesive being readily squeezed from an intercontact space, substantially without redistributing forces at contact points of respective exposed array of predefined electrical contact regions,said compressing being sufficient to plastically deform the respective aligned sets of exposed array of predefined electrical contact regions, andthe liquid curable adhesive surrounding the plastically deformed aligned sets of exposed array of predefined electrical contact regions being cured to form a cryogenically stable solid matrix which is configured to maintain a relative compression and electrical conductivity between the respective aligned sets of plastically deformed exposed array of predefined electrical contact regions over entire temperature range from +50 C to −175 C, andthe aligned sets of plastically deformed exposed array of predefined electrical contact regions being aligned, compressed and cured substantially without fusion. 22. The electronic module according to claim 21, wherein the liquid curable adhesive comprises a substantially unfilled epoxy adhesive, which prior to curing has a viscosity at 20 C of less than about 1000 cp, wets silicon dioxide, and subsequent to curing, shrinks, has a positive coefficient of thermal expansion, and maintains its mechanical integrity down to 9 K, wherein the liquid curable adhesive is configured to cure in a process having a maximum process temperature of less than 120 C.
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