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At least one feature pertains to an apparatus having passive thermal management that includes an integrated circuit die, a heat spreader thermally coupled to the integrated circuit die, a phase change material (PCM) thermally coupled to the heat spreader, and a molding compound that encases the heat

At least one feature pertains to an apparatus having passive thermal management that includes an integrated circuit die, a heat spreader thermally coupled to the integrated circuit die, a phase change material (PCM) thermally coupled to the heat spreader, and a molding compound that encases the heat spreader and the PCM. In one example, the heat spreader may include a plurality of fins, and at least a portion of the PCM is interposed between the plurality of fins. Another feature pertains to an apparatus that includes an integrated circuit die, and a molding compound having a phase change material intermixed therein. The resulting molding compound completely encases the die.

대표청구항 ▼

1. An apparatus having passive thermal management, the apparatus comprising: an integrated circuit die;a heat spreader thermally coupled to the integrated circuit die;a phase change material (PCM) thermally coupled to the heat spreader; anda molding compound encasing, at least partially, the heat sp

1. An apparatus having passive thermal management, the apparatus comprising: an integrated circuit die;a heat spreader thermally coupled to the integrated circuit die;a phase change material (PCM) thermally coupled to the heat spreader; anda molding compound encasing, at least partially, the heat spreader, wherein the molding compound encases the PCM, and wherein the PCM is configured to transition from solid to liquid within an operating temperature of the integrated circuit die. 2. The apparatus of claim 1, wherein the heat spreader comprises a plurality of fins, and at least a portion of the PCM is interposed between the plurality of fins. 3. The apparatus of claim 1, wherein the heat spreader comprises a plurality of fins that form at least one basin, and at least a portion of the PCM resides in the basin. 4. The apparatus of claim 3, wherein the molding compound encasing the PCM physically touches the PCM. 5. The apparatus of claim 1, wherein the heat spreader comprises a plurality of fins that form a plurality of basins containing the PCM, the plurality of basins positioned side-by-side next to each other along a length of the heat spreader. 6. The apparatus of claim 1, wherein the heat spreader comprises a plurality of chambers that contain the PCM, the heat spreader encasing the PCM. 7. The apparatus of claim 6, wherein the plurality of chambers are positioned side-by-side next to each other along a length of the heat spreader. 8. The apparatus of claim 6, wherein the plurality of chambers are positioned side-by-side next to each other along a thickness of the heat spreader. 9. The apparatus of claim 1, wherein the heat spreader comprises a first region positioned over a high heat region of the die and a second region positioned over a low heat region of the die, the first region including a plurality of fins having the PCM interposed therein, the second region lacking the PCM, wherein the high heat region of the die generates heat energy at a greater rate than the low heat region of the die when the apparatus is powered ON. 10. The apparatus of claim 1, wherein the PCM is adapted to passively dissipate heat energy generated by the die by changing phase from a solid to a liquid at its melting point. 11. The apparatus of claim 10, wherein the melting point, of the PCM is less than a maximum allowed operational temperature tM of the die. 12. The apparatus of claim 1, wherein a thickness of the heat spreader is between one (1) times and ten (10) times a thickness of the die. 13. The apparatus of claim 1, wherein the heat spreader is adapted to reduce die warpage. 14. The apparatus of claim 1, further comprising: a backside metallization layer having a first side that is thermally coupled to the die and a second side that is thermally coupled to the heat spreader. 15. The apparatus of claim 1, wherein the PCM is one of a shape-stabilized composite paraffin having expanded graphite, a micro-encapsulated composite paraffin and high density polyethylene compound having expanded graphite, a nano-encapsulated composite paraffin and high density polyethylene compound having expanded graphite, a micro-encapsulated composite paraffin and high density polyethylene compound, or a nano-encapsulated composite paraffin and high density polyethylene compound. 16. The apparatus of claim 1, wherein the molding compound comprises a molding compound phase change material. 17. The apparatus of claim 1, wherein the apparatus is incorporated into at least one of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, and/or a laptop computer. 18. An apparatus, comprising: an integrated circuit die;means for passively dissipating heat energy thermally coupled to the integrated circuit die;means for storing latent heat thermally coupled to the means for passively dissipating heat energy; andmeans for encasing, at least partially, the means for passively dissipating heat energy, wherein the means for encasing, at least partially, the means for passively dissipating heat energy encases the means for storing latent heat, and wherein the means for storing latent heat is configured to transition from solid to liquid within an operating temperature of the integrated circuit die. 19. The apparatus of claim 18, further comprising: means for increasing a surface area of the means for passively dissipating heat energy, wherein at least a portion of the means for storing latent heat is interposed between the means for increasing the surface area of the means for passively dissipating heat energy. 20. The apparatus of claim 18, wherein the means for passively dissipating heat enemy comprises means for containing the means for storing latent heat, the means for passively dissipating heat energy encasing the means for storing latent heat. 21. The apparatus of claim 20, wherein the means for containing the means for storing latent heat is positioned side-by-side next to a second means for containing the means for storing latent heat along a length of the means for passively dissipating heat energy. 22. The apparatus of claim 20, wherein the means for containing the means for storing latent heat is positioned side-by-side next to a second means for containing the means for storing latent heat along a thickness of the means for passively dissipating heat energy. 23. The apparatus of claim 18, wherein the means for storing latent heat dissipates heat energy generated by the die by changing phase from a solid to a liquid at its melting point, and the melting point of the means for storing latent heat is less than a maximum allowed operational temperature tM of the die. 24. The apparatus of claim 18, wherein a thickness of the means for passively dissipating heat energy is between one (1) times and ten (10) times a thickness of the die. 25. The apparatus of claim 18, wherein the means for encasing, at least partially, the means for passively dissipating heat energy comprises a phase change material. 26. The apparatus of claim 18, wherein the means for storing latent heat is a phase change material. 27. The apparatus of claim 18, wherein the means for passively dissipating heat energy is a heat spreader. 28. The apparatus of claim 18, wherein the means for encasing is a molding compound. 29. An apparatus, comprising: an integrated circuit die;a molding compound having a molding compound phase change material intermixed therein, the molding compound encasing the integrated circuit die;a heat spreader thermally coupled to the integrated circuit die; anda phase change material thermally coupled to the heat spreader, wherein the molding compound encases, at least partially, the heat spreader, and completely encases the phase change material. 30. The apparatus of claim 29, wherein the apparatus is incorporated into at least one of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, and/or a laptop computer. 31. An apparatus, comprising: an integrated circuit die;means for encasing the integrated circuit die, wherein the means for encasing the integrated circuit die comprises a phase change material intermixed therein;means for passively dissipating heat energy thermally coupled to the integrated circuit die; andmeans for storing latent heat thermally coupled to the means for passively dissipating heat energy, wherein the means for encasing encases, at least partially, the means for passively dissipating heat energy, and completely encases the means for storing latent heat.