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An object of the present invention is to provide a method of transferring an object to be peeled onto a transferring member in a short time without imparting damage to the object to be peeled within a laminate. Also, another object of the present invention is to provide a method of manufacturing a s

An object of the present invention is to provide a method of transferring an object to be peeled onto a transferring member in a short time without imparting damage to the object to be peeled within a laminate. Also, another object of the present invention is to provide a method of manufacturing a semiconductor device in which a semiconductor element manufactured on a substrate is transferred onto a transferring member, typically, a plastic substrate. The methods are characterized by including: forming a peeling layer and an object to be peeled on a substrate; bonding the object to be peeled and a support through a two-sided tape; peeling the object to be peeled from the peeling layer by using a physical method, and then bonding the object to be peeled onto a transferring member; and peeling the support and the two-sided tape from the object to be peeled.

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1. A method for manufacturing a semiconductor device comprising: forming a semiconductor element over a first substrate with a peeling layer interposed therebetween;bonding a support to the semiconductor element with a two-sided tape interposed therebetween;peeling the semiconductor element from the

1. A method for manufacturing a semiconductor device comprising: forming a semiconductor element over a first substrate with a peeling layer interposed therebetween;bonding a support to the semiconductor element with a two-sided tape interposed therebetween;peeling the semiconductor element from the first substrate at the peeling layer;bonding the semiconductor element to a first transferring member with an adhesive interposed therebetween;peeling the support from the two-sided tape;peeling the two-sided tape from the semiconductor element by irradiating the two-sided tape with ultraviolet light after peeling the support from the two-sided tape; andbonding a second transferring member over the semiconductor element,wherein the support is made from a metal. 2. A method for manufacturing a display device comprising: forming a semiconductor element over a first substrate with a peeling layer interposed therebetween;bonding a support to the semiconductor element with a two-sided tape interposed therebetween;peeling the semiconductor element from the first substrate at the peeling layer;bonding the semiconductor element to a first transferring member with an adhesive interposed therebetween;peeling the support from the two-sided tape;peeling the two-sided tape from the semiconductor element by irradiating the two-sided tape with ultraviolet light after peeling the support from the two-sided tape; andbonding a second transferring member over the semiconductor element,wherein the support is made from a metal. 3. A method for manufacturing a semiconductor device according to claim 1, wherein the semiconductor element comprises thin film transistors. 4. A method for manufacturing a semiconductor device according to claim 1, wherein the first transferring member comprises a plastic. 5. A method for manufacturing a semiconductor device according to claim 1, wherein the second transferring member comprises a plastic. 6. A method for manufacturing a semiconductor device according to claim 1, wherein the semiconductor device is at least one selected from the group consisting of a computer, a camera, a goggle type display, a phone and an electronic book. 7. A method for manufacturing a display device according to claim 2, wherein the semiconductor element comprises thin film transistors. 8. A method for manufacturing a display device according to claim 2, wherein the first transferring member comprises a plastic. 9. A method for manufacturing a display device according to claim 2, wherein the second transferring member comprises a plastic. 10. A method for manufacturing a display device according to claim 2, wherein the display device is a liquid crystal display incorporated in at least one selected from the group consisting of a computer, a camera, a goggle type display, a phone and an electronic book. 11. A method for manufacturing a semiconductor device according to claim 1, wherein the adhesive comprises at least one selected from the group consisting of an epoxy resin, an acrylic resin, and a silicon resin. 12. A method for manufacturing a display device according to claim 2, wherein the adhesive comprises at least one selected from the group consisting of an epoxy resin, an acrylic resin, and a silicon resin.