Method for manufacturing glass sealed body and method for manufacturing light-emitting device
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
C03B-023/207
C03B-023/24
C03C-027/06
H01L-051/52
H01J-009/24
출원번호
US-0468607
(2012-05-10)
등록번호
US-8950216
(2015-02-10)
우선권정보
JP-2011-107804 (2011-05-13)
발명자
/ 주소
Tanaka, Koichiro
출원인 / 주소
Semiconductor Energy Laboratory Co., Ltd.
대리인 / 주소
Husch Blackwell LLP
인용정보
피인용 횟수 :
1인용 특허 :
24
초록▼
In a method for manufacturing a glass sealed body, a paste including powdered glass and a binder is discharged from an outlet whose shape is a closed curve to form a partition whose shape is a closed curve over a first glass substrate; the partition is heated so that the binder is volatilized and th
In a method for manufacturing a glass sealed body, a paste including powdered glass and a binder is discharged from an outlet whose shape is a closed curve to form a partition whose shape is a closed curve over a first glass substrate; the partition is heated so that the binder is volatilized and the powdered glass is fused to be a frit glass; and the frit glass and a second glass substrate are heated while disposing in close contact with each other, so that the frit glass and the second glass substrate are welded together to form a closed space by the frit glass, the first glass substrate, and the second glass substrate. A light-emitting element is sealed with the glass sealed body, so that the sealing is hardly broken even when impact or external force is applied.
대표청구항▼
1. A method for manufacturing a glass sealed body, comprising: discharging a paste formed in an annular shape from an outlet which has the annular shape to form a partition which has the annular shape over a first glass substrate, the paste including powdered glass and a binder;heating the partition
1. A method for manufacturing a glass sealed body, comprising: discharging a paste formed in an annular shape from an outlet which has the annular shape to form a partition which has the annular shape over a first glass substrate, the paste including powdered glass and a binder;heating the partition so that the binder is volatilized and the powdered glass is fused to be a frit glass; andheating the frit glass and a second glass substrate while disposing in close contact with each other, so that the frit glass and the second glass substrate are welded together to form a closed space by the frit glass, the first glass substrate, and the second glass substrate. 2. The method for manufacturing the glass sealed body according to claim 1, wherein the paste is discharged to form a closed curve. 3. The method for manufacturing the glass sealed body according to claim 1, further comprising a step of forming a frit glass over the second glass substrate. 4. A method for manufacturing a light-emitting device, comprising: discharging a paste formed in an annular shape from an outlet which has the annular shape to form a partition which has the annular shape over a first glass substrate, the paste including powdered glass and a binder;heating the partition so that the binder is volatilized and the powdered glass is fused to be a fit glass;forming a light-emitting element over a second glass substrate; andheating the frit glass rapidly while the frit glass and the second glass substrate are disposed in close contact with each other, so that the frit glass and the second glass substrate are welded together to form a closed space by the frit glass, the first glass substrate, and the second glass substrate to seal the light-emitting element in the closed space. 5. The method for manufacturing the light-emitting device according to claim 4, wherein a part of a terminal connecting to an electrode of the light-emitting element is led to an outside of the closed space, andwherein a depressed portion which engages with a projected portion of the terminal is formed in the frit glass overlapping with the terminal. 6. The method for manufacturing the light-emitting device according to claim 4, wherein the paste is discharged to form a closed curve. 7. The method for manufacturing the light-emitting device according to claim 4, further comprising a step of forming a frit glass over the second glass substrate. 8. The method for manufacturing the light-emitting device according to claim 4, further comprising a step of forming a depressed portion in the partition before heating the partition. 9. A method for manufacturing a light-emitting device, comprising: forming a light-emitting element over a first glass substrate;discharging a paste formed in an annular shape from an outlet which has the annular shape to form a partition which has the annular shape over the first glass substrate so as to surround the light-emitting element, the paste including powdered glass and a binder;heating the partition locally so that the binder is volatilized and the powdered glass is fused to be a frit glass; andheating the frit glass locally while the frit glass and a second glass substrate are disposed in close contact with each other, so that the frit glass and the second glass substrate are welded together to form a closed space by the frit glass, the first glass substrate, and the second glass substrate to seal the light-emitting element in the closed space. 10. The method for manufacturing the light-emitting device according to claim 9, wherein a part of a terminal connecting to an electrode of the light-emitting element is led to an outside of the closed space, andwherein a depressed portion which engages with a projected portion of the terminal is formed in the partition overlapping with the terminal. 11. The method for manufacturing the light-emitting device according to claim 9, wherein a surface of the partition, which is in contact with the second glass substrate, is planarized. 12. The method for manufacturing the light-emitting device according to claim 9, wherein the paste is discharged to form a closed curve. 13. The method for manufacturing the light-emitting device according to claim 9, further comprising a step of forming a frit glass over the second glass substrate. 14. The method for manufacturing the light-emitting device according to claim 9, further comprising a step of forming a depressed portion in the partition before heating the partition. 15. A method for manufacturing a light-emitting device, comprising: forming a light-emitting element over a first glass substrate;discharging a paste formed in an annular shape from an outlet which has the annular shape to form a partition which has the annular shape over the first glass substrate so as to surround the light-emitting element, the paste including powdered glass and a binder; andheating the partition locally while the partition and a second glass substrate are disposed in close contact with each other so that the binder is volatilized and the powdered glass is fused to be a fit glass,wherein the fit glass and the second glass substrate are welded together to form a closed space by the frit glass, the first glass substrate, and the second glass substrate to seal the light-emitting element in the closed space. 16. The method for manufacturing the light-emitting device according to claim 15, wherein a part of a terminal connecting to an electrode of the light-emitting element is led to an outside of the closed space, andwherein a depressed portion which engages with a projected portion of the terminal is formed in the partition overlapping with the terminal. 17. The method for manufacturing the light-emitting device according to claim 15, wherein a surface of the partition, which is in contact with the second glass substrate, is planarized. 18. The method for manufacturing the light-emitting device according to claim 15, wherein the paste is discharged to form a closed curve. 19. The method for manufacturing the light-emitting device according to claim 15, further comprising a step of forming a partition over the second glass substrate. 20. The method for manufacturing the light-emitting device according to claim 15, further comprising a step of forming a depressed portion in the partition before heating the partition.
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