A re-workable heat dissipation assembly may include a non-removable adhesive layer. A first interposer layer may be adhered to a device via the non-removable adhesive layer. A removable adhesive layer may be adhered to the first interposer layer. A heat dissipation assembly may be adhered to the rem
A re-workable heat dissipation assembly may include a non-removable adhesive layer. A first interposer layer may be adhered to a device via the non-removable adhesive layer. A removable adhesive layer may be adhered to the first interposer layer. A heat dissipation assembly may be adhered to the removable adhesive layer. Use of an interposer layer and a removable adhesive layer in combination with a non-removable adhesive layer, provides a high performance heat dissipation assembly while enabling re-working of the assembly following initial manufacture.
대표청구항▼
1. A re-workable heat dissipation assembly comprising: a substantially permanent first adhesive layer, the substantially permanent first adhesive layer having a first dimension and a second dimension;a first interposer layer adhered to an electronic device via the substantially permanent first adhes
1. A re-workable heat dissipation assembly comprising: a substantially permanent first adhesive layer, the substantially permanent first adhesive layer having a first dimension and a second dimension;a first interposer layer adhered to an electronic device via the substantially permanent first adhesive layer, the first interposer layer having the first dimension and the second dimension;a second adhesive layer adhered to the first interposer layer, the second adhesive layer comprising a thermally conductive tape, andthe second adhesive layer having the first dimension and the second dimension;a second interposer layer adhered to the second adhesive layer, the second interposer layer having the first dimension and the second dimension;a third adhesive layer adhered to the second interposer layer, the third adhesive layer having the first dimension and the second dimension; anda heat dissipation device adhered to the first interposer layer via the third adhesive layer, at least one of the first interposer layer or the second adhesive layer including a non-uniform, irregular, or non-planar surface. 2. The assembly of claim 1, where the substantially permanent first adhesive layer comprises a thermally conductive adhesive layer. 3. The assembly of claim 1, where the substantially permanent first adhesive layer comprises a low pressure adhesive layer. 4. The assembly of claim 1, where the substantially permanent first adhesive layer comprises an epoxy adhesive layer. 5. The assembly of claim 1, where the first interposer layer comprises a heat conductive layer. 6. The assembly of claim 1, where the first interposer layer comprises a metallic heat conductive layer. 7. The assembly of claim 1, where the first interposer layer comprises aluminum. 8. The assembly of claim 1, where the first interposer layer comprises a metallic foil. 9. The assembly of claim 1, where the first interposer layer comprises copper. 10. The assembly of claim 1, where the second adhesive layer is applied using pressure. 11. The assembly of claim 10, where the second adhesive layer is applied to the first interposer layer with a high pressure. 12. The assembly of claim 1, where the second adhesive layer has a thickness ranging from approximately 0.001 to 0.011 inches. 13. The assembly of claim 1, where the heat dissipation device comprises a heat sink or a heat pipe assembly. 14. The assembly of claim 1, where the substantially permanent first adhesive layer comprises a no-pressure adhesive layer. 15. The assembly of claim 1, where the second adhesive layer is a non-epoxy adhesive layer. 16. A re-workable heat dissipation assembly comprising: a substantially permanent first adhesive layer, the substantially permanent first adhesive layer having a first dimension and a second dimension;a first interposer layer adhered to a device via the substantially permanent first adhesive layer, the first interposer layer having a thickness of approximately 0.001 inches, andthe first interposer layer having the first dimension and the second dimension;a second substantially permanent adhesive layer adhered to the first interposer layer, the second substantially permanent adhesive layer having the first dimension and the second dimension;a second interposer layer adhered to the first interposer layer via the second substantially permanent adhesive layer, the second interposer layer having the first dimension and the second dimension;a third adhesive layer adhered to the second interposer layer, the third adhesive layer comprising a thermally conductive tape, andthe third adhesive layer having the first dimension and the second dimension; anda heat dissipation device adhered to the third adhesive layer, at least one of the first interposer layer or the second interposer layer including a non-uniform, irregular, or non-planar surface. 17. The re-workable heat dissipation assembly of claim 16, where the substantially permanent first adhesive layer comprises one of: a thermally conductive adhesive layer,a low pressure adhesive layer,an epoxy adhesive layer, ora no-pressure adhesive layer. 18. The re-workable heat dissipation assembly of claim 16, where the first interposer layer comprises one of: a heat conductive layer, ora metallic heat conductive layer. 19. The re-workable heat dissipation assembly of claim 16, where the second substantially permanent adhesive layer is applied using pressure. 20. The re-workable heat dissipation assembly of claim 16, where the heat dissipation device comprises a heat sink or a heat pipe assembly.
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