IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0231771
(2011-09-13)
|
등록번호 |
US-8953318
(2015-02-10)
|
발명자
/ 주소 |
- Smith, James E.
- Bishop, William
|
출원인 / 주소 |
- The Board of Trustees of the University of Alabama, for and on behalf of the University of Alabama in Huntsville
|
대리인 / 주소 |
Maynard Cooper & Gale, P.C.
|
인용정보 |
피인용 횟수 :
1 인용 특허 :
6 |
초록
▼
Embodiments of the present disclosure generally pertain to passive cooling systems and methods for electronics. An exemplary passive cooling system for electronics has a circuit package and dielectric liquid. The circuit package has a cover positioned over a circuit element coupled to a substrate. T
Embodiments of the present disclosure generally pertain to passive cooling systems and methods for electronics. An exemplary passive cooling system for electronics has a circuit package and dielectric liquid. The circuit package has a cover positioned over a circuit element coupled to a substrate. The cover is attached to the substrate and creates a water-tight seal around the circuit element. The circuit package further has a porous media. The dielectric liquid directly contacts the circuit element, and heat from the circuit element is transferred to the dielectric liquid. As the liquid reaches its boiling point, vapor from the liquid is passed through the porous media for further cooling.
대표청구항
▼
1. A cooling system for electronics, comprising: a substrate;a circuit element coupled to the substrate;a cover positioned over the circuit element such that the circuit element is enclosed by the cover and the substrate, the cover attached to the substrate such that a water-tight seal is formed bet
1. A cooling system for electronics, comprising: a substrate;a circuit element coupled to the substrate;a cover positioned over the circuit element such that the circuit element is enclosed by the cover and the substrate, the cover attached to the substrate such that a water-tight seal is formed between the substrate and the cover;dielectric liquid positioned within the cover, the dielectric liquid contacting the circuit element;input tubing coupled to the cover; andoutput tubing coupled to the cover,wherein the dielectric liquid enters the cover through the input tubing, and wherein vapor from the dielectric liquid exits the cover through the output tubing. 2. The cooling system of claim 1, wherein the substrate comprises dielectric material. 3. The cooling system of claim 1, further comprising a dielectric liquid source coupled to the input tubing and the output tubing, wherein the vapor condenses into the liquid within the output tubing, and wherein the liquid flows back into the dielectric liquid source from the output tubing. 4. The cooling system of claim 1, wherein the output tubing discards the vapor. 5. The cooling system of claim 1, further comprising a porous media having a plurality of pores dimensioned to receive vapor from the dielectric liquid, the porous media positioned such that vapor from the dielectric liquid is received by the pores when the dielectric liquid boils. 6. The cooling system of claim 1, wherein the circuit element comprises an integrated circuit chip. 7. A cooling system for electronics, comprising: a substrate;a circuit element coupled to the substrate;a cover positioned over the circuit element such that the circuit element is enclosed by the cover and the substrate, the cover attached to the substrate such that a water-tight seal is formed between the substrate and the cover;dielectric liquid positioned within the cover, the dielectric liquid contacting the circuit element; anda porous media having a plurality of pores dimensioned to receive vapor from the dielectric liquid, the porous media positioned such that vapor from the dielectric liquid is received by the pores when the dielectric liquid boils, wherein the pores are dimensioned to prevent the dielectric liquid from entering the pores. 8. The cooling system of claim 7, wherein the porous media is positioned within the cover. 9. The cooling system of claim 8, wherein the porous media comprises liquid phase sintered (LPS) copper frit. 10. The cooling system of claim 7, wherein the porous media is positioned within the output tubing. 11. A cooling system for electronics, comprising: a substrate;a circuit element positioned on the substrate;a cover positioned over the circuit element;a dielectric liquid positioned within the cover and contacting the circuit element; anda dielectric liquid source,wherein the cover has an inlet for receiving the dielectric liquid from the dielectric liquid source, and wherein the cover has an outlet. 12. The cooling system of claim 11, wherein the cover is attached to the substrate. 13. The cooling system of claim 12, wherein the cover forms a water-tight seal between the cover and the substrate. 14. The cooling system of claim 11, further comprising a porous media having a plurality of pores dimensioned to accept vapor from the dielectric liquid, the media positioned such that vapor from the dielectric liquid is received by the pores and cooled by the porous media when the dielectric liquid boils. 15. The cooling system of claim 11, wherein the outlet is for permitting vapor from the dielectric liquid to exit the cover when the dielectric liquid boils. 16. The cooling system of claim 11, wherein the outlet is coupled to the dielectric liquid source. 17. A cooling system for electronics, comprising: a substrate;a circuit element positioned on the substrate;a cover positioned over the circuit element;a dielectric liquid positioned within the cover and contacting the circuit element; anda porous media having a plurality of pores dimensioned to accept vapor from the dielectric liquid, the media positioned such that vapor from the dielectric liquid is received by the pores and cooled by the porous media when the dielectric liquid boils, wherein the pores are dimensioned such that the dielectric liquid is prevented from passing through the porous media. 18. The cooling system of claim 17, wherein the porous media is positioned on the cover. 19. A cooling system for electronics, comprising: a substrate;a circuit element positioned on the substrate;a cover positioned over the circuit element;a dielectric liquid positioned within the cover and contacting the circuit element; anda porous media having a plurality of pores dimensioned to accept vapor from the dielectric liquid, the media positioned such that vapor from the dielectric liquid is received by the pores and cooled by the porous media when the dielectric liquid boils, wherein the porous media covers an outlet of the cover. 20. A method of cooling a circuit element, comprising: providing a circuit element positioned upon a substrate and covered by a cover;causing dielectric liquid to flow through an inlet of the cover such that the dielectric liquid contacts the circuit element;emitting heat from the circuit element to the dielectric liquid contacting the circuit element, thereby causing the dielectric liquid to boil; andpermitting vapor from the boiling dielectric liquid to exit the cover through an outlet of the cover. 21. The method of claim 20, further comprising receiving the vapor from the boiling dielectric liquid into pores of a porous media. 22. A method of cooling a circuit element, comprising: providing a circuit element positioned upon a substrate and covered by a cover;emitting heat from the circuit element to a dielectric liquid positioned within the cover andcontacting the circuit element, thereby causing the dielectric liquid to boil; andreceiving vapor from the boiling dielectric liquid into pores of a porous media,wherein the pores are dimensioned such that the dielectric liquid is prevented from passing through the porous media. 23. The method of claim 22, further comprising cooling the vapor via the porous media causing the vapor to condense. 24. The method of claim 22, wherein the porous media is positioned within the cover.
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