Coolant-buffered, vapor-compression refrigeration apparatus and method with controlled coolant heat load
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
F25D-023/12
F25B-049/02
F25B-025/00
H05K-007/20
출원번호
US-0939546
(2010-11-04)
등록번호
US-8955346
(2015-02-17)
발명자
/ 주소
Campbell, Levi A.
Chu, Richard C.
Ellsworth, Jr., Michael J.
Iyengar, Madhusudan K.
Simons, Robert E.
출원인 / 주소
International Business Machines Corporation
대리인 / 주소
Chiu, Esq., Steven
인용정보
피인용 횟수 :
0인용 특허 :
50
초록▼
Apparatus and method are provided for cooling an electronic component. The apparatus includes a coolant-cooled structure in thermal communication with the component(s) to be cooled, and a coolant-to-refrigerant heat exchanger coupled in fluid communication with the coolant-cooled structure via a coo
Apparatus and method are provided for cooling an electronic component. The apparatus includes a coolant-cooled structure in thermal communication with the component(s) to be cooled, and a coolant-to-refrigerant heat exchanger coupled in fluid communication with the coolant-cooled structure via a coolant loop to receive coolant from and supply coolant to the coolant-cooled structure. The apparatus further includes a refrigerant loop coupled in fluid communication with the coolant-to-refrigerant heat exchanger, and the heat exchanger cools coolant passing therethrough by dissipating heat from the coolant in the coolant loop to refrigerant in the refrigerant loop. A controllable coolant heater is associated with the coolant loop for providing an adjustable heat load on the coolant in the coolant loop to ensure at least a minimum heat load is dissipated from the coolant to the refrigerant passing through the heat exchanger.
대표청구항▼
1. An apparatus for facilitating cooling of an electronic component, the apparatus comprising: a coolant-cooled structure, the coolant-cooled structure being in thermal communication with the electronic component;a coolant loop coupled in fluid communication with the coolant-cooled structure for pas
1. An apparatus for facilitating cooling of an electronic component, the apparatus comprising: a coolant-cooled structure, the coolant-cooled structure being in thermal communication with the electronic component;a coolant loop coupled in fluid communication with the coolant-cooled structure for passing a liquid coolant therethrough:a coolant-to-refrigerant heat exchanger coupled in fluid communication with the coolant-cooled structure via the coolant loop to receive liquid coolant therefrom and provide liquid coolant thereto;a vapor-compression refrigeration loop lacking an adjustable expansion valve and coupled in fluid communication with the coolant-to-refrigerant heat exchanger, the coolant-to-refrigerant heat exchanger cooling liquid coolant passing therethrough by dissipating heat from the liquid coolant passing therethrough to refrigerant passing therethrough; anda controllable coolant heater in thermal communication with the coolant loop, the controllable coolant heater selectively heating liquid coolant in the coolant loop based, at least in part, on heat load of the electronic component to ensure that the liquid coolant passing through the coolant-to-refrigerant heat exchanger dissipates at least a specified minimum heat load to refrigerant passing through the coolant-to-refrigerant heat exchanger;an adjustable pump in fluid communication with the coolant loop for pumping coolant through the coolant loop;a controller coupled to control the controllable coolant heater to automatically adjust the heat load applied by the controllable heater to coolant within the coolant loop to ensure that the liquid coolant passing through the coolant-to-refrigerant heat exchanger dissipates at least the specified minimum heat load to the refrigerant passing through the coolant-to-refrigerant heat exchanger, and the controller being coupled to the adjustable pump to automatically adjust pump speed of the adjustable pump, the controller operating to maintain a temperature of the electronic component within a specified temperature range by dynamically increasing pump speed of the adjustable pump responsive to temperature of the electronic component being above a first specified temperature, and by dynamically reducing pump speed of the adjustable pump responsive to temperature of the electronic component being below a second specified temperature; anda compressor coupled in fluid communication with the vapor-compression refrigeration loop, wherein the specified minimum heat load is prespecified to ensure that super-heated vapor refrigerant enters the compressor, thereby allowing the compressor to run at a fixed compressor speed, without cycling on and off during cooling of the electronic component. 2. The apparatus of claim 1, further comprising a fixed expansion orifice in fluid communication with the vapor-compression refrigeration loop for expanding refrigerant passing therethrough. 3. The apparatus of claim 1, wherein the controller automatically adjusts heat load applied by the controllable coolant heater to the coolant within the coolant loop responsive to a change in the heat load of the electronic component. 4. The apparatus of claim 3, wherein the controller periodically monitors a current heat load of the electronic component and, responsive thereto, automatically sets heat load applied by the controllable coolant heater to the coolant within the coolant loop equal to the minimum heat load to be dissipated to the refrigerant less the current heat load of the electronic component. 5. The apparatus of claim 1, further comprising a temperature sensor for monitoring a temperature associated with the electronic component, and wherein the controller automatically increases heat load applied by the controllable coolant heater to coolant within the coolant loop responsive to the monitored temperature being below a specified temperature, and automatically decreases heat load applied by the controllable coolant heater to the coolant within the coolant loop responsive to the monitored temperature of the electronic component being above another specified temperature, wherein the another specified temperature is greater than the specified temperature. 6. The apparatus of claim 1, further comprising a temperature sensor for monitoring a temperature of coolant within the coolant loop, and wherein the controller automatically adjusts heat load applied by the controllable coolant heater to coolant within the coolant loop with reference to the monitored temperature of coolant within the coolant loop, wherein heat load applied by the controllable coolant heater is automatically increased responsive to the monitored temperature being below a specified temperature, and is automatically decreased responsive to the monitored temperature being above another specified temperature, wherein the another specified temperature is greater than the specified temperature. 7. A cooled electronic system comprising: an electronics rack comprising an electronic component to be cooled; andan apparatus for facilitating cooling of the electronic component, the apparatus comprising: a coolant-cooled structure, the coolant-cooled structure being in thermal communication with the electronic component;a coolant loop coupled in fluid communication with the coolant-cooled structure for passing a liquid coolant therethrough;a coolant-to-refrigerant heat exchanger coupled in fluid communication with the coolant-cooled structure via the coolant loop to receive liquid coolant therefrom and provide liquid coolant thereto;a vapor-compression refrigeration loop lacking an adjustable expansion valve and coupled in fluid communication with the coolant-to-refrigerant heat exchanger, the coolant-to-refrigerant heat exchanger cooling liquid coolant passing therethrough by dissipating heat from the liquid coolant passing therethrough to refrigerant passing therethrough; anda controllable coolant heater in thermal communication with the coolant loop, the controllable coolant heater selectively heating liquid coolant in the coolant loop based, at least in part, on heat load of the electronic component to ensure that liquid coolant passing through the coolant-to-refrigerant heat exchanger dissipates at least a specified minimum heat load to refrigerant passing through the coolant-to-refrigerant heat exchanger;an adjustable pump in fluid communication with the coolant loop for pumping coolant through the coolant loop;a controller coupled to control the controllable coolant heater to automatically adjust the heat load applied by the controllable heater to coolant within the coolant loop to ensure that the liquid coolant passing through the coolant-to-refrigerant heat exchanger dissipates at least the specified minimum heat load to the refrigerant passing through the coolant-to-refrigerant heat exchanger, and the controller being coupled to the adjustable pump to automatically adjust pump speed of the adjustable pump, the controller operating to maintain a temperature of the electronic component within a specified temperature range by dynamically increasing pump speed of the adjustable pump responsive to temperature of the electronic component being above a first specified temperature, and by dynamically reducing pump speed of the adjustable pump responsive to temperature of the electronic component being below a second specified temperature; anda compressor coupled in fluid communication with the vapor-compression refrigeration loop, wherein the specified minimum heat load is prespecified to ensure that super-heated vapor refrigerant enters the compressor, thereby allowing the compressor to run at a fixed compressor speed, without cycling one and off during cooling of the electronic component. 8. The cooled electronic system of claim 7, wherein the apparatus further comprises a fixed expansion orifice in fluid communication with the vapor-compression refrigeration loop for expanding refrigerant passing therethrough. 9. The cooled electronic system of claim 7, wherein the electronic component is a first electronic component of an electronics rack to be cooled, the coolant-cooled structure is a first coolant-cooled structure, the coolant loop is a first coolant loop, the coolant-to-refrigerant heat exchanger is a first coolant-to-refrigerant heat exchanger, the refrigerant loop is a first vapor-compression refrigeration loop and the controllable coolant heater is a first controllable coolant heater, and wherein the electronics rack further comprises a second electronic component to be cooled, and the apparatus further comprises: a second coolant-cooled structure, the second coolant-cooled structure being associated with the second electronic component;a second coolant loop coupled in fluid communication with the second coolant-cooled structure for passing liquid coolant therethrough;a second coolant-to-refrigerant heat exchanger coupled in fluid communication with the second coolant-cooled structure via the second coolant loop to receive liquid coolant therefrom and provide liquid coolant thereto;a second vapor-compression refrigeration loop lacking an adjustable expansion valve and coupled in fluid communication with the second coolant-to-refrigerant heat exchanger, the second coolant-to-refrigerant heat exchanger cooling liquid coolant passing therethrough by dissipating heat from the coolant passing liquid coolant therethrough to refrigerant passing therethrough; anda second controllable coolant heater in thermal communication with the second coolant loop, the second controllable coolant heater selectively heating liquid coolant in the second coolant loop based, at least in part, on heat load of the electronic component and ensuring that liquid coolant passing through the second coolant-to-refrigerant heat exchanger dissipates at least a minimum heat load to refrigerant passing through the second coolant-to-refrigerant heat exchanger. 10. The cooled electronic system of claim 9, wherein the controller is further coupled to the second controllable coolant heater for automatically controlling heat load applied by the second controllable coolant heater to coolant within the second coolant loop. 11. The cooled electronic system of claim 10, wherein the compressor coupled in fluid communication with the first vapor-compression refrigeration loop is a first compressor, and the apparatus further comprises a second compressor coupled in fluid communication with the second vapor-compression refrigeration loop, a first fixed expansion orifice coupled in fluid communication with the first vapor-compression refrigeration loop and a second fixed expansion orifice coupled in fluid communication with the second vapor-compression refrigeration loop, wherein the minimum heat load dissipated by coolant passing through the second coolant-to-refrigerant heat exchanger is prespecified to ensure that super-heated refrigerant enters the second compressor, thereby allowing the second compressor to run at a fixed compressor speed, and wherein the first fixed expansion orifice expands refrigerant passing therethrough, and the second fixed expansion orifice expands refrigerant passing therethrough, the apparatus further comprising a condenser, the first vapor-compression refrigeration loop and the second vapor-compression refrigeration loop, each being in fluid communication with a separate section of the condenser for separately condensing refrigerant passing therethrough. 12. The cooled electronic system of claim 7, wherein the controller periodically monitors a current heat load of the electronic component and, responsive thereto, automatically sets the heat load applied by the controllable coolant heater to the coolant within the coolant loop equal to the minimum heat load to be dissipated to the refrigerant less the current heat load of the electronic component. 13. The cooled electronic system of claim 7, further comprising a temperature sensor for monitoring a temperature associated with the electronic component, wherein the controller automatically increases heat load applied by the controllable coolant heater to coolant within the coolant loop responsive to the monitored temperature being below a specified temperature, and automatically decreases heat load applied by the controllable coolant heater to the coolant within the coolant loop responsive to the monitored temperature of the electronic component being above another specified temperature, wherein the another specified temperature is greater than the specified temperature. 14. The cooled electronic system of claim 7, further comprising a temperature sensor for monitoring a temperature of coolant within the coolant loop, wherein the controller automatically adjusts heat load applied by the controllable coolant heater to coolant within the coolant loop with reference to the monitored temperature of coolant within the coolant loop, and wherein heat load applied by the controllable coolant heater is automatically increased responsive to the monitored temperature being below a specified temperature, and is automatically decreased responsive to the monitored temperature being above another specified temperature, wherein the another specified temperature is greater than the specified temperature. 15. A method of facilitating cooling of an electronic component, the method comprising: coupling in thermal communication a coolant-cooled structure to the electronic component;providing a coolant loop in fluid communication with the coolant-cooled structure for passing a liquid coolant therethrough;providing a coolant-to-refrigerant heat exchanger in fluid communication with the coolant-cooled structure via the coolant loop to receive liquid coolant therefrom and provide liquid coolant thereto;providing a vapor-compression refrigeration loop lacking an adjustable expansion valve and coupled in fluid communication with the coolant-to-refrigerant heat exchanger, the coolant-to-refrigerant heat exchanger cooling liquid coolant passing therethrough by dissipating heat from the liquid coolant passing therethrough to refrigerant passing therethrough;associating a controllable coolant heater in thermal communication with the coolant loop, the controllable coolant heater selectively heating liquid coolant in the coolant loop based, at least in part, on heat load of the electronic component to ensure that the liquid coolant passing through the coolant-to-refrigerant heat exchanger dissipates at least a specified minimum heat load to refrigerant passing through the coolant-to-refrigerant heat exchanger when the apparatus is operationally facilitating cooling of the electronic component;providing an adjustable pump in fluid communication with the coolant loop for pumping coolant through the coolant loop;providing, a controller coupled to control the controllable coolant heater to automatically adjust the heat load applied by the controllable heater to coolant within the coolant loop to ensure that the liquid coolant passing through the coolant-to-refrigerant heat exchanger dissipates at least the specified minimum heat load to the refrigerant passing through the coolant-to-refrigerant heat exchanger, and the controller being coupled to the adjustable pump to automatically adjust pump speed of the adjustable pump, the controller operating to maintain a temperature of the electronic component within a specified temperature range by dynamically increasing pump speed of the adjustable pump responsive to temperature of the electronic component being above a first specified temperature, and by dynamically reducing pump speed of the adjustable pump responsive to temperature of the electronic component being below a second specified temperature; andproviding a compressor coupled in fluid communication with the vapor-compression refrigeration loop, wherein the specified minimum heat load is prespecified to ensure that super-heated vapor refrigerant enters the compressor, thereby allowing the compressor to run at a fixed compressor speed, without cycling on and off during cooling of the electronic component.
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