초록 ▼

The electronic device includes a heat generator 54, a heat radiator 58, and a heat radiation material 56 disposed between the heat generator 54 and the heat radiator 58 and including a plurality of linear structures 12 of carbon atoms and a filling layer 14 formed of a thermoplastic resin and dispos

The electronic device includes a heat generator 54, a heat radiator 58, and a heat radiation material 56 disposed between the heat generator 54 and the heat radiator 58 and including a plurality of linear structures 12 of carbon atoms and a filling layer 14 formed of a thermoplastic resin and disposed between the plurality of linear structures 12.

대표청구항 ▼

1. An electronic device comprising: a heat generator;a heat radiator; anda heat radiation material disposed between the heat generator and the heat radiator and comprising: a plurality of cylindrical structures made up of carbon atoms; a filling layer formed of a thermoplastic resin and disposed bet

1. An electronic device comprising: a heat generator;a heat radiator; anda heat radiation material disposed between the heat generator and the heat radiator and comprising: a plurality of cylindrical structures made up of carbon atoms; a filling layer formed of a thermoplastic resin and disposed between the plurality of cylindrical structures; and a first coating film having a thickness of 25 nm to 1000 nm, formed so as to coat individual ends of the plurality of cylindrical structures and formed of a material having a higher thermal conductivity than the thermoplastic resin. 2. The electronic device according to claim 1, wherein the thermoplastic resin changes a state between liquid and solid in accordance with temperatures. 3. The electronic device according to claim 2, wherein the thermoplastic resin exhibits adhesiveness when it changes the state from liquid to solid. 4. The electronic device according to claim 1, wherein the filling layer includes a first layer formed of the thermoplastic resin, a second layer disposed on the first layer and formed of a material different from the thermoplastic resin, and a third layer disposed on the second layer and formed of the thermoplastic layer. 5. The electronic device according to claim 1, wherein the plurality of cylindrical structures are oriented in a direction of a film thickness of the filling layer. 6. The electronic device according to claim 1, wherein at least one end of the plurality of cylindrical structures are exposed from the filling layer. 7. The electronic device according to claim 1, further comprising: a second coating film having a thickness of 25 nm to 1000 nm, formed so as to coat individual other ends of the plurality of cylindrical structures and formed of a material having a higher thermal conductivity than the thermoplastic resin.