Cooling systems employing fluidic jets, methods for their use and methods for cooling
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
F28F-013/02
F28F-013/12
H05K-007/20
F28F-013/08
F28F-013/10
출원번호
US-0072903
(2013-11-06)
등록번호
US-RE45376
(2015-02-17)
발명자
/ 주소
Arik, Mehmet
Wetzel, Todd Garrett
Solovitz, Stephen Adam
출원인 / 주소
General Electric Company
대리인 / 주소
Ziolkowski Patent Solutions Group, SC
인용정보
피인용 횟수 :
0인용 특허 :
19
초록▼
In one embodiment, a cooling system is disclosed. The cooling system comprises: a cooling channel for receiving a cooling media, a substrate disposed near the cooling channel, and a fluidic jet disposed within the substrate and in fluid communication with the cooling channel. The cooling channel is
In one embodiment, a cooling system is disclosed. The cooling system comprises: a cooling channel for receiving a cooling media, a substrate disposed near the cooling channel, and a fluidic jet disposed within the substrate and in fluid communication with the cooling channel. The cooling channel is for thermal communication with a component to be cooled. The cooling channel has a height of less than or equal to about 3 mm and a width of less than or equal to 2 mm. The fluidic jet comprises a cavity defined by a well and a membrane. In one embodiment, a method of cooling an electrical component comprises: passing a cooling media through a cooling channel, drawing the cooling media into one or more of the fluidic jets, expelling the cooling media from the one or more fluidic jets into the cooling channel, and removing thermal energy from the electrical component.
대표청구항▼
1. A cooling system comprising: a cooling channel for receiving a cooling media,the cooling channel being for thermal communication with a component to be cooled,;wherein the cooling channel has a height of less than or equal to about 3 mm and a width of less than or equal to 2 mm;a substrate dispos
1. A cooling system comprising: a cooling channel for receiving a cooling media,the cooling channel being for thermal communication with a component to be cooled,;wherein the cooling channel has a height of less than or equal to about 3 mm and a width of less than or equal to 2 mm;a substrate disposed near the cooling channel; anda fluidic jet device disposed withincoupled to the substrate and in fluid communication with the cooling channel, wherein the fluidic jet comprises a cavity defined by a well and a membrane comprising an orifice, wherein the membrane is deformable intoaway from the well to draw the cooling media into the cavity via the orifice and away fromtoward the well to expel the cooling media from the cavity via the orifice. 2. The cooling system of claim 1, wherein the cooling channel has a channel width that is about 25 μm to about 300 μm and a channel height that is about 50 μm to about 500 μm. 3. The cooling system of claim 1, wherein the membrane has a membrane size, wherein the orifice disposed through the membrane forms the fluid communication between the fluidic jet device and the channel, and wherein the orifice has an orifice size that is less than or equal to about 50% of the membrane size. 4. The cooling system of claim 3, wherein the orifice size that is less than or equal to about 25% of the membrane size. 5. The cooling system of claim 4, wherein the orifice size that is about 8% to about 15% of the membrane size. 6. The cooling system of claim 1, wherein the membrane is connected in operable communication to a lead for supplying electrical energy to the membrane to cause the membrane to oscillate. 7. The cooling system of claim 1, further comprising a sensor that is connected in operational communication to a controller for activating the fluidic jet device. 8. The cooling system of claim 1, further comprising a plurality of the fluidic jets, anda sensor connected to each fluidic jet and connected in operational communication to a controller for activating the fluidic jets individually. 9. The cooling system of claim 1, wherein the channel has a changing width and/or height. 10. The cooling system of claim 1, wherein the cooling system is a closed loop system comprising a plurality of the fluidic jets, a plurality of the channels, and a cooling media in the cooling channels. 11. The cooling system of claim 1, wherein the cooling channels are in thermal communication with an electronic component. 12. The cooling system of claim 11, wherein the electronic component is an integrated circuit. 13. The cooling system of claim 1, wherein the cavity has a cavity depth of about 10 μm to about 3 mm. 14. The cooling system of claim 1, wherein the cooling channel has a height of less than or equal to about 3 mm and a width of less than or equal to 2 mm. 15. The cooling system of claim 1, wherein the cooling channel is formed on a surface of the component to be cooled. 16. The cooling system of claim 1, wherein the fluidic jet device is in fluid communication with a plurality of cooling channels. 17. The cooling system of claim 1, wherein the membrane is disk-shaped. 18. The cooling system of claim 1, wherein the orifice is formed in a center of the membrane. 19. The cooling system of claim 1, wherein the orifice is formed off-center on the membrane. 20. The cooling system of claim 9, wherein the changing width and/or height comprises one of converging channel sides and diverging channel sides. 21. A cooling system comprising: a cooling channel to receive a cooling media for thermal communication with a component to be cooled; anda fluidic jet device fluidically coupled to the cooling channel, the fluidic jet device having a membrane and an orifice therein, wherein the membrane is deformable to draw the cooling media within the fluidic jet device via the orifice and expel the cooling media from the fluidic jet device via the orifice. 22. The cooling system of claim 21, wherein the fluidic jet device expels the cooling media at the component to be cooled. 23. The cooling system of claim 21, wherein the fluidic jet device expels the cooling media toward the component to be cooled in a direction orthogonal to a surface of the component to be cooled. 24. The cooling system of claim 21, wherein the cooling media in the cooling channel has a flow that is independent of the fluidic jet device. 25. The cooling system of claim 21, wherein the cooling media is expelled from the fluidic jet device in a direction generally orthogonal to a direction of flow of the cooling media through the cooling channel. 26. A cooling system comprising: a cooling channel having a cooling media disposed therein, the cooling channel in thermal communication with a component to be cooled;a substrate disposed near the cooling channel; anda fluidic jet device comprising a membrane, a well formed in the substrate, andan orifice;wherein a cavity is formed between the membrane and the well; andwherein the membrane is deformable away from the well to draw the cooling media into the cavity via the orifice and toward the well to expel the cooling media from the cavity via the orifice. 27. The cooling system of claim 26, wherein the orifice is formed through one of the membrane and the substrate. 28. The cooling system of claim 26, wherein the component to be cooled comprises an electrical component. 29. The cooling system of claim 26, further comprising a sensor connected in operational communication to a controller for activating the fluidic jet device. 30. The cooling system of claim 26, further comprising a lead coupled to the membrane and configured to supply electrical current to the membrane to cause the membrane to oscillate. 31. The cooling system of claim 26, wherein the cooling channel further comprises a conduit.
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