Protection of electronic devices used with perforating guns
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
F16F-007/00
E21B-047/01
G10K-011/16
출원번호
US-0125578
(2012-12-19)
등록번호
US-8978817
(2015-03-17)
국제출원번호
PCT/US2012/070742
(2012-12-19)
국제공개번호
WO2014/084868
(2014-06-05)
발명자
/ 주소
Rodgers, John P.
Glenn, Timothy S.
Eaton, Edwin A.
Walter, Patrick L.
Serra, Marco
출원인 / 주소
Halliburton Energy Services, Inc.
대리인 / 주소
Chamberlain Hrdlicka
인용정보
피인용 횟수 :
4인용 특허 :
133
초록▼
A sensing subassembly for use with a downhole tool comprises a housing, a cavity disposed within the housing, an electronic board disposed within the cavity, a stiffening member engaging the electronic board and configured to limit flexing of the electronic board, and a spring member configured to p
A sensing subassembly for use with a downhole tool comprises a housing, a cavity disposed within the housing, an electronic board disposed within the cavity, a stiffening member engaging the electronic board and configured to limit flexing of the electronic board, and a spring member configured to provide an isolation mount for the electronic board within the cavity.
대표청구항▼
1. A sensing subassembly for use with a downhole tool comprising: a housing;a cavity, wherein the cavity is disposed within the housing;an electronic board disposed within the cavity;a stiffening member engaging the electronic board and configured to limit flexing of the electronic board;a spring me
1. A sensing subassembly for use with a downhole tool comprising: a housing;a cavity, wherein the cavity is disposed within the housing;an electronic board disposed within the cavity;a stiffening member engaging the electronic board and configured to limit flexing of the electronic board;a spring member configured to provide an isolation mount for the electronic board within the cavity;a material layer disposed over at least a portion of at least one face or component of the electronic board; anda potting material, wherein the potting material is configured to provide a coupling between the stiffening member and the electronic board, and wherein the material layer comprises a softer material than the potting material. 2. The sensing subassembly of claim 1, where the spring member is engaged with at least a portion of the electronic board, and wherein the spring member is configured to provide isolation of the electronic board along the axis of the subassembly and radially about the axis of the subassembly. 3. The sensing subassembly of claim 1, wherein the stiffening member comprises a first stiffener disposed on at least a first side of the electronic board and a second stiffener disposed on at least a second side of the electronic board. 4. The sensing subassembly of claim 1, wherein the spring member is disposed between the electronic board and the cavity. 5. The sensing subassembly of claim 1, wherein the spring member comprises a first elastomer disposed at a first end of the cavity and a second elastomer disposed at a second end of the cavity, wherein the first elastomer and second elastomers retain the stiffening member in the cavity and couple the electronic board to the housing. 6. The sensing subassembly of claim 5, wherein the first elastomer disposed at a first end of the cavity is configure to engage at least a portion of the cavity and at least a portion of the stiffening member and the second elastomer disposed at a second end of the cavity is configured to engage at least a portion of the cavity and at least a portion of the stiffening member. 7. The sensing subassembly of claim 5, wherein the first elastomer disposed at a first end of the cavity and the second elastomer disposed at a second end of the cavity are separated by at least one void space within the cavity. 8. The sensing subassembly of claim 1, wherein the electronic board comprises a circuit board or a battery. 9. A sensing subassembly for use with a downhole tool comprising: a housing;a cavity, wherein the cavity is disposed within the housing;an electronic board disposed within the cavity;a tubular member disposed within the cavity and configured to reduce flexing of the electronic board;a potting material configured to provide a coupling between the electronic board and the tubular member, wherein the potting material is configured to reduce deflection of the electronic board;a material layer comprising softer material than the potting material, wherein the material layer is disposed over at least a portion of at least one face of the electronic board; anda spring member configured to retain the tubular member within the cavity and attenuate at least a portion of a mechanical wave incident on the housing, wherein the spring member comprises a first elastomer disposed at a first end of the cavity and a second elastomer disposed at a second end of the cavity, wherein the first elastomer and second elastomers retain the tubular member in the cavity and couple the electronic board to the housing. 10. The sensing subassembly of claim 9, wherein the tubular member comprises a non-circular tubular member or a tubular member having an open cross section. 11. The sensing subassembly of claim 9, wherein the polymeric material is configured to substantially prevent relative motion between the electronic board and at least one electronic component disposed on the electronic board when subjected to an inertial load. 12. The sensing subassembly of claim 9, further comprising a stiffening member engaging the electronic board, wherein the stiffening member is configured to reduce flexing of the electronic board along the axis of the subassembly and radially about the axis of the subassembly. 13. The sensing subassembly of claim 9, wherein the first elastomer and the second elastomer are configured to allow deflection of the electronic board and tubular member below a threshold deflection along the axis of the subassembly and radially about the axis of the subassembly. 14. The sensing subassembly of claim 13, wherein the first elastomer disposed at the first end of the cavity is configure to engage at least a portion of the cavity wall and at least a portion of the tubular member and the second elastomer disposed at the second end of the cavity is configure to engage at least a portion of the cavity wall and at least a portion of the tubular member. 15. The sensing subassembly of claim 14, further comprising a void space between the first elastomer and the second elastomer. 16. A method of attenuating at least a portion of a mechanical wave using a shock protection apparatus, the method comprising: receiving a mechanical wave at a housing of a sensing subassembly, wherein an electronic board is housed in a cavity disposed within the housing; andattenuating at least a portion of the mechanical wave on the electronic board in the axial and radial directions along the axis of the subassembly using a stiffening member and an polymeric material, wherein a material layer is disposed over at least a portion of at least one face or component of the electronic board, wherein a stiffening member is coupled to the electronic board and a potting material is disposed on at least a portion of the electronic board, wherein the potting material is configured to provide a coupling between the stiffening member and the electronic board, wherein the material layer comprises a softer material than the potting material, wherein attenuating the mechanical wave in the axial and radial directions along the axis of the subassembly on the electronic board further comprises attenuating at least a portion of the mechanical wave using a spring member, and wherein the spring member comprises a first elastomer disposed at a first end of the cavity and a second elastomer disposed at a second end of the cavity. 17. The method of claim 16, further comprising supporting at least one electronic wire by encapsulating the electronic wire with the polymeric material.
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