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Thermally conductive polymer compositions and articles made therefrom 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C08K-003/22
  • C08K-003/00
  • C08K-007/04
  • C09K-019/02
  • C09K-019/38
  • C09K-019/52
  • H05K-007/20
출원번호 US-0383468 (2010-07-21)
등록번호 US-8980984 (2015-03-17)
국제출원번호 PCT/IB2010/053332 (2010-07-21)
§371/§102 date 20121012 (20121012)
국제공개번호 WO2011/010291 (2011-01-27)
발명자 / 주소
  • Saga, Yuji
출원인 / 주소
  • Ticona LLC
대리인 / 주소
    Dority & Manning, P.A.
인용정보 피인용 횟수 : 0  인용 특허 : 58

초록

Thermally conductive polymer compositions comprising polymer, highly moisture resistant magnesium oxide, and filler having higher aspect ratio than 5. The compositions are particularly useful for metal/polymer hybrid parts.

대표청구항 ▼

1. A thermally conductive polymer composition, comprising: (a) about 15 to about 70 weight percent of thermoplastic polymer;(b) about 20 to about 60 weight percent of magnesium oxide;(c) about 5 to about 50 weight percent of filler having an aspect ratio greater than 5; wherein one or more of said (

이 특허에 인용된 특허 (58)

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  57. Asai Kuniaki (Tondabayashi JPX) Kobayashi Tadayasu (Tsukuba JPX), Wholly aromatic polyester resin composition and ovenware obtained by molding said composition.
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  58. Asai Kuniaki (Tondabayashi JPX) Kobayashi Tadayasu (Tsukuba JPX) Maeda Mituo (Tsukuba JPX), Wholly aromatic polyester resin composition and ovenware obtained by molding said composition.
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