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A high-speed, high-resolution, triangulation-based, 3-D method and system for inspecting manufactured parts and sorting the inspected parts are provided. The method includes consecutively transferring the parts so that the parts move along a path which extends from a supply of parts and through an i

A high-speed, high-resolution, triangulation-based, 3-D method and system for inspecting manufactured parts and sorting the inspected parts are provided. The method includes consecutively transferring the parts so that the parts move along a path which extends from a supply of parts and through an imaging station. A triangulation-based sensor head is supported at the imaging station. The sensor head is configured to generate focused lines of radiation and to sense corresponding reflected lines of radiation. The focused lines are delivered onto an end surface of each part to obtain a corresponding array of reflected lines of radiation. The sensor head senses the array of reflected lines to obtain a corresponding set of 2-D profile signals. The set of profile signals represent a 3-D view of the end surface. The set of 2-D profile signals of each part is processed to identify parts having an unacceptable defect.

대표청구항 ▼

1. A high-speed, high-resolution, triangulation-based, 3-D method of inspecting manufactured parts and sorting the inspected parts, the method comprising; receiving a supply of parts;consecutively transferring the parts so that the parts move along a path which extends from the supply of parts and t

1. A high-speed, high-resolution, triangulation-based, 3-D method of inspecting manufactured parts and sorting the inspected parts, the method comprising; receiving a supply of parts;consecutively transferring the parts so that the parts move along a path which extends from the supply of parts and through an imaging station;supporting a triangulation-based sensor head at the imaging station, the sensor head being configured to generate focused lines of radiation and to sense corresponding reflected lines of radiation;delivering the focused lines onto an end surface of each part during motion of the parts relative to the focused lines to obtain a corresponding array of reflected lines of radiation, the sensor head sensing the array of reflected lines to obtain a corresponding set of 2-D profile signals, the set of profile signals representing a 3-D view of the end surface;processing the set of 2-D profile signals of each part to identify parts having an unacceptable defect;directing parts identified as having an unacceptable defect to a defective part area; anddirecting parts not identified as having an unacceptable defect to an acceptable part area. 2. The method as claimed in claim 1, further comprising generating control signals to control the sensor head based on the step of transferring. 3. The method as claimed in claim 1, wherein the sensor head includes at least one semiconductor laser. 4. The method as claimed in claim 1, wherein the focused lines of radiation are polarized laser lines of light. 5. The method as claimed in claim 1, wherein the step of processing determines a part parameter. 6. The method as claimed in claim 2, wherein the path is circular and wherein the step of generating is performed with a rotary encoder. 7. The method as claimed in claim 2, wherein the path is linear and wherein the step of generating is performed with a linear encoder. 8. The method as claimed in claim 1, further comprising the step of coordinating the imaging of the parts at the imaging station with the movement of the parts to and from the imaging station to control the movement and the imaging of the parts. 9. The method as claimed in claim 6, wherein the step of transferring is at least partially performed with a rotary glass disk or table. 10. The method as claimed in claim 7, wherein the step of transferring is at least partially performed with a track having an elongated slit dimensioned to allow the focused and reflected lines of radiation to pass therethrough. 11. A high-speed, high-resolution, triangulation-based, 3-D system for inspecting manufactured parts and sorting the inspected parts, the system comprising; a source of parts;a transfer subsystem for consecutively transferring the parts from the source of parts so that the parts move along a path which extends from the source of parts and through an imaging station;a triangulation-based sensor head located at the imaging station, the sensor head being configured to generate focused lines of radiation and to sense corresponding reflected lines of radiation, the sensor head delivering the focused lines onto an end surface of each part during motion of the parts relative to the focused lines to obtain a corresponding array of reflected lines of radiation, the sensor head sensing the array of reflected lines to obtain a corresponding set of 2-D profile signals, the set of profile signals representing a 3-D view of the end surface;at least one processor to process the set of 2-D profile signals of each part to identify parts having an unacceptable defect;a mechanism including a part sorter for directing parts identified as having an unacceptable defect to a defective part area, and directing parts not identified as having an unacceptable defect to an acceptable part area; anda system controller coupled to the at least one processor and the part sorter to control the sorting based on the inspecting. 12. The system as claimed in claim 11, further comprising a sensor for providing a control signal at each of a plurality of known intervals of movement of the transfer subsystem, the control signals being utilized to control the sensor head. 13. The system as claimed in claim 11, wherein the sensor head includes at least one semiconductor laser. 14. The system as claimed in claim 11, wherein the focused lines of radiation are polarized laser lines of light. 15. The system as claimed in claim 11, wherein the at least one processor determines a part parameter. 16. The system as claimed in claim 12, wherein the path is circular and wherein the sensor is a rotary sensor. 17. The system as claimed in claim 12, wherein the path is linear and wherein the sensor is a linear sensor. 18. The system as claimed in claim 11, wherein the system controller coordinates the imaging of the parts at the imaging station with the movement of the parts to and from the imaging station to control the movement and the imaging of the parts. 19. The system as claimed in claim 16, wherein the transfer subsystem includes a rotary glass disk or table. 20. The system as claimed in claim 17, wherein the transfer subsystem includes a track having an elongated slit dimensioned to allow the focused and reflected lines of radiation to pass therethrough.