초록 ▼

Stacked semiconductor devices, semiconductor assemblies, methods of manufacturing stacked semiconductor devices, and methods of manufacturing semiconductor assemblies. One embodiment of a semiconductor assembly comprises a thinned semiconductor wafer having an active side releaseably attached to a t

Stacked semiconductor devices, semiconductor assemblies, methods of manufacturing stacked semiconductor devices, and methods of manufacturing semiconductor assemblies. One embodiment of a semiconductor assembly comprises a thinned semiconductor wafer having an active side releaseably attached to a temporary carrier, a back side, and a plurality of first dies at the active side. The individual first dies have an integrated circuit, first through die interconnects electrically connected to the integrated circuit, and interconnect contacts exposed at the back side of the wafer. The assembly further includes a plurality of separate second dies attached to corresponding first dies on a front side, wherein the individual second dies have integrated circuits, through die interconnects electrically connected to the integrated circuits and contact points at a back side, and wherein the individual second dies have a thickness of approximately less than 100 microns.

대표청구항 ▼

1. A semiconductor assembly, comprising: a thinned semiconductor wafer having an active side, a back side with a back side surface opposite the active side, and a plurality of first dies arranged in a die pattern at the active side, wherein individual first dies have first mounting terminals, an int

1. A semiconductor assembly, comprising: a thinned semiconductor wafer having an active side, a back side with a back side surface opposite the active side, and a plurality of first dies arranged in a die pattern at the active side, wherein individual first dies have first mounting terminals, an integrated circuit, and first through die interconnects electrically connected to the first mounting terminals, wherein the first mounting terminals are exposed at the active side of the wafer and are electrically connected to the integrated circuit, wherein the first through die interconnects extend from the active side and extend through the back side surface such that ends of the first through die interconnects protrude from the back side surface to define interconnect contacts exposed at the back side of the wafer; anda plurality of separate second dies spaced apart from each other and arranged in the die pattern relative to the thinned semiconductor wafer, individual second dies having a second active side electrically coupled to corresponding interconnect contacts and located at the back side of the wafer, a second back side,a second integrated circuit, anda second terminal electrically coupled to the second integrated circuit on the second active side,wherein the individual second dies have a thickness of approximately less than 150 microns. 2. The assembly of claim 1, further comprising an underfill material deposited between the first and second dies. 3. The assembly of claim 1 wherein the thickness of the plurality of second dies is substantially uniform across the thinned semiconductor wafer. 4. The assembly of claim 1 wherein the thinned semiconductor wafer has a thickness of approximately less than 100 microns. 5. The assembly of claim 1 wherein the thinned semiconductor wafer has a wafer thickness of approximately less than 50 microns and the thickness of the second die is approximately less than 50 microns. 6. The assembly of claim 1, further comprising: a plurality of separate third dies spaced apart from each other and arranged in the die pattern relative to the thinned semiconductor wafer, individual third dies having a third active side, a third back side, a third integrated circuit, and a third terminal electrically coupled to the third integrated circuit on the third active side, wherein the third die has a thickness of approximately less than 100 microns. 7. The assembly of claim 1, further comprising underfill material between the thinned semiconductor wafer and the second dies, wherein the underfill material surrounds sections of the interconnect contacts between the thinned semiconductor wafer and the second dies. 8. The assembly of claim 1 wherein the back side surface is a polished surface that is spaced apart from the second dies to define a stand-off space filled by an underfill material. 9. The assembly of claim 1 wherein the plurality of first dies are exposed at the active side of the thinned semiconductor wafer; and the second active sides of the second dies face the back side of the thinned semiconductor wafer. 10. The assembly of claim 1, further comprising: a plurality of under bump metallurgy plated pads located between and connecting the interconnect contacts of the thinned semiconductor wafer and the second terminals of the second dies, wherein the under bump metallurgy plated pads and the interconnect contacts space apart the second dies from the thinned semiconductor wafer to define a stand-off space; andan underfill material located in the stand-off space and surrounding the interconnect contacts and the under bump metallurgy plated pads. 11. The assembly of claim 1 wherein the first dies include a redistribution layer at the active side of the thinned semiconductor wafer. 12. The assembly of claim 1 wherein the plurality of first dies includes a plurality of known good first dies and a plurality of known bad first dies; andthe plurality of separate second dies includes a plurality of separated known good second dies electrically coupled to corresponding known good first dies, anda plurality of separated known bad second dies electrically coupled to corresponding known bad first dies. 13. An intermediate stacked semiconductor assembly, comprising: a thinned semiconductor wafer having an active side with mounting terminals, a plurality of first dies arranged in a die pattern, a back side with a back side surface, and first through die interconnects extending from the active side and end portions of the first through die interconnects extend through the back side surface of the wafer such that the end portions define interconnect contacts protruding from the back side surface;a plurality of singulated second dies located on the back side of the thinned semiconductor wafer and electrically connected to the interconnect contacts, wherein the individual second dies are spaced apart from each other by gaps, and wherein the second dies have a first side, a second side spaced apart from the first side by a handling thickness, and a second interconnect extending from the first side to an intermediate depth in the second die such that the second interconnects are not exposed on the second side of the second dies; andan encapsulant in the gaps. 14. The assembly of claim 13 wherein the individual second dies have a handling thickness approximately greater than 300 microns. 15. The assembly of claim 13 wherein the thinned semiconductor wafer has a final thickness approximately less than 50 microns. 16. The assembly of claim 13, further comprising an underfill material between the thinned semiconductor wafer and the second dies, wherein the underfill material surrounds ends of the first through die interconnects located between the thinned semiconductor wafer and the second dies. 17. The intermediate stacked semiconductor assembly of claim 13 wherein the first dies include a plurality of known good first dies and a plurality of known bad first dies; andthe second dies include a plurality of known good second dies and a plurality of known bad second dies, wherein the known good second dies are attached to corresponding known good first dies, and wherein the known bad second dies are attached to corresponding known bad first dies. 18. A semiconductor assembly, comprising: a wafer including a plurality of known good first dies and a plurality of known bad first dies;a plurality of separated known good second dies attached to corresponding known good first dies, and a plurality of separated known bad second dies attached to corresponding known bad first dies, wherein the known good and bad second dies are spaced apart from each other by gaps; andan encapsulant material in the gaps. 19. The assembly of claim 18 wherein the wafer has a thickness approximately less than 100 microns. 20. The assembly of claim 18 wherein the separated known good second dies and/or the separated known bad second dies have a thickness approximately less than 100 microns. 21. The assembly of claim 18 wherein the known good first dies individually comprise a first integrated circuit electrically coupled to a first terminal and a through die interconnect, and wherein the known good second dies individually comprise a second terminal electrically coupled to a second integrated circuit and an interconnect contact point of the corresponding through die interconnect.