An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed thr
An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed through the aperture. A lens is supported in a threaded lens support. The threaded lens support is threaded into the aperture of the lens holder extension portion. The lens is readily adjusted relative to the image sensor by rotating the lens support.
대표청구항▼
1. A method comprising: mounting an image sensor die to a packaging substrate, the packaging substrate comprising: a lower surface;an upper surface;a plurality of side surfaces connecting the upper and lower surfaces of the packaging substrate; anda perimeter edge at which the upper and side surface
1. A method comprising: mounting an image sensor die to a packaging substrate, the packaging substrate comprising: a lower surface;an upper surface;a plurality of side surfaces connecting the upper and lower surfaces of the packaging substrate; anda perimeter edge at which the upper and side surfaces of the packaging substrate meet;electrically connecting the image sensor die to traces on the upper surface of the packaging substrate;providing a molding comprising a lower base portion, an upper lens holder extension portion, and a window pocket between the lower base portion and the upper lens holder extension portion, where the window pocket comprises a lower shelf surface facing generally toward the lower base portion;after said providing a molding, attaching an upper surface of a window having no optical power to the lower shelf surface of the window pocket, such that the upper surface of the window will face away from the packaging substrate and a lower surface of the window will face the packaging substrate when the molding is attached to the packaging substrate;attaching the lower base portion of the molding to the upper surface of the packaging substrate at the perimeter edge of the packaging substrate;supporting a lens in a lens support; andcoupling the lens support to the lens holder extension portion of the molding in a manner that provides for movement of the lens support toward and away from the image sensor die. 2. The method of claim 1, wherein said attaching an upper surface of a window comprises using adhesive to attach the upper surface of the window to the lower shelf surface of the window pocket. 3. The method of claim 1 wherein at least one side of the lower base portion of the molding is coplanar with at least one of the plurality of side surfaces of the packaging substrate. 4. The method of claim 1, wherein the lower base portion, the packaging substrate, a first adhesive between the lower base portion and the packaging substrate, the window, and a second adhesive between the window and the lower shelf surface form an enviro-hermetically sealed cavity in which the image sensor die and the traces on the upper surface of the packaging substrate are sealed. 5. A method comprising: providing a molding comprising a lower base portion, an upper lens holder extension portion, and a window pocket between the lower base portion and the upper lens holder extension portion, where the window pocket that comprises a lower shelf surface facing generally toward the lower base portion;after said providing a molding, attaching an upper surface of a window having no optical power and comprising a filter to the lower shelf surface of the window pocket, such that the upper surface of the window will face away from a packaging substrate and a lower surface of the window will face the packaging substrate when the molding is attached to the packaging substrate;coupling an exterior surface of a lens support to an interior surface of the upper lens holder extension portion in a manner that provides for focusing movement of the lens support;attaching a lower surface of an image sensor die to an upper surface of the packaging substrate, the image sensor die comprising an upper surface comprising an active area;attaching the lower base portion of the molding to the upper surface of the packaging substrate around the image sensor die, wherein said attaching the lower base portion of the molding comprises using an adhesive to attach the lower base portion of the molding to the upper surface of the packaging substrate without penetrating the packaging substrate; andtrimming the adhesive around a periphery of the packaging substrate. 6. The method of claim 5 wherein the molding comprises molding compound. 7. The method of claim 5 wherein the image sensor die is selected from the group consisting of a CMOS image sensor device, a charge coupled device, and a pyroelectric ceramic on CMOS device. 8. The method of claim 5 wherein said attaching the lower base portion of the molding to the upper surface of the packaging substrate comprises creating an enviro-hermetical seal between the lower base portion of the molding and the packaging substrate. 9. The method of claim 5 wherein the packaging substrate is selected from the group consisting of an alumina-based ceramic substrate, a printed circuit board substrate, a plastic glass laminated substrate, and a tape-based substrate. 10. The method of claim 5 wherein the active area is responsive to light radiation. 11. The method of claim 5 wherein the upper surface of the image sensor die comprises bond pads. 12. The method of claim 11 wherein the packaging substrate comprises traces on the upper surface of the packaging substrate, the method comprising electrically connecting the bond pads to the traces. 13. The method of claim 12 wherein said electrically connecting the bond pads to the traces comprises wire-bonding the bond pads to the traces. 14. The method of claim 12, wherein the lower base portion, the packaging substrate, the adhesive between the lower base portion and the packaging substrate, the window, and a second adhesive between the window and the lower shelf surface form an enviro-hermetically sealed cavity in which the image sensor die and the traces on the upper surface of the packaging substrate are sealed. 15. A method comprising: after a molding has been provided, contacting a periphery of an upper surface of a window with a lower shelf surface of the molding, the molding comprising: a lens holder extension portion extending in an upper direction from the window, the lens holder extension portion comprising an interior surface defining a first aperture exposing the upper surface of the window; anda base portion extending in a lower direction from the window, wherein the lower shelf surface faces generally toward the base portion of the molding;coupling an exterior surface of a lens support to the interior surface of the lens holder extension portion in a manner that provides for movement of the lens support toward and away from the window;supporting at least one lens in the lens support;attaching a lower surface of an image sensor die to an upper surface of a substrate, the image sensor die comprising an upper surface comprising an active area, the upper surface of the substrate comprising exposed traces, the substrate comprising: a lower surface opposite the upper surface of the substrates;a plurality of side surfaces connecting the upper and lower surfaces of the substrate; anda perimeter edge at which the upper and side surfaces of the substrate meet; andattaching the base portion of the molding to the upper surface of the substrate around the image sensor and at the perimeter edge of the substrate, such that at least one side of the base portion of the molding is coplanar with at least one of the plurality of side surfaces of the substrate. 16. The method of claim 15, wherein said attaching the base portion of the molding to the upper surface of the substrate comprises attaching the base portion of the molding to the upper surface of the substrate with an adhesive, where the adhesive comprises a side surface that is coplanar with said at least one side of the base portion of the molding and with said at least one of the plurality of side surfaces of the substrate. 17. The method of claim 15, wherein the base portion, the substrate, a first adhesive between the base portion and the substrate, the window, and a second adhesive between the window and the lower shelf surface form an enviro-hermetically sealed cavity in which the image sensor die and the exposed traces on the upper surface of the substrate are sealed. 18. The method of claim 15 wherein the molding comprises a pocket defined, at least in part, by the lower shelf surface. 19. The method of claim 18 comprising trimming the base portion of the molding and the substrate. 20. The method of claim 18 wherein the molding comprises sides which, at least in part, define the pocket. 21. The method of claim 20 wherein the lower shelf surface extends perpendicularly from the sides of the molding.
Runyan Daniel (Hickmans) Irons Gary J. (Lincoln) Edds Thomas A. (Lincoln NE), Circuit breaker auxiliary device snap-on package and method of assembling same.
Cassarly James W. (Huntingdon PA) Rollings Robert W. (Huntingdon PA) Youngfleish Frank C. (Pennsylvania Furnace PA), Connector mounting for integrated circuit chip packages.
Iso Toshimitsu (Atsugi JPX) Nagata Kenji (Kawasaki JPX), Contact type image sensor, producing method of the same, and information processing apparatus.
Fusaroli Marzio (Milan ITX) Ceriati Laura (Sesto S. Giovanni ITX), EPROM semiconductor device erasable with ultraviolet rays and manufacturing process thereof.
Ueda Kazuhiko,JPX, Image pickup apparatus fabrication method thereof image pickup adaptor apparatus signal processing apparatus signal processing method thereof information processing apparatus and information processi.
Walton R. Thomas (Torrance CA) Hathaway James A. (Redondo Beach CA) Runyan Michael D. (Torrance CA) Turnage Michael L. (Sunnymead CA), Integrated circuit package carrier.
Suresh Ramalingam ; Nagesh Vodrahalli ; Michael J. Costello ; Mun Leong Loke ; Ravi V. Mahajan, Integrated circuit package having a substrate vent hole.
Sengupta Kabul S. ; Sklenicka Carl E. ; Thompson Deborah L. ; Arellano Raul A. ; Nagai Naoyuki,JPX ; Takehashi Nobuyuki,JPX ; Nomoto Kouichiro,JPX, Mass reflowable windowed package.
O\Regan Eoin P. (Cork IEX) Coburn Paul A. (Cork IEX) Nash Robert P. (Cork IEX) O\Donnell Pat T. (Cork IEX) Denyer Peter B. (Edinburgh GB6), Method and apparatus for coupling an optical lens to an imaging electronics array.
Bielick James D. (Oronoco MN) Hoffmeyer Mark K. (Rochester MN) Isaacs Phillip D. (Rochester MN), Method of performing solder joint analysis of semi-conductor components.
Degani Yinon (Highland Park NJ) Dudderar Thomas D. (Chatham NJ) Han Byung J. (Scotch Plains NJ) Lyons Alan M. (New Providence NJ) Tai King L. (Berkeley Heights NJ), Packaging multi-chip modules without wire-bond interconnection.
Izumi Akiya (Mobara JPX) Takemoto Iwao (Mobara JPX) Sokei Hiroichi (Mobara JPX) Kadowaki Masahiko (Mobara JPX) Iguchi Atsumu (Mobara JPX) Nakajima Junichiro (Atsugi JPX) Takahashi Masayuki (Fujisawa , Semiconductor device and video camera unit using it and their manufacturing method.
Kitaoka Kouki (Sakurai JPX) Maeda Takamichi (Ikoma JPX) Minamide Shozo (Naga-ken JPX), Solid state imaging device having a solid state image sensor and its peripheral IC mounted on one package.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.