IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0433308
(2012-03-29)
|
등록번호 |
US-9010406
(2015-04-21)
|
우선권정보 |
TW-100149144 A (2011-12-28) |
발명자
/ 주소 |
- Wang, Yu-Hsuan
- Hsu, Chung-Kai
- Liu, Chia-Yang
|
출원인 / 주소 |
- Foxconn Technology Co., Ltd.
|
대리인 / 주소 |
Novak Druce Connolly Bove + Quigg LLP
|
인용정보 |
피인용 횟수 :
0 인용 특허 :
7 |
초록
▼
A heat dissipation module includes a fan, a heat sink and a heat pipe. The fan defines an air outlet at one side thereof. The duct extends from the fan and away from the air outlet. The duct includes a first open end communicating with the fan and a second open end adjacent to a heat generating comp
A heat dissipation module includes a fan, a heat sink and a heat pipe. The fan defines an air outlet at one side thereof. The duct extends from the fan and away from the air outlet. The duct includes a first open end communicating with the fan and a second open end adjacent to a heat generating component. The located is located at the air outlet of the fan. The heat pipe thermally interconnects the heat sink and the heat generating component. The duct guides a part of airflow generated by the fan to the heat generating component during operation of the fan.
대표청구항
▼
1. A heat dissipation module comprising: a fan defining an air outlet at one side thereof;a duct extending from the fan and away from the air outlet, the duct comprising a first open end communicating with the fan and a second open end adjacent to a heat generating component;a heat sink located at t
1. A heat dissipation module comprising: a fan defining an air outlet at one side thereof;a duct extending from the fan and away from the air outlet, the duct comprising a first open end communicating with the fan and a second open end adjacent to a heat generating component;a heat sink located at the air outlet of the fan; anda heat pipe thermally interconnecting the heat sink and the heat generating component;wherein the duct guides a part of airflow generated by the fan to the heat generating component during operation of the fan, the duct further comprises a bottom plate and two side plates extending from two opposite sides of the bottom plate, and the two side plates extend beyond an edge of the bottom plate. 2. The heat dissipation module of claim 1, wherein the fan is a centrifugal fan, the air outlet and the duct being located at two opposite sides of the fan. 3. The heat dissipation module of claim 1, wherein the duct is a hollow sealed channel with the first open end and the second open end, the first open end of the duct extending to and communicating with the fan, the second open end thereof facing the heat generating component. 4. The heat dissipation module of claim 1, further comprising a fixing board connecting a sidewall of the fan via the duct, the heat generating component thermally connecting a bottom surface of the fixing board, the heat pipe thermally connecting a top surface of the fixing board. 5. The heat dissipation module of claim 4, further comprising a heat absorption board for thermally connecting the heat generating component, wherein the fixing board defines an elongated channel in the top surface thereof receiving a first end of the heat pipe, and a receiving hole in the bottom surface receiving the heat absorption board therein. 6. The heat dissipation module of claim 5, wherein the receiving hole communicates with the elongated channel. 7. The heat dissipation module of claim 5, wherein the heat pipe comprises an evaporator section, a condenser section, and a connecting section interconnecting the evaporator section and the condenser section, the evaporator section being received in the elongated channel of the fixing board. 8. The heat dissipation module of claim 7, wherein the heat pipe is U-shaped and the condenser section is parallel to the evaporator section. 9. The heat dissipation module of claim 7, wherein the heat sink defines a notch at a top portion for receiving the condenser section of the heat pipe. 10. The heat dissipation module of claim 1, wherein the heat sink comprises a plurality of fins stacked together, the fins being parallel to and spaced from each other. 11. The heat dissipation module of claim 1, wherein the fan comprises an impeller, a base, a sidewall extending upwardly from an outer periphery of the base, a cover engaged with the sidewall, the cover, the base and the sidewall cooperatively defining a cavity receiving the impeller therein. 12. The heat dissipation module of claim 11, wherein the air outlet is defined between two ends of the sidewall, the duct extending from the sidewall of the fan, the duct communicating with the cavity. 13. A heat dissipation module comprising: a heat absorption board used for thermally connecting a heat generating component;a fan comprising an impeller, the fan having a cavity receiving the impeller therein, and an air outlet at one side thereof and communicating with the cavity;a hollow sealed duct extending from the fan along a direction away from the outlet of the fan, a first open end of the duct communicating with the cavity, and a second open end of the duct facing to the heat absorption board, the duct further comprising a bottom plate and two side plates extending from two opposite sides of the bottom plate, and the two side plates extending beyond an edge of the bottom plate;a heat sink located at the air outlet of the fan; anda heat pipe thermally interconnecting heat absorption plate and the heat sink. 14. The heat dissipation module of claim 13, further comprising a fixing board connecting the fan via the duct, the heat absorption board thermally connecting a bottom surface of the fixing board, and the heat pipe thermally connecting a top surface of the fixing board. 15. The heat dissipation module of claim 14, wherein the fixing board defines an elongated channel at the top surface receiving a first end of the heat pipe, and a receiving hole at the bottom surface receiving the heat absorption plate. 16. The heat dissipation module of claim 15, wherein the receiving hole communicates with the elongated channel. 17. The heat dissipation module of claim 13, wherein the fan comprises a sidewall surrounding the cavity, the duct with the first open end extending into and through the sidewall to communicate with the cavity. 18. The heat dissipation module of claim 1, wherein the duct further comprises a top plate. 19. The heat dissipation module of claim 18, wherein the top plate extends beyond the edge of the bottom plate.
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