$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Arrangement for energy conditioning 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H02H-009/00
  • H05K-009/00
  • H01L-023/50
  • H01L-023/552
출원번호 US-0082082 (2013-11-15)
등록번호 US-9019679 (2015-04-28)
발명자 / 주소
  • Anthony, Anthony A.
  • Anthony, William M.
출원인 / 주소
  • X2Y Attenuators, LLC
대리인 / 주소
    Spafford, Kenneth C.
인용정보 피인용 횟수 : 0  인용 특허 : 770

초록

Circuit arrangement embodiments that use relative groupings of energy pathways that include shielding circuit arrangements that can sustain and condition electrically complementary energy confluences.

대표청구항

1. A conductive architecture comprising: 1.] a substrate;2.] three conductor plates including: (1) a first conductor plate,(2) a second conductor plate that is spaced apart from the first conductor plate, and(3) a third conductor plate that is spaced apart from both the first and second conductor pl

이 특허에 인용된 특허 (770)

  1. Herbert Edward, 3- and 4-terminal capacitors with "Faraday-shielded" connections.
  2. Wolf William D. ; Fraley Mary A. ; Seifried Lynn M. ; Hoch Ronald F., Adhesively- and solder-bonded capacitive filter feedthrough for implantable medical devices.
  3. Wolf William D. ; Fraley Mary A. ; Seifried Lynn M., Adhesively-bonded capacitive filter feedthrough for implantable medical device.
  4. Insetta Victor (Jacksonville FL) Davis ; Jr. Donald J. (Rocky Point NY), Adjustable mulitlayered capacitor.
  5. Insetta Victor (Jacksonville FL) Monsorno Richard V. (Jacksonville FL) Davis ; Jr. Donald J. (Rocky Point NY) Beyel Stephen (Brentwood NY), Adjustable multilayer capacitor.
  6. Anthony,William M., Amalgam of shielding and shielded energy pathways and other elements for single or multiple circuitries with common reference node.
  7. Anthony,William M., Amalgam of shielding and shielded energy pathways and other elements for single or multiple circuitries with common reference node.
  8. Saitoh Yasuaki,JPX ; Kawahata Kazunari,JPX, Antenna formed of multiple dielectric substrates including shielded LC filter.
  9. Ittipiboon Apisak (Kanata CAX) Cuhaci Michel (Ottawa CAX) Katsube Masahiro W. (Kingston CAX) Antar Yahia M. M. (Kingston CAX), Aperture-coupled line Magic-Tee and mixer formed therefrom.
  10. Seymour Colin,GBX ; Couch Nigel,GBX, Apparatus for blocking a D.C. component of a signal.
  11. Babb Samuel M. (Fort Collins CO), Apparatus for controlling electromagnetic interference from multi-layered circuit boards.
  12. Leigh Kevin B. ; Chan Michael Y., Apparatus for controlling the impedance of high speed signals on a printed circuit board.
  13. Dibene, II, Joseph T.; Hartke, David H.; Derian, Edward J.; Hoge, Carl E.; Broder, James M.; San Andres, Jose B.; Riel, Joseph S., Apparatus for delivering power to high performance electronic assemblies.
  14. Balderes Demetrios (Wappingers Falls NY) Frankovsky Andrew J. (Endwell NY) Jarvela Robert A. (Wappingers Falls NY), Apparatus for directly powering a multi-chip module from a power distribution bus.
  15. Danysh Sergey V. (Moscow SUX) Lobanov Alexey N. (Moscow SUX) Obukhov Andrey V. (Moscow SUX) Obukhov Vladimir A. (Moscow SUX), Apparatus for ion-plasma machining workpiece surfaces including improved decelerating system.
  16. Wohrstein Katharine M. (Mount Prospect IL) Copertino Vito A. (Carol Stream IL), Apparatus for shielding electronic circuit boards.
  17. Patil Sadanand R. (San Jose CA) Chou Tai-Yu (Pleasonton CA) Chakrabarti Prabhansu (Sunnyvale CA), Apparatus to decouple core circuits power supply from input-output circuits power supply in a semiconductor device packa.
  18. Anthony, Anthony A.; Anthony, William M., Arrangement for energy conditioning.
  19. Anthony, Anthony A.; Anthony, William M., Arrangement for energy conditioning.
  20. Anthony, Anthony A.; Anthony, William M., Arrangement for energy conditioning.
  21. Anthony, Anthony A.; Anthony, William M., Arrangement for energy conditioning.
  22. Anthony, Anthony A.; Anthony, William M., Arrangement for energy conditioning.
  23. Anthony, Jr.,Anthony A.; Anthony,William M., Arrangement for energy conditioning.
  24. Anthony,Anthony A.; Anthony,William M., Arrangement for energy conditioning.
  25. Anthony,Anthony A.; Anthony,William M., Arrangement for energy conditioning.
  26. Puzo Antoine,FRX ; Gonzalez Juan,FRX, Arrangement for reducing the electromagnetic field created by power electronic equipment.
  27. Anthony, Anthony A.; Anthony, William M., Arrangements for energy conditioning.
  28. Hsu, Sheng Teng, Asymmetrical MOS channel structure with drain extension.
  29. Hung Je,TWX, Automatic switching-off structure for protecting electronic device from burning.
  30. Ishizaki Toshio,JPX ; Yamada Toru,JPX ; Nakakubo Hideaki,JPX ; Kitazawa Shoichi,JPX, Balanced dielectric filter.
  31. Carlile Bruce W. (Chelmsford MA), Balanced low-pass common mode filter.
  32. Ueno Moriaki (Soma JPX), Balanced-type dielectric filter and high frequency circuit using balanced-type dielectric filter.
  33. Corisis David J., Ball array layout.
  34. Marcantonio Gabriel,CAX, Ball grid array (BGA) integrated circuit packages.
  35. Stearns William P. ; Hassanzadeh Nozar, Ball grid array package and method using enhanced power and ground distribution circuitry.
  36. Selna Erich (Mountain View CA), Ball grid array package for a integrated circuit.
  37. Selna Erich, Ball grid array package for an integrated circuit.
  38. Mostafazadeh Shahram ; Smith Joseph O., Ball grid array package with enhanced thermal and electrical characteristics and electronic device incorporating same.
  39. Richard Emil Sweeney ; Glen Brian Rochford, Balun assembly with reliable coaxial connection.
  40. Mudra Robert E. (Glenview IL), Breakaway jumper edge connector.
  41. Eckels ; Robert E., Building with passive solar energy conditioning.
  42. Bajorek Christopher H. (Goldens Bridge NY) Chance Dudley A. (Danbury CT) Ho Chung W. (Chappaqua NY), Capacitive chip carrier and multilayer ceramic capacitors.
  43. Mayer ; Ferdy, Capacitive electric filter.
  44. Buck, Bernd; Gundlach, Jochen; Palata, Jaromir, Capacitive fill level measurement device.
  45. Seifried Lynn M. ; Lessar Joseph F. ; Wolf William D. ; Fraley Mary A. ; Tidemand Kevin K. ; Engmark David B. ; Hoch Ronald F. ; Wiklund Craig L., Capacitive filter feedthrough for implantable medical device.
  46. Nagakari Shoken,JPX ; Konushi Shigeo,JPX ; Sadakane Akihiro,JPX, Capacitor.
  47. Naito Yasuyuki,JPX ; Hayashi Motoo,JPX, Capacitor and manufacturing method thereof.
  48. Greuel Georg (Simmerath DEX), Capacitor and method of manufacturing same.
  49. Sakamoto Yukio (Fukui JPX) Arakawa Yoshio (Takefu JPX) Takahashi Seiichi (Fukui JPX), Capacitor arrangement.
  50. Kohno Yoshiaki (Nagaokakyo JPX) Suzuki Tatsuya (Nagaokakyo JPX), Capacitor array.
  51. Vu Quat T. (Santa Clara CA) Gardner Donald S. (Mountain View CA), Capacitor fabricated on a substrate containing electronic circuitry.
  52. Elias William H., Capacitor for an implantable cardiac defibrillator.
  53. Johansson Ted (Hagersten SEX) Gobbi Jose-Maria (Stockholm SEX), Capacitor in an integrated function block or an integrated circuit having high capacitance, a method for manufacturing s.
  54. Howard James R. (Los Gatos CA) Lucas Gregory L. (Newark CA), Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture.
  55. Howard James R. (Sacramento CA) Lucas Gregory L. (Newark CA), Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture.
  56. Howard James R. (Sacramento CA) Lucas Gregory L. (Newark CA), Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture.
  57. Ng Anthony C. C. (Ottawa CAX) Saran Mukul (Kanata CAX), Capacitor structure for an integrated circuit.
  58. Sutardja, Pantas, Capacitor structure in a semiconductor device.
  59. Evans David A., Capacitor with spiral anode and planar cathode.
  60. Shinohara Hiroichi (Hitachi JPX) Inoue Hirokazu (Ibaraki JPX) Abe Yoichi (Hitachi JPX) Kato Akira (Mito JPX) Suzuki Hideo (Katsuta JPX) Yamada Kazuji (Hitachi JPX) Takahashi Masaaki (Hitachi JPX) Nak, Capacitor-carrying semiconductor module.
  61. Ishigaki Takaya,JPX ; Ishikawa Masatoshi,JPX ; Kamiya Takashi,JPX ; Itakura Shunji,JPX ; Aiba Yuji,JPX ; Yamamoto Masanori,JPX, Ceramic capacitor.
  62. Ishigaki Takaya,JPX ; Ishikawa Masatoshi,JPX ; Kamiya Takashi,JPX ; Itakura Shunji,JPX ; Aiba Yuji,JPX ; Yamamoto Masanori,JPX, Ceramic capacitor.
  63. Naito Yasuyuki,JPX ; Sakabe Yukio,JPX, Ceramic capacitor and semiconductor device in which the ceramic capacitor is mounted.
  64. Naito Yasuyuki (Nagaokakyo JPX) Okubo Shinichi (Nagaokakyo JPX) Tani Hiroji (Nagaokakyo JPX) Honma Kanehito (Nagaokakyo JPX) Morimoto Tadashi (Nagaokakyo JPX) Mandai Harufumi (Nagaokakyo JPX), Ceramic electronic part and producing method thereof.
  65. Chambers Jeffrey (Cumbria GB2) Smith David J. (Cumbria GB2), Ceramic package component having one quarter wavelength spaced conductive grounding vias.
  66. Frappart Pierre (Bagnolet FRX) Guichard Serge (Bagnolet FRX) Saint Marcoux Roland (Bagnolet FRX), Ceramic power capacitor.
  67. Tucker Kevin M. (Toledo OH) Peeler Donald (Toledo OH), Cervical collar.
  68. Stevenson Robert A. ; Haskell Donald K. ; Brendel Richard L. ; Woods Jason ; Louder Mike, Chip capacitor electromagnetic interference filter.
  69. Stevenson Robert A. ; Haskell Donald K. ; Brendel Richard L. ; Woods Jason ; Louder Mike, Chip capacitors and chip capacitor electromagnetic interference filters.
  70. Urbish Glenn F. (Coral Springs FL) Mullen ; III William B. (Boca Raton FL) Banerji Kingshuk (Plantation FL), Chip carrier having copper pattern plated with gold on one surface and devoid of gold on another surface.
  71. Iwaya Shoichi (Kisagata JPX) Masujima Sho (Tokyo JPX), Chip ceramic capacitor.
  72. Thompson David A. (South Salem NY), Chip package with high capacitance, stacked vlsi/power sheets extending through slots in substrate.
  73. Lee Chang H. (Daeduk-ku KRX) Lee Suk J. (Seo-ku KRX) Lee Sang S. (Dong-ku KRX) Choy Tae G. (Yuseong-ku KRX), Chip type capacitor for removing radio frequency noise.
  74. Fujiki Yasuhiro (Nagaokakyo JPX), Chip type directional coupler comprising a laminated structure.
  75. Ahiko Taisuke,JPX ; Musaka Junichi,JPX ; Satoh Hiroki,JPX, Chip type laminated ceramic capacitor.
  76. Sakamoto Yukio (Kyoto JPX) Madokoro Shinichi (Kyoto JPX) Okuyama Shingo (Kyoto JPX), Chip-like LC filter.
  77. Sakamoto Yukio (Nagaokakyo JPX) Madokoro Shinichi (Nagaokakyo JPX) Okuyama Shingo (Nagaokakyo JPX), Chip-like LC filter.
  78. Mandai Harufumi,JPX ; Kato Noboru,JPX ; Shiroki Koji,JPX ; Tojyo Atsushi,JPX, Chip-type electronic component.
  79. Raets Hubert,NLX, Circuit arrangement including an EHT cascade circuit.
  80. Bohbot Michel (Cote St-Luc CAX) Guilbert Paul A. (Lasalle CAX), Circuit assemblies of printed circuit boards and telecommunications connectors.
  81. Lightfoot David (Horsham GB2), Circuit assembly.
  82. Hundt Michael J. (Double Oak TX), Circuit assembly having interposer lead frame.
  83. Kametani Masatsugu (Ibaraki-ken JPX) Umekita Kazuhiro (Ibaraki-ken JPX), Circuit board capable of efficiently conducting heat through an inside thereof using thermal lands surrounding through-h.
  84. Funada Masao (Kanagawa JPX), Circuit board having improved thermal radiation.
  85. Funada Masao (Kanagawa JPX), Circuit board having improved thermal radiation.
  86. Steigerwald Todd W. ; Sebring Mitchell C., Circuit board voltage plane impedance matching.
  87. Kametani Masatsugu (Ibaraki JPX) Umekita Kazuhiro (Ibaraki JPX), Circuit board, electronic circuit chip-mounted circuit board and circuit board apparatus.
  88. Sweet Martin (Swindon GB2), Circuit protection device.
  89. Cross David A. (Sai Kung HKX), Clamped continuous flyback power converter.
  90. Shusterman Boris I. (Brookline MA) Curtis Robert (Hudson MA), Combined differential-mode and common-mode noise filter.
  91. Shusterman, Boris I.; Curtis, Robert, Combined differential-mode common-mode noise filter.
  92. White Curtis B. ; Anderson W. Kyle ; Allen ; III Frank W., Common-mode EMI filter.
  93. Hutchison James B., Common-mode EMI filter with a separately wound ground winding.
  94. Shusterman Boris (44 White Ave. Newton MA 02159), Common-mode filtering attachment for power line connectors.
  95. Spielman Mark A. (South Norwalk CT), Compact diplexer connection circuit.
  96. Kling John P. (Mt. Joy PA) Stone Jr. Richard F. (Elizabethtown PA), Compact encapsulated filter assembly for printed circuit boards and method of manufacture thereof.
  97. Wire Michael S., Compact magnetic shielding enclosure with high frequency feeds for cryogenic high frequency electronic apparatus.
  98. Tronche Christian,FRX ; Monfraix Philippe,FRX ; Coello Vera Augustin,FRX, Compact microwave module.
  99. Anthony, Anthony A., Component carrier.
  100. Anthony,Anthony A., Component carrier.
  101. Anthony,Anthony A.; Anthony,William M., Component carrier.
  102. Anthony,Anthony; Anthony,William M., Component carrier.
  103. Fahey Timothy E. (San Jose CA) Carlomagno William D. (Redwood City CA) Au Andrew N. (Union City CA), Composite circuit protection devices.
  104. Fang Shou-Mean (Union City CA) Horsma David A. (Palo Alto CA) Peronnet Guillaume (Palo Alto CA) Fahey Timothy E. (Williamsport PA) Au Andrew N. (Fremont CA) Carlomagno William D. (Redwood City CA), Composite circuit protection devices.
  105. Fang Shou-Mean (Union City CA) Horsma David A. (Palo Alto CA) Peronnet Guillaume (Palo Alto CA) Fahey Timothy E. (Williamsport PA) Au Andrew N. (Fremont CA) Carlomagno William D. (Redwood City CA), Composite circuit protection devices.
  106. Azumi, Takeshi; Morii, Hiroshi; Naito, Yasuyuki; Kohno, Yoshiaki, Composite electronic component.
  107. Kato Noboru (Kyoto JPX) Nogome Emiko (Kyoto JPX) Okamura Hisatake (Kyoto JPX) Tsuru Teruhisa (Kyoto JPX) Taniguchi Tetsuo (Kyoto JPX) Tonegawa Ken (Kyoto JPX), Composite electronic component and frequency adjustment method of the same.
  108. deNeuf Joel B. (State College PA) Helms Bruce E. (Warrior\s Mark PA), Composite multilayer capacitive device and method for fabricating the same.
  109. deNeuf Joel B. (State College PA) Helms Bruce E. (Warrior\s Mark PA), Composite multilayer capacitive device and method for fabricating the same.
  110. Konno Tadashige (Tokyo JPX) Nishida Koji (Tokyo JPX) Saitoh Makoto (Tokyo JPX), Composite-type circuit component and its manufacturing method.
  111. Carsten Bruce W. (Vancouver CAX) Davidson Christopher D. (North Vancouver CAX), Compound inductors for use in switching regulators.
  112. Muyshondt Jorge E. (Austin TX) Parker Gary A. (Round Rock TX) Wilkie Bruce J. (Georgetown TX), Computer including a Faraday cage on printed circuit board.
  113. Saint Marcoux Roland (Bagnolet FRX), Condenser block and voltage multiplier comprising such a condenser block.
  114. Anthony, William M., Conditioner with coplanar conductors.
  115. Anthony, William M., Conditioner with coplanar conductors.
  116. Carlomagno William D. (Redwood City CA), Conductive polymer circuit protection devices having improved electrodes.
  117. Chandler Daniel (Menlo Park CA) Thein Nelson H. (Union City CA) Chu Edward F. (Sunnyvale CA), Conductive polymer composition.
  118. Halim Moe A.,CAX, Connecting arrangement for reducing induced noise.
  119. Cohen Amir (Moshav Be\er Tuvia ; 70996 ILX), Connector.
  120. Pharney Julian Robert (Indianapolis IN) Spitz William Tracy (Indianapolis IN), Connector cross-talk compensation.
  121. Klas Daniel E. (Black Mtn. NC) Rose William J. (West Hartford CT), Connector for communication systems with cancelled crosstalk.
  122. Anthony,Anthony, Connector related structures including an energy conditioner.
  123. Teshome Abeye ; Wallace ; Jr. Douglas Elmer, Controlled impedance bus and method for a computer system.
  124. Beilin Solomon I. ; Chou William T. ; Kudzuma David ; Lee Michael G. ; Peters Michael G. ; Roman James J. ; Swamy Som S. ; Wang Wen-chou Vincent ; Moresco Larry L. ; Murase Teruo, Controlled impedence interposer substrate.
  125. Maehara Kenichi,JPX, Cooling structure of electronic appliance.
  126. Corzine Robert G. (Ridgecrest CA) Mosko Joseph A. (Ridgecrest CA), Coupled strip line circuit.
  127. Johnsen Helge Bodahl,SEX ; Timgren Mats Olav,SEX, Coupling device presenting and/or dominating a capacitance belonging to a board with a printed circuit.
  128. Whybrew Walter M. ; May Jeffery C. ; Heckaman Douglas E., Cross-over distribution scheme for canceling mutually coupled signals between adjacent stripline signal distribution networks.
  129. Aekins Robert A. (Stratford CT), Crosstalk noise reduction connector for telecommunication system.
  130. Savicki Joseph Peter, Crosstalk reduction in parsitically coupled circuits.
  131. Baiatu Tudor,CHX, Current limiter device.
  132. Duggal Anil R. (Niskayuna NY) Levinson Lionel M. (Niskayuna NY) Patchen Harold J. (Burnt Hills NY) Lewis Larry N. (Scotia NY), Current limiting device.
  133. Huang Chern I. (Beavercreek OH) Calcatera Mark (Spring Valley OH), DC biasing and AC loading of high gain frequency transistors.
  134. Aoki Kanemasa (Yokohama JPX), DC rotary machine.
  135. Ecker Mario E. (Poughkeepsie NY) Olson Leonard T. (Endwell NY), De-coupled printed circuits.
  136. Bhattacharyya Bidyut K. (Beaverton OR) Mallik Debendra (Beaverton OR) Yu You Y. (Phoenix AZ), De-coupling capacitor on the top of the silicon die by eutectic flip bonding.
  137. Herrell Dennis J. ; Boettcher Mathias,DEX, Decoupling capacitor configuration for integrated circuit chip.
  138. Lockard Steven C. (Tempe AZ) Hyslop Michael S. (Tempe AZ) Hernandez Jorge M. (Mesa AZ), Decoupling capacitor for Pin Grid Array package.
  139. Hernandez Jorge M. (Mesa AZ) Gilderdale Aleta (Chandler AZ), Decoupling capacitor for pin grid array package.
  140. Hernandez Jorge M. (Mesa AZ) Larson Rodney W. (Mesa AZ), Decoupling capacitor for surface mounted leadless chip carrier, surface mounted leaded chip carrier and pin grid array p.
  141. Hernandez Jorge M. (Mesa AZ) Gilderdale Aleta (Chandler AZ), Decoupling capacitor for surface mounted leadless chip carriers, surface mounted leaded chip carriers and Pin Grid Array.
  142. Mandai Harufumi (Kyoto JPX) Chigodo Yoshikazu (Kyoto JPX) Tojo Atsushi (Kyoto JPX), Delay line device and a method for producing the same.
  143. Nakamura Nakaba (Kyoto JPX) Kosaki Makoto (Kyoto JPX), Delay line device and method of manufacturing the same.
  144. Mandai Harufumi (Kyoto JPX) Chigodo Yoshikazu (Kyoto JPX) Tojo Atsushi (Kyoto JPX), Delay line device with adjustable time delay.
  145. Naito Yasuyuki (Nagaokakyo JPX) Morii Hiroshi (Nagaokakyo JPX) Azumi Takeshi (Nagaokakyo JPX) Kohno Yoshiaki (Nagaokakyo JPX), Designing method of p 상세보기
  • Kupper Karl H. (Krefeld DEX), Device for filtering a high-frequency conductor susceptible to electromagnetic interference of a high-frequency space.
  • Walters Roy J., Device for removing stains from swimming pool walls and concrete and the method of making the same.
  • Bartilson Bradley W., Diamond-based transformers and power convertors.
  • Doi Tetsuya (Nagaokakyo JPX) Miyagawa Takuya (Nagaokakyo JPX) Naito Yasuyuki (Nagaokakyo JPX) Morimoto Tadashi (Nagaokakyo JPX), Dielectric ceramic composition.
  • Yamada Masayuki (Takefu JPX) Ichikawa Hiroaki (Yokohama JPX) Morimoto Tadashi (Takefu JPX) Naito Yasuyuki (Takefu JPX) Takagi Hiroshi (Otsu JPX) Mandai Harufumi (Takatsuki JPX) Sakabe Yukio (Kyoto JP, Dielectric ceramic composition.
  • Ishizaki Toshio (Kobe JPX) Fujita Mitsuhiro (Yamatokoriyama JPX) Ikeda Hikaru (Takatsuki JPX) Fujino Takashi (Izumi JPX), Dielectric filter having inter-resonator coupling including both magnetic and electric coupling.
  • Mikami Shigeyuki,JPX ; Hiratsuka Toshiro,JPX ; Sonoda Tomiya,JPX, Dielectric resonator device.
  • Yuki Satoh JP; Masami Hatanaka JP; Toshio Ishizaki JP; Yuji Saka JP; Toshiaki Nakamura JP, Dielectric resonator having a frequency tuning member spirally engaged with the cavity.
  • Brooks Mark ; Broman Mark Hamilton ; Howieson Michael, Differential delay line.
  • Hamasaki Toshihiko,JPX ; Terasawa Hitoshi,JPX ; Murota Toshio,JPX, Differential filter circuit and integrated circuit structure therefor.
  • Lamson Michael A., Differential pair geometry for integrated circuit chip packages.
  • Lamson Michael A., Differential pair geometry for integrated circuit chip packages.
  • Koontz Jerry D. ; Coffin Donald F., Digital signal processing assembly and test method.
  • Lampen James L. ; Setzco Paul ; Kazior Thomas E. ; Kizner Michael G. ; Wendler ; Jr. John P., Direct backside interconnect for multiple chip assemblies.
  • Heinks Michael W. (Maple Grove MN) Dunaway Thomas J. (St. Louis Park MN) Spielberger Richard (Maple Grove MN), Direct microcircuit decoupling.
  • Whybrew Walter M. ; May Jeffery C. ; Heckaman Douglas E., Distributed ground pads for shielding cross-overs of mutually overlapping stripline signal transmission networks.
  • Barnett Ron ; Casey John F., Distributed lossy capacitive circuit element with two resistive layers.
  • Breisch,James; Chung,Chee Yee; Waizman,Alex; Yew,Teong Guan, Dual referenced microstrip.
  • Osamu Ikata JP; Yoshio Satoh JP; Nobuo Hirasawa JP; Hidenori Fukushima JP, Duplexer device.
  • Stevenson Robert A. ; Ni Dick H., EMI filter for human implantable heart defibrillators and pacemakers.
  • Wiggins Charles L. (Newport News VA) Stewart David W. (Bonaire GA), EMI line filter.
  • Chiao James ; Kinoshita Gary G., EMI noise cancellation in disk drive having MR read head and single-ended preamplifier.
  • Hailey Jeffrey C. ; Worley Richard N., EMI shielding ventilation structure.
  • Clements Brad E. ; Mann Kristina L. ; Cherniski Andrew M., EMI-attenuating air ventilation panel.
  • Masako Ohya JP; Kazuya Mimura JP; Yutaka Nakazawa JP; Satoshi Abe JP; Satoshi Arai JP; Takashi Yasuda JP; Toshihisa Nagasawa JP; Koji Sakata JP; Mitsuru Ogawa JP, Electric double layer capacitor.
  • Yamamoto Koichi,JPX ; Matsumoto Kenji,JPX ; Matsuoka Toshiyuki,JPX ; Shibuya Kentaro,JPX, Electric double layer capacitor apparatus.
  • Ftterer Bodo (Luzern CHX) Mayer Jurgen (Sachseln CHX) Fritschy Hugo (Sachseln CHX), Electric motor control.
  • Val Christian (St. Remy les Chevreuses FRX), Electric potential distribution device and an electronic component case incorporating such a device.
  • Foreman Kevin G. (Sandia Park NM) Miller Paul J. (Placitas NM), Electrical connector circuit wafer.
  • DiMarco Mario (Scottsdale AZ) Wilhelm Timothy J. (Peoria AZ), Electrical connector incorporating EMI filter.
  • Scheer Peter L. (Camp Hill PA) Raman Venkat A. (Santa Clara CA) Minich Steven E. (Carlisle PA), Electrical connector jack assembly for signal transmission.
  • Belopolsky Yakov ; Northey William A., Electrical connector with internal shield and filter.
  • Chu Edward F. (Sunnyvale CA) Banich Ann (Menlo Park CA) Ives Robert (Newark CA) Sunshine Steven (San Carlos CA) Chan Chi-Ming (Kowloon HKX), Electrical device comprising a conductive polymer composition.
  • Johnson Wayne L. ; Parsons Richard, Electrical impedance matching system and method.
  • Anastasio Paul J. (Camp Hill PA) English James M. (Annville PA) Farrar John C. (Harrisburg PA) Goel Ram P. (Camp Hill PA) Janoss Bernard J. (Harrisburg PA) Collins Christopher J. (Fremont CA) Childer, Electrical overstress protection apparatus and method.
  • Capel Antoine (Ramonville FRX), Electrical regulation and energy transfer circuit.
  • Starr Tom (Sussex GB2), Electrical surge protection.
  • Ulery Kirk D. (Mount Joy PA), Electrical terminal having means for mounting electrical circuit components in series thereon and connector for same.
  • Suzuki Hirosuke (Saitama JPX) Umebayashi Tetsuro (Saitama JPX), Electrical transmission line.
  • Siemon John (Woodbury CT) Below Randy (Cheshire CT), Electrically balanced connector assembly.
  • Anthony, Anthony A.; Anthony, William M., Electrode arrangement for circuit energy conditioning.
  • Anthony,Anthony A.; Anthony,William M., Electrode arrangement for circuit energy conditioning.
  • Siao Roger (Mountain View CA), Electrodeless discharge lamp including impedance matching and filter network.
  • Strickler Mike, Electromagnetic interference (EMI) shield for electrical components, an internal EMI barrier, and a storage enclosure for electrical/electronic components.
  • Brown Cass A. ; Greives Dane L., Electromagnetic interference shielding filter apparatus and method.
  • Yasushi Kinoshita JP; Hiroshi Wabuka JP; Shiro Yoshida JP; Hirokazu Tohya JP; Toru Mori JP; Atsushi Ochi JP, Electromagnetic interference suppressing device and circuit.
  • Mark A. Kappel ; Richard W. Waltz ; Richard G. Smith ; Donald F. Swietlik ; Raymond H. Hannula ; Christopher J. Wieloch ; Jeffrey R. Annis, Electromagnetic operator for an electrical contactor and method for controlling same.
  • Tomihari Yoshinori,JPX, Electron gun for cathode ray tube.
  • Chakravorty, Kishore K., Electronic assembly comprising substrate with embedded capacitors.
  • Ferchau Joerg U. (Morgan Hill CA) Kotyuk Kenneth A. (Morgan Hill CA) Diaz Randall J. (Gilroy CA), Electronic assembly with improved grounding and EMI shielding.
  • David G. Figueroa ; Michael Walk ; Yuan-Liang Li ; Robert L. Sankman, Electronic assembly with trench structures and methods of manufacture.
  • Amaya Keishirou (Kyoto JPX) Uchiyama Kazuyoshi (Kyoto JPX), Electronic component.
  • Maesaka Michinobu,JPX ; Tatsumi Tetsuo,JPX ; Higuchi Masato,JPX, Electronic component.
  • Celaya Phillip C. ; Kerr John R., Electronic component assembly having an encapsulation material and method of forming the same.
  • Val Christian (St. Remy les Chevreuses FRX), Electronic component box supplied with a capacitor.
  • Yoshiro Takahashi JP; Kei Nakakuki JP; Satoshi Itaya JP; Kayo Hamano JP, Electronic component utilizing face-down mounting.
  • Nguyen Hung N. (Bensalem PA), Electronic device interconnection techniques.
  • Gould, Jerry M.; Tresness, Andrew F., Electronic filter assembly.
  • Hiroshi Sekidou JP; Yoshikazu Takagi JP; Yasunobu Yoneda JP, Electronic multilayer ceramic component.
  • Chan Yee-Ning,CAX, Electronic package carrying an electronic component and assembly of mother board and electronic package.
  • Garbelli Francesco,ITX ; Oggioni Stefano,ITX, Electronic package with enhanced pad design.
  • Brown Michael B. (Binghamton NY) Ebert William S. (Endicott NY) Olson Leonard T. (Endwell NY) Sloma Richard R. (Endicott NY), Electronic package with integrated distributed decoupling capacitors.
  • Williams Bruce T. (454 South St. Lockport NY 14094), Electrophotographic charging system and method.
  • David G. Figueroa ; Yuan-Liang Li ; Chee-Yee Chung, Embedded capacitor assembly in a package.
  • Li, Yuan-Liang; Chung, Chee-Yee; Figueroa, David G., Embedded enclosure for effective electromagnetic radiation reduction.
  • Gu Wang-Chang A. (Albuquerque NM), Embedded ground plane for providing shielded layers in low volume multilayer transmission line devices.
  • Branchevsky Shaul, Embedded multi-layer ceramic capacitor in a low-temperature con-fired ceramic (LTCC) substrate.
  • English, James M.; Gurreri, Nicholas L.; Kling, John P., Encapsulated printed circuit board filter.
  • Perrin Randall L. ; Washeleski John M. ; Strom Peter H., End cap assembly and electrical motor utilizing same.
  • Anthony, David J., Energy conditioner structures.
  • Anthony, William M., Energy conditioner with tied through electrodes.
  • Anthony, William M., Energy conditioner with tied through electrodes.
  • Anthony, William M., Energy conditioner with tied through electrodes.
  • Anthony, Anthony A.; Anthony, William M., Energy conditioning circuit arrangement for integrated circuit.
  • Anthony, Anthony A.; Anthony, William M., Energy conditioning circuit arrangement for integrated circuit.
  • Anthony, Anthony A.; Anthony, William M.; Musil, Kenneth W., Energy conditioning circuit assembly.
  • Anthony, Anthony A.; Musil, Kenneth W.; Anthony, William M.; Muccioli, James P.; Anthony, David J., Energy conditioning circuit assembly.
  • Anthony,Anthony A.; Anthony,William M., Energy conditioning circuit assembly.
  • Anthony,Anthony; Anthony,William, Energy conditioning structure.
  • Anthony,William M., Energy pathway arrangement.
  • Anthony,William M.; Anthony,Anthony A.; Muccioli,James P., Energy pathway arrangement.
  • Anthony,William M., Energy pathway arrangements for energy conditioning.
  • Anthony,William M., Energy pathway arrangements for energy conditioning.
  • Seifried Lynn M. (Minneapolis MN) Tettemer Susan A. (Minneapolis MN), Fabricating a combination feedthrough/capacitor including a metallized tantalum or niobium pin.
  • Muyshondt Jorge E. (Austin TX) Parker Gary A. (Round Rock TX) Wilkie Bruce J. (Georgetown TX), Faraday cage for a printed circuit card.
  • Muyshondt Jorge E. (Austin TX) Parker Gary A. (Round Rock TX) Wilkie Bruce J. (Georgetown TX), Faraday cage for a printed circuit card.
  • Herbert Edward, Fast transition power supply.
  • Akino Tadaharu,JPX ; Tanaka Takashi,JPX ; Sasaki Hisanori,JPX ; Akachi Yoshiaki,JPX ; Konno Tadashige,JPX, Feed-through EMI filter with a metal flake composite magnetic material.
  • Makl Albert S. ; Panlener Richard J. ; Piersma Randall J., Feed-through filter assembly having varistor and capacitor structure.
  • Tanabe Takeshi (Fukui JPX), Feed-through type multilayer capacitor.
  • Azuma Takahiro (Nagaokakyo JPX) Tokuda Hiromichi (Nagaokakyo JPX) Kaneko Toshimi (Nagaokakyo JPX), Feedthrough LC filter with a deformation preventing spring.
  • Stevenson Robert A. (Canyon Country CA) Pruett Donald N. (Carson City NV), Feedthrough filter capacitor assembly for human implant.
  • Mantese Joseph V. (Troy MI) Micheli Adolph L. (Harrison Township MI) Dungan Dennis F. (Mt. Clemens MI), Ferroelectric-ferromagnetic composite materials.
  • McClanahan Robert F. (Valencia CA) Washburn Robert D. (Malibu CA), Field control and stability enhancement in multi-layer, 3-dimensional structures.
  • Nakatsuka Yasuo,JPX, Film carrier and laminate type mounting structure using same.
  • Gerstenberg, Bruno; Michling, Hans-Joachim; Messmer, Helmut, Filter arrangement.
  • Anthony, Anthony, Filter assembly.
  • Tsuchiya Takao (Tokyo JPX) Soneda Mitsuo (Tokyo JPX), Filter circuit utilizing charge transfer device.
  • Sakamoto Yukio (Nagaokakyo JPX) Tanabe Takeshi (Nagaokakyo JPX) Hori Toshio (Nagaokakyo JPX) Takeda Masashi (Nagaokakyo JPX) Iida Mitsuhiro (Nagaokakyo JPX), Filter connector.
  • Krantz Leonard A. (Sidney NY) Hogan Edward P. (Sidney NY), Filter connector with compound filter elements.
  • Whitley Thomas J. (Scarborough CAX), Filter contact.
  • Griffin Alan L. (Redlands CA), Filter pin electrical connector.
  • Miller Charles A., Filter structures for integrated circuit interfaces.
  • Lenker William G. (Marysville PA) Lurie George R. (Harrisburg PA) Showers Jeffrey L. (Mechanisburg PA), Filtered electrical connector.
  • DeDaran, Fran.cedilla.ois; Bruneau, Severin; Rouyer, Philippe; Salembere, Abdou, Filtering and interference suppressing device for an electric motor.
  • Panicker Ramachandra M. P. (Camarillo CA), Fine-pitch chip carrier.
  • Brunker David L., Flat flexible cable with ground conductors.
  • Naylor Thomas K. (Belmont MA) Crouse Helen C. (Waltham MA) Muz Edwin (Reutlingen DEX), Flexible multi-parameter cable.
  • Moden Walter L., Flip chip adaptor package for bare die.
  • Schaper Leonard W., Floating plate capacitor with extremely wide band low impedance.
  • Tanahashi Masakazu,JPX ; Shimada Mikinari,JPX ; Igaki Emiko,JPX, Four-terminal capacitor.
  • Wang Wen-chou V. (Cupertino CA) Chou William T. (Cupertino CA), Functional substrates for packaging semiconductor chips.
  • Fang Jiayuan, Ground and power patches on printed circuit board signal planes in the areas of integrated circuit chips.
  • Takamine Henry K. (Gardena CA), Ground shield apparatus for giga-hertz test jig.
  • Ott John N. (8118 Sanderling Rd. Sarasota FL 33581), Grounding device for lamp with shielded electrodes.
  • Sakshaug Eugene C. (Lanesborough MA) Stetson Earl W. (Pittsfield MA), Heat sink thermal transfer system for zinc oxide varistors.
  • Herbert Edward, High current, low inductance capacitor packages.
  • Yializis Angelo ; Miller Theodore A., High energy density capacitor.
  • Nagaishi, Hideyuki; Kondoh, Hiroshi, High frequency circuit module.
  • Denkmann W. John (Carmel IN) Dix Willard A. (Noblesville IN) Spitz William T. (Indianapolis IN), High frequency electrical connector.
  • Herbert Edward (Canton CT), High frequency matrix transformer.
  • Herbert Edward (Canton CT) Repp John D. (Barkhamsted CT) Cebry Stephen E. (Burlington CT), High frequency matrix transformer power converter module.
  • Garland Paul ; Long James Kyo ; Satoda Yozo ; Park Chong-il, High frequency microwave packaging having a dielectric gap.
  • Kamada Chiyoshi (Kokubunji JPX), High frequency signal transmission line structure having shielding conductor unit.
  • Farooq Mukta S. ; Hamel Harvey C. ; Rita Robert A. ; Stoller Herbert I., High k dielectric capacitor with low k sheathed signal vias.
  • Mukta S. Farooq ; Harvey C. Hamel ; Robert A. Rita ; Herbert I. Stoller, High k dielectric material with low k dielectric sheathed signal vias.
  • D'Ostilio James Phillip, High performance RF/microwave filters for surface mount technology with a shielding metal bracket.
  • Mosley, Larry Eugene, High performance capacitor.
  • McShane Michael B. (Austin TX) Lin Paul (Austin TX), High performance overmolded electronic package.
  • Chu George D. (Newark CA), High performance plastic encapsulated package for integrated circuit die.
  • Le Binh Quang ; Chen Pau-Ling ; Hollmer Shane ; Kawamura Shoichi ; Chung Michael ; Leung Vincent ; Yano Masaru, High voltage NMOS pass gate for integrated circuit with high voltage generator.
  • Arakawa Hajime (Youkaichi JPX) Yamaoka Osamu (Youkaichi JPX) Kobayashi Shinichi (Oumihachiman JPX) Okumura Kunio (Youkaichi JPX) Morishita Kanichi (Shiga JPX), High voltage capacitor.
  • Iwaya Shouichi (Tokyo JPX) Yahagi Masahiro (Tokyo JPX) Kudou Hitoshi (Tokyo JPX) Itou Shigeru (Tokyo JPX) Fujiwara Isao (Tokyo JPX) Ogasawara Tadashi (Tokyo JPX) Morita Makoto (Tokyo JPX) Taguchi Ter, High voltage capacitor and magnetron.
  • Blalock Donald R. (Colfax NC) Ferry Julian J. (Kernersville NC) Lincoln Clifford F. (Atlanta GA), High voltage, low pass filtering connector with multiple ground planes.
  • Sakuragawa Toru,JPX ; Yuda Naoki,JPX ; Aizawa Kimio,JPX ; Ota Ikuo,JPX ; Nanba Hideki,JPX, High-frequency circuit board trace crossing and electronic component therefor.
  • Ngai Tony ; Shumarayev Sergey ; Cheung Sammy ; Patel Rakesh ; Chan Vinson, High-performance interconnect.
  • Rainal Attilio J. (Convent Station NJ), High-speed, high pin-out LSI chip package.
  • Satou, Tukasa; Fujiwara, Isao; Sasaki, Setsuo, High-voltage feedthrough capacitor.
  • Mazumder Mohiuddin M., Hole geometry of a semiconductor package substrate.
  • Val Christian (Saint Remy Les Chevreuses FRX), Housing for encapsulating an electronic circuit.
  • Suzuki Kazutaka,JPX ; Narita Naoto,JPX ; Watanabe Tohru,JPX ; Kamiyama Yoshiaki,JPX ; Yagi Kazuki,JPX, Hybrid module and methods for manufacturing and mounting thereof.
  • Yamada Minoru (Iruma JPX) Wajima Motoyo (Hitachi JPX) Masaki Akira (Musashino JPX) Takahashi Akio (Hitachiota JPX) Nakanishi Keiichirou (Kokubunji JPX) Sugawara Katuo (Hitachi JPX), Hybrid multilayer wiring board.
  • Tamamura Masaya (Inagi JPX) Morino Yoshiro (Tsukuba JPX), IC package with electric conductor lines in dielectric package body.
  • Gumley John Richard,AUX, Ignition apparatus and method.
  • Brownell Kenneth W. (Marion NC) Vaden Sterling A. (Black Mountain NC), Impedance matched reduced cross talk electrical connector system.
  • Josefsson Lars G. (Askim SEX) Svensson Bengt T. (Mlndal SEX) Moeschlin Lars F. (Frlunda SEX), Impedance matching stripline transition for microwave signals.
  • Cox Timothy John ; Day John K., Implantable cardiac cardioverter/defibrillator with EMI suppression filter with independent ground connection.
  • Lucas Gregory L. (Newark CA), In situ method for forming a capacitive PCB.
  • Yoshidome Hitoshi,JPX ; Maruyama Takashi,JPX ; Hirota Kazuo,JPX, Inductance cancelled condenser implemented apparatus.
  • Kato Noboru,JPX ; Tojyo Atsushi,JPX, Inductor built-in electronic parts using via holes.
  • Kledzik Kenneth J. (Boise ID), Inherently impedance matched integrated circuit socket.
  • Foreman Kevin G. (Sandia Park NM) Kiser Willie C. (Rio Rancho NM) Miller Paul J. (Albuquerque NM), Insert device for electrical relays, solenoids, motors, controllers, and the like.
  • Foreman Kevin G. (Sandia Park NM) Kiser Willie C. (Rio Rancho NM) Miller Paul J. (Albuquerque NM), Insert device for electrical relays, solenoids, motors, controllers, and the like.
  • Li, Yuan-Liang; Chung, Chee-Yee; Figueroa, David G., Integral capacitor using embedded enclosure for effective electromagnetic radiation reduction.
  • Robert A. Stevenson, Integrated EMI filter-DC blocking capacitor.
  • Youker Nick A. ; Blood James E. ; Hansen John E., Integrated EMI shield utilizing a hybrid edge.
  • Devoe, Daniel; Devoe, Alan; Devoe, Lambert, Integrated broadband ceramic capacitor array.
  • Oku Akihiro (Kawasaki JPX) Aonuma Souichi (Kawasaki JPX) Wakabayashi Tetsushi (Yokohama JPX), Integrated circuit device having an improved package structure.
  • Miyauchi Akira (Kawasaki JPX) Nishimoto Hiroshi (Tokyo JPX) Okiyama Tadashi (Kawasaki JPX) Kitasagami Hiroo (Kawasaki JPX) Sugimoto Masahiro (Yokosuka JPX) Tamada Haruo (Yokohama JPX) Emori Shinji (U, Integrated circuit device having stacked conductive layers connecting circuit elements therethrough.
  • Miyauchi Akira (Kawasaki JPX) Nishimoto Hiroshi (Tokyo JPX) Okiyama Tadashi (Kawasaki JPX) Kitasagami Hiroo (Kawasaki JPX) Sugimoto Masahiro (Yokohama JPX) Tamada Haruo (Yokohama JPX) Emori Shinji (U, Integrated circuit device having strip line structure therein.
  • Tomita, Hiroyoshi; Shinozaki, Naoharu; Taniguchi, Nobutaka; Fujieda, Waichirou; Sato, Yasuharu; Kawasaki, Kenichi; Yamazaki, Masafumi; Ninomiya, Kazuhiro, Integrated circuit device incorporating DLL circuit.
  • Lange Friedrich (Groebenzell DEX) Ressel Roland (Munich DEX), Integrated circuit housing composed of three coated, dielectric plates.
  • Marcantonio Gabriel (Nepean CAX) Nguyen Khanh (Nepean CAX), Integrated circuit package and assembly thereof for thermal and EMI management.
  • Imai Ryuji (Aichi JPX) Kanbe Rokuro (Aichi JPX), Integrated circuit package having a multilayered wiring portion formed on an insulating substrate.
  • Hernandez Jorge M. (1920 E. Jarvis Mesa AZ 85202), Integrated circuit package having an internal cavity for incorporating decoupling capacitor.
  • Upadhyay Anand K. (Libertyville IL), Integrated common mode and differential mode inductor device.
  • Cain Jeffery C. ; Barris John E., Integrated dual frequency noise attenuator.
  • Frederick W. Richard (Mundelein IL), Integrated electromagnetic interference filter.
  • Fasano Benjamin V. ; Kim Churl S., Integrated electronic components having conductive filled through holes.
  • Nishida Masao,JPX ; Sawai Tetsuro,JPX, Integrated resonance circuit consisting of a parallel connection of a microstrip line and a capacitor.
  • Vafi Habib (San Diego CA) Beilin Solomon I. (San Carlos CA) Wang Wen-chou V. (Cupertino CA), Interconnect carriers having high-density vertical connectors and methods for making the same.
  • Park Pyong K. (Agoura Hills CA), Interconnection between layers of striplines or microstrip through cavity backed slot.
  • Foreman Kevin G. (13 Tejano Canyon Rd. Sandia Park NM 87047) Kiser Willie C. (4572 Rockaway Loop Rio Rancho NM 87124) Lovett Karin J. (2815 Tramway Cir. Albuquerque NM 87122) Miller Paul J. (1809 New, Interface conditioning insert wafer.
  • Tulintseff Ann N., Interlayer stripline transition.
  • Cross David A.,GB2, Interleaved continuous flyback power converter system.
  • Zane A. Ball ; Aviram Gutman IL; Lawrence T. Clark, Interleaved signal trace routing.
  • Viola Raymond D. (Oyster Bay NY) Hanley Gerard L. (Melville NY), Interlevel stripline coupler.
  • Hernandez Jorge M. (Mesa AZ) Hyslop Michael S. (Chandler AZ), Internally decoupled integrated circuit package.
  • Brendel Richard L. ; Stevenson Robert A., Internally grounded feedthrough filter capacitor.
  • Anthony, William M.; Anthony, David; Anthony, Anthony, Internally overlapped conditioners.
  • Anthony, William M.; Anthony, David; Anthony, Anthony, Internally overlapped conditioners.
  • Anthony, David; Anthony, Anthony; Anthony, William M.; Muccioli, James; Neifeld, Richard A., Internally shielded energy conditioner.
  • Gilliland Don Alan ; Peacock James Larry, Interposer array module for capacitive decoupling and filtering.
  • Kishore K. Chakravorty ; Michael Walk, Interposer substrate with low inductance capacitive paths.
  • Nishikawa Masaji (Hachioji JPX), Ion flow electrostatic recording process and apparatus.
  • Anthony A. Anthony ; William M. Anthony, Isolating energy conditioning shield assembly.
  • Anthony, Anthony A.; Anthony, William M., Isolating energy conditioning shield assembly.
  • Jain Nitin ; Atherton John Stephen ; Schwab Paul John ; Wells Graham J. H., Isolation in multi-layer structures.
  • Ryoichi Kondo JP; Takahide Kurahashi JP; Shinya Nakai JP; Hajime Kato JP, Isolator device with built-in power amplifier and embedded substrate capacitor.
  • Chang Sik Kim KR, Isolator with capacitors and chip resistors located outside of the housing.
  • Morii Hiroshi (Kyoto JPX) Naito Yasuyuki (Kyoto JPX) Azumi Takeshi (Kyoto JPX) Sakabe Yukio (Kyoto JPX), LC composite component.
  • Sakamoto Yukio (Nagaokakyo JPX) Tanabe Takeshi (Nagaokakyo JPX) Fujiki Yasuo (Nagaokakyo JPX) Sakai Hiromichi (Nagaokakyo JPX) Tomono Kunisaburo (Nagaokakyo JPX) Murata Michihiro (Nagaokakyo JPX) Man, LC composite component.
  • Kinoshita Motohiro,JPX ; Kishishita Hiroyuki,JPX, LC composite component with variable capacitor and inductor.
  • Kitahara Naoto,JPX, LC composite part with no adverse magnetic field in the capacitor.
  • Naito Yasuyuki (Nagaokakyo JPX) Azumi Takeshi (Nagaokakyo JPX) Morii Horishi (Nagaokakyo JPX) Kohno Yoshiaki (Nagaokakyo JPX), LC filter.
  • Kawaguchi, Masahiko, LC filter device having magnetic resin encapsulating material.
  • Azumi Takeshi (Kyoto JPX) Morii HIroshi (Kyoto JPX) Naito Yasuyuki (Kyoto JPX) Sakabe Yukio (Kyoto JPX), LC filter structure.
  • Alexander Mostov IL, LC filter with suspended printed inductor and compensating interdigital capacitor.
  • Kato Noboru,JPX ; Tojyo Atsushi,JPX ; Nosaka Koji,JPX, LC resonant part with a via hole inductor directly connected to the ground electrode.
  • Takashi Yamamoto JP, Ladder filter comprising stacked piezoelectric resonators.
  • Frankeny Jerome Albert ; Frankeny Richard Francis ; Hayden Terry Frederick ; Imken Ronald Lann ; Rice Janet Louise, Laminar stackable circuit board structure with capacitor.
  • Kazuyoshi Honda JP; Noriyasu Echigo JP; Masaru Odagiri JP; Nobuki Sunagare JP; Shinichi Suzawa JP, Laminate and capacitor.
  • Mishiro Hidehiro,JPX ; Tsubone Kenichiro,JPX ; Abe Mitsunori,JPX ; Takada Rie,JPX, Laminate circuit board with selectable connections between wiring layers.
  • Myohga Osamu,JPX ; Yoshida Shiro,JPX ; Saito Mitsuo,JPX ; Shimada Yuzo,JPX ; Tohya Hirokazu,JPX ; Maniwa Ryo,JPX, Laminate printed circuit board with a magnetic layer.
  • Kuroda Yoichi,JPX ; Honda Yukio,JPX ; Osuga Kazumi,TWX, Laminated capacitor.
  • Horie Katsuyuki,JPX ; Tsuzuku Koichiro,JPX, Laminated capacitor and trimming method thereof.
  • Sakamoto Yukio (Fukui JPX), Laminated capacitor of feed-through type.
  • Oida Toshifumi,JPX, Laminated ceramic electronic component with a quadrangular inner conductor and a method for manufacturing the same.
  • Kresge John S. (Binghamton NY) Light David N. (Friendsville PA) Wu Tien Y. (Endwell NY), Laminated electronic package including a power/ground assembly.
  • Takahashi Tetsuo (248-5 ; Shiogoshi ; Kisagata-cho 4-chome Yurigun ; Akita-ken JPX) Takaya Minoru (13-2 ; Onitaka 3-chome Ichikawa-shi ; Chiba-ken JPX), Laminated electronic parts and process for making the same.
  • Shigemura Hiroshi,JPX, Laminated filter.
  • Okubo Akira (Nagaokakyo JPX), Laminated inductor array comprising a crosstalk inhibiting layer.
  • Pai Deepak K. ; Denny Ronald R. ; Chevalier Jeanne M. ; Schwartz ; III George F. ; Webster Clark F. ; Lufkin Robert M. ; Krinke Terrance A., Laminated multilayer substrates.
  • Ishizaki, Toshio; Awai, Ikuo; Miyake, Hideyuki; Kitazawa, Shoichi; Yamada, Toru, Laminated notch filter and cellular phone using the same.
  • Okamura Hisatake,JPX, Laminated resonator and laminated band pass filter using same.
  • Taira Hiroaki (Kyoto JPX) Nakamura Kazutaka (Kyoto JPX) Yoneda Yasunobu (Kyoto JPX) Sakabe Yukio (Kyoto JPX) Shimahara Yutaka (Kyoto JPX), Laminated varistor.
  • Hadano Kenjiro,JPX ; Kawada Tsuyoshi,JPX ; Fukutani Iwao,JPX ; Nakamura Kazutaka,JPX ; Kaneko Kuzuhiro,JPX ; Urahara Ryouichi,JPX, Laminated-type varistor.
  • Honda, Kazuyoshi; Echigo, Noriyasu; Odagiri, Masaru; Sunagare, Nobuki; Suzawa, Shinichi, Layered product and capacitor.
  • Honda, Kazuyoshi; Echigo, Noriyasu; Odagiri, Masaru; Sunagare, Nobuki; Suzawa, Shinichi, Layered product and capacitor.
  • Honda, Kazuyoshi; Echigo, Noriyasu; Odagiri, Masaru; Sunagare, Nobuki; Suzawa, Shinichi, Layered product and capacitor.
  • Honda, Kazuyoshi; Echigo, Noriyasu; Odagiri, Masaru; Sunagare, Nobuki; Suzawa, Shinichi, Layered product and capacitor.
  • Templeton ; Jr. Thomas H. (Fremont CA) Wyland Christopher P. (Campbell CA) Campbell David L. (Sunnyvale CA), Leadframe with power and ground planes.
  • Gilbert, Barry K.; Schwab, Daniel J., Leadless chip carrier apparatus providing an improved transmission line environment and improved heat dissipation.
  • Gilbert, Barry K.; Schwab, Daniel J., Leadless chip carrier apparatus providing for a transmission line environment and improved heat dissipation.
  • Neuman, Werner E.; Head, Michael B.; Kummel, Marshall L., Leadless filter.
  • Miles Barry M. (Plantation FL) Juskey Frank J. (Coral Springs FL) Banerji Kingshuk (Plantation FL), Leadless integrated circuit package.
  • Kuth Rainer,DEX, Line coupling assembly guiding electrical signals into a high-frequency shielded area.
  • Baumbach Bertram W. (Franklin Park IL), Line protector for a communications circuit.
  • Brownell Kenneth W. (Marion NC) Vaden Sterling A. (Marion NC), Low cross talk electrical connector system.
  • Fung Laurie P., Low inductance decoupling capacitor arrangement.
  • Herrell, Dennis J.; Dolbear, Thomas P., Low inductance power distribution system for an integrated circuit chip.
  • Carlson, Richard O.; Glascock, II, Homer H.; Loughran, James A.; Webster, Harold F., Low loss, multilevel silicon circuit board.
  • Kershaw ; Jr. Stanley S. (Portville NY) Goedde Gary L. (Racine WI) Schettler Robert N. (Olean NY), Low voltage, high energy surge arrester for secondary applications.
  • Yutaka Akiba JP; Yasunori Narizuka JP; Hirayoshi Tanei JP; Naoya Kitamura JP, Low-EMI electronic apparatus, low-EMI circuit board, and method of manufacturing the low-EMI circuit board..
  • Rainal Attilio Joseph, Low-crosstalk modular electrical connector assembly.
  • Schaper Leonard W. (West Orange NJ), Low-inductance power/ground distribution in a package for a semiconductor chip.
  • Furutani Koji (Nagaokakyo JPX) Kato Mitsuhide (Nagaokakyo JPX) Tsuru Teruhisa (Nagaokakyo JPX), Low-pass filter.
  • Ulmer Richard W. (Austin TX), MOS current limiting output circuit.
  • Hitoyoshi Kurata JP, Magnetostatic wave device.
  • Anthony, Anthony A.; Anthony, William M., Manufacture including shield structure.
  • Herbert Edward (Canton CT) Repp John D. (Barkhamsted CT), Matrix capacitor.
  • Van Konynenburg Richard A. ; Farmer Joseph C., Means for limiting and ameliorating electrode shorting.
  • Frech Roland,DEX ; Garben Bernd,DEX ; Harrer Hubert,DEX ; Klink Erich,DEX, Mesh planes for multilayer module.
  • Lavene Bernard (Ocean NJ), Metallized capacitor having increased dielectric breakdown voltage and method for making the same.
  • Schelhorn Robert L. (Vincentown NJ), Metallized ceramic circuit package.
  • Wink Reinhold (Schlitz DEX) Gruner Mathias (Schlitz DEX), Metallized wound-dielectricalization condenser X-Y multiple capacitances.
  • Metsler Alexander (Newton MA), Method and apparatus for a PCB and I/O integrated electromagnetic containment.
  • Brown, Karl, Method and apparatus for conditioning an electrostatic chuck.
  • Wieloch Christopher J. ; Benard David J. ; Hildebrandt Gernot ; Nolden Paul T., Method and apparatus for interrupting a current carrying path in a multiphase circuit.
  • Gilby Anthony C. (Foxboro MA) Ihnat Dale E. (Woonsocket RI), Method and apparatus for sensing a measurand.
  • Jay D. Brussels, Method and apparatus of EMI filtering that eliminates the need for an inductor.
  • Coccioli, Roberto, Method and system for broadband transition from IC package to motherboard.
  • Novak Istvan ; Yip Wai-Yeung, Method for edge termination of parallel conductive planes including estimating the characteristic impedance of the structure.
  • Florjancic Matjaz (Murr DEX) Richter Horst (Boblingen DEX) Smernos Stauros (Stuttgart DEX) Reiner Hans (Gerlingen DEX), Method for fabricating a fully shielded signal line.
  • Varker Kenneth James (Binghamton NY), Method for forming a multilayer printed circuit board.
  • Call Anson J. (Holmes NY) Meisner Stephen H. (Hudson NY) Pompeo Frank L. (Walden NY) Zitz Jeffrey A. (Poughkeepsie NY), Method for forming chip carrier with a single protective encapsulant.
  • Berg Howard M. ; Ganesan Sankaranarayanan ; Lewis Gary L. ; Hawkins George W. ; Sloan James W. ; Bolton Scott C., Method for making a moisture resistant semiconductor device having an organic substrate.
  • Anthony, Anthony A.; Anthony, William M., Method for making arrangement for energy conditioning.
  • Dalal Hormazdyar M. (Milton NY) Fallon Kenneth M. (Vestal NY) Gaudenzi Gene J. (Purdys NY), Method for making direct chip attach circuit card.
  • Farooq Mukta S. ; Hamel Harvey C. ; Rita Robert A. ; Stoller Herbert I., Method for making high k dielectric material with low k dielectric sheathed signal vias.
  • Anthony, William M.; Anthony, David; Anthony, Anthony, Method for making internally overlapped conditioners.
  • Lavene Bernard (Ocean NJ), Method for making metallized capacitor having increased dielectric breakdown voltage.
  • Stynes ; James A., Method for producing capacitors and ceramic body therefore.
  • Sasaki Tsutomu,JPX ; Ogura Taketsugu,JPX, Method for producing conductive composition and conductive composition.
  • Hanson David A., Method for reducing via inductance in an electronic assembly and article.
  • Gardiner Samuel W. (170 La Cuesta San Rafael CA 94904), Method for utilizing angular momentum in energy conversion devices and an apparatus therefore.
  • Maroni Victor A. (Naperville IL), Method of bonding metals to ceramics.
  • Ying W. Hsu, Method of canceling quadrature error in an angular rate sensor.
  • Dutta Vivek B. (Cupertino CA) Demmin Jeffrey C. (Mt. View CA) Diorio Mark L. (Cupertino CA) Ewanich Jon T. (Cupertino CA), Method of connecting an IC component with another electrical component.
  • Booth Richard B. (Wappingers Falls NY) Gephard Robert H. (Poughkeepsie NY) Gremban Bradley S. (Lake Katrine NY) Poetzinger Janet E. (Rochester MN) Shen David T. (Poughkeepsie NY), Method of fabricating a multi-layer integrated circuit chip interposer.
  • Pravin K. Narwankar ; Annabel Nickles ; Xiaoliang Jin ; Deepak Upadhyaya ; Yaxin Wang, Method of forming metal electrodes.
  • Boyle Steven R. (Santa Clara CA) Proebsting Robert J. (Los Altos Hills CA) Herndon William H. (Sunnyvale CA), Method of making a multi-layer to package.
  • Takaya Minoru (Chiba JPX) Mochizuki Yoshinori (Chiba JPX), Method of making a multilayer hybrid circuit.
  • Venaleck John T. (Madison OH), Method of making an electrical connector.
  • Batliwalla Neville S. (Foster City CA) Dharia Amitkumar N. (Newark CA) Feldman Randall M. (Redwood City CA) Mehan Ashok K. (Union City CA), Method of making an electrical device comprising a conductive polymer.
  • Goetz Martin (San Diego CA) Babiarz Joseph (San Diego CA), Method of making ceramic microwave electronic package.
  • Jennings Thomas A. (518A Oak Summit Apts. Glenside PA 19038), Method of making multiple electrical components in integrated microminiature form.
  • Ashe, James; Phillips, Christopher David; Temple, Stephen, Method of manufacturing a droplet deposition apparatus.
  • Ogawa Mamoru,JPX ; Yoshikawa Takashi,JPX, Method of manufacturing a multilayer capacitor.
  • Nellissen Antonius J. M.,NLX ; van Grunsven Erik C. E.,NLX, Method of manufacturing a plurality of electronic components.
  • Murata Michihiro (Nagaokakyo JPX) Mandai Harufumi (Nagaokakyo JPX) Naito Yasuyuki (Nagaokakyo JPX), Method of manufacturing an LC composite component.
  • Naito Yasuyuki (Nagaokakyo JPX) Doi Tetsuya (Nagaokakyo JPX) Hasegawa Yoshiki (Nagaokakyo JPX) Morimoto Tadashi (Nagaokakyo JPX) Tanaka Yukio (Nagaokakyo JPX), Method of manufacturing multilayer ceramic electronic component.
  • Katsuhiro Ikada JP; Kenji Sakaguchi JP; Miki Takamiya JP, Method of manufacturing surface acoustic wave apparatus.
  • Kano Osamu (Nagaokakyo JPX) Senda Atsuo (Nagaokakyo JPX), Method of metallizing ceramic material.
  • Agatstein Willy (El Dorado Hills CA) Aghazadeh Mostafa (Chandler AZ) Chiu Chia-pin (Phoenix AZ) Ghori Amar (El Dorada Hills CA) Neal James R. (Cameron Park CA) Turturio Gregory (Chandler AZ), Method of optimizing operating parameters of an integrated circuit package having a voltage regulator mounted thereon.
  • Wolfgang Pahl DE; Alois Stelzl DE; Hans Kruger DE, Method of producing a surface acoustic wave component.
  • Chobot Ivan I. (Whitby NY CAX) Covert John A. (Binghamton NY) Haight Randy L. (Waverly NY) Mansfield Keith D. (New Milford PA) Miller Donald W. (Newark Valley NY) Neira Reinaldo A. (Endicott NY) Petr, Methods of forming electronic multi-layer printed circuit boards and/or cards and electronic packages including said boa.
  • Koh, Gwan-byeob; Kim, Ki-nam, Methods of forming integrated circuits using masks to provide ion implantation shielding to portions of a substrate adjacent to an isolation region therein.
  • John W. Smith, Microelectronic connections with liquid conductive elements.
  • Paustian Philip J. (Panama City FL), Microwave facilitated atmospheric energy projection system.
  • Rowe David A. (Redondo Beach CA) Lao Binneg Y. (Rancho Palos Verdes CA) Dietterle Robert E. (Fullerton CA), Microwave multiport multilayered integrated circuit chip carrier.
  • Takahashi Kazuaki,JPX ; Sangawa Ushio,JPX, Millimeter wave module and radio apparatus.
  • Ziegner Bernhard Alphonso ; Sletten Robert John ; Jain Nitin ; Brown Steve Robert, Millimeter wave module with an interconnect from an interior cavity.
  • DeMore Walter R. ; Holloway Richard A. ; Holmes Bruce A. ; Johnson Benjamin T. ; Londre Dale A. ; Nakamura Lloyd Y., Millimeter wave multilayer assembly.
  • Monsorno, Richard V.; Insetta, Victor, Miniature monolithic multilayered capacitors and method for trimming.
  • Lau James Ching Sik,HKX, Miniature motor.
  • Retseptor Gennady,ILX, Miniature surface mount capacitor and method of making same.
  • Nguyen Hung Thai (Harrisburg PA), Modular connector assembly having removable contacts.
  • Noguchi Kathuhiko,JPX ; Miyashita Masashi,JPX ; Murano Yosio,JPX, Modular surface mount circuit device and a manufacturing method thereof.
  • Brandelik, Alexander; Hubner, Christof, Moisture sensor for layers.
  • Hernandez Jorge M. (Mesa AZ), Molded integrated circuit package incorporating decoupling capacitor.
  • Hernandez Jorge M. (Mesa AZ), Molded integrated circuit package incorporating thin decoupling capacitor.
  • Provost George A. ; Dowd Clinton ; Van Stumpf James ; Lacey Thomas G. ; Condon Mark Joseph ; Pollard Samuel White ; Jens Stephen C. ; Grulke Peter E., Molding methods, molds and products.
  • Kuroda Yoichi,JPX ; Taniguchi Masaaki,JPX ; Naito Yasuyuki,JPX ; Kondo Takanori,JPX, Monolithic capacitor.
  • Naito Yasuyuki,JPX ; Kuroda Yoichi,JPX ; Taniguchi Masaaki,JPX ; Hori Haruo,JPX ; Kondo Takanori,JPX, Monolithic capacitor.
  • Petrinec John (Valencia CA), Monolithic capacitor with variable capacitance.
  • Kazuhiro Yoshida JP; Shigeki Nishiyama JP; Nobushige Moriwaki JP; Takeshi Azumi JP; Yasuhiko Kubota JP; Yoshihiro Omura JP; Kazuyuki Kubota JP, Monolithic ceramic electronic component.
  • DeVoe Alan D. (Cambridge MA) DeVoe Daniel F. (Coronado CA), Monolithic multiple capacitor.
  • Nakamura Kazutaka (Nagaokakyo JPX) Taira Hiroaki (Nagaokakyo JPX) Higashi Tohru (Nagaokakyo JPX) Nakayama Akinori (Nagaokakyo JPX) Yoneda Yasunobu (Nagaokakyo JPX) Sakabe Yukio (Nagaokakyo JPX), Monolithic type varistor.
  • Nakamura Kazutaka,JPX ; Kaneko Kazuhiro,JPX ; Kawada Tsuyoshi,JPX ; Hadano Kenjiro,JPX, Monolithic varistor.
  • Person, Herman R.; Veik, Thomas L., Monolythic surge suppressor.
  • Mehta Mahendra C. (Palm Beach Gardens FL), Mounting of semiconductor chips on a plastic substrate.
  • Bissey Lucien J., Multi-capacitance lead frame decoupling device.
  • Liu Zhenyn Lawrence, Multi-capacitor device.
  • Palmer Edward G. ; Newton Charles M., Multi-chip module having an integral capacitor element.
  • Rostoker Michael D. (San Jose CA), Multi-chip semiconductor arrangements using flip chip dies.
  • Wilhelm Timothy J. (Peoria AZ), Multi-coplanar capacitor for electrical connector.
  • Anthony A. Anthony, Multi-functional energy conditioner.
  • Anthony, Anthony A.; Anthony, William M., Multi-functional energy conditioner.
  • Anthony, Anthony; Anthony, William M., Multi-functional energy conditioner.
  • Anthony,Anthony A.; Anthony,William M., Multi-functional energy conditioner.
  • Sogabe Tomohiro,JPX ; Enokido Yasushi,JPX, Multi-functional multilayer device and method for making.
  • Bhansali Ameet ; Zhu Qing, Multi-layer C4 flip-chip substrate.
  • Yasuyuki Naito JP; Masaaki Taniguchi JP; Yoichi Kuroda JP; Haruo Hori JP; Takanori Kondo JP, Multi-layer capacitator, wiring substrate, decoupling circuit, and high-frequency circuit.
  • Kuroda Yoichi,JPX ; Taniguchi Masaaki,JPX ; Naito Yasuyuki,JPX ; Hori Haruo,JPX ; Kondo Takanori,JPX ; Murata Michihiro,JPX, Multi-layer capacitor, wiring board, and high-frequency circuit.
  • Kuroda, Yoichi; Taniguchi, Masaaki; Naito, Yasuyuki; Hori, Haruo; Kondo, Takanori, Multi-layer capacitor, wiring board, and high-frequency circuit.
  • Kuroda, Yoichi; Taniguchi, Masaaki; Naito, Yasuyuki; Hori, Haruo; Kondo, Takanori, Multi-layer capacitor, wiring board, and high-frequency circuit.
  • Yoichi Kuroda JP; Masaaki Taniguchi JP; Yasuyuki Naito JP; Haruo Hori JP; Takanori Kondo JP, Multi-layer capacitor, wiring board, and high-frequency circuit.
  • Yoichi Kuroda JP; Masaaki Taniguchi JP; Yasuyuki Naito JP; Haruo Hori JP; Takanori Kondo JP, Multi-layer capacitor, wiring substrate, decoupling circuit, and high-frequency circuit.
  • Tanaka, Yukio; Chigodo, Yoshikazu, Multi-layer ceramic capacitor.
  • Blasi Charles J. ; Das Gobinda ; Motika Franco, Multi-layer ceramic substrate decoupling.
  • Baran Jozef B. (Moreno Valley CA), Multi-layer circuit board that suppresses radio frequency interference from high frequency signals.
  • Tanahashi Shigeo,JPX, Multi-layer circuit substrate having orthogonal grid ground and power planes.
  • Stave Eric J., Multi-layer lead frame for a semiconductor device.
  • Krumm Horst (Steinenbronn DEX) Schettler Helmut (Dettenhausen DEX) Stahl Rainer (Schoenaich DEX) Zhlke Rainer (Leonberg DEX), Multi-layer module with constant characteristic impedance.
  • Utsumi Kazuaki,JPX ; Yoshida Shiro,JPX ; Saitou Mitsuo,JPX, Multi-layer printed board with an inductor providing a high impedance at high frequency.
  • Miyagi Takeshi (Fujisawa JPX) Matsumoto Kazuhiro (Yokohama JPX) Sasaki Tomiya (Yokohama JPX) Iwasaki Hideo (Kawasaki JPX) Hisano Katsumi (Yokohama JPX), Multi-layer substrate.
  • Kabumoto, Masanao; Kawabata, Kouki, Multi-layer wiring board.
  • Yamaguchi, Naoto, Multi-layered LC composite with a connecting pattern capacitively coupling inductors to ground.
  • Boyle Steven R. (Santa Clara CA) Proebsting Robert J. (Los Altos Hills CA) Herndon William H. (Sunnyvale CA), Multi-layered integrated circuit package with improved high frequency performance.
  • Mullen Urban E. (4014 Cody Rd. Sherman Oaks CA 91403), Multi-layered printed circuit board with transmission line capabilities.
  • Tohya Hirokazu,JPX ; Yoshida Shiro,JPX, Multi-layered printed wiring board.
  • Horiuchi, Michio; Kurihara, Takashi; Mizuno, Shigeru, Multi-layered semiconductor device and method for producing the same.
  • Chen-Wen Tsai TW; Chung-Ju Wu TW; Wei-Feng Lin TW, Multi-layered substrate with a built-in capacitor design.
  • Huang Chin-Ching (San Jose CA) Lee Sang S. (Sunnyvale CA) Rao Ramachandra A. (Pleasanton CA) Forcier ; Jr. Fernand N. (San Jose CA), Multi-layered, integrated circuit package having reduced parasitic noise characteristics.
  • Huang Chin-Ching (San Jose CA) Lee Sang S. (Sunnyvale CA) Rao Ramachandra A. (Pleasanton CA) Forcier ; Jr. Fernand N. (San Jose CA), Multi-layered, integrated circuit package having reduced parasitic noise characteristics.
  • Ashman John J. ; Williams Brian J., Multifunction connector assembly.
  • Yasuyuki Naito JP; Masaaki Taniguchi JP; Yoichi Kuroda JP; Takanori Kondo JP, Multilayer Capacitor.
  • Nogi Kenichiro,JPX, Multilayer LC complex component.
  • Lin Jun-Nun (Taichung Hsien TWX) Kao Chio-Chun (Hsinchu TWX), Multilayer ZnO varistor.
  • Katho Noboru (Nagaokakyo JPX) Nogome Emiko (Nagaokakyo JPX), Multilayer capacitor.
  • Kato Noboru (Nagaokakyo JPX) Nogome Emiko (Nagaokakyo JPX), Multilayer capacitor.
  • Naito Yasuyuki,JPX ; Taniguchi Masaaki,JPX ; Kuroda Yoichi,JPX ; Kondo Takanori,JPX, Multilayer capacitor.
  • Naito Yasuyuki,JPX ; Taniguchi Masaaki,JPX ; Kuroda Yoichi,JPX ; Kondo Takanori,JPX, Multilayer capacitor.
  • Naito Yasuyuki,JPX ; Taniguchi Masaaki,JPX ; Kuroda Yoichi,JPX ; Kondo Takanori,JPX, Multilayer capacitor.
  • Naito Yasuyuki,JPX ; Taniguchi Masaaki,JPX ; Kuroda Yoichi,JPX ; Kondo Takanori,JPX, Multilayer capacitor.
  • Naito Yasuyuki,JPX ; Taniguchi Masaaki,JPX ; Kuroda Yoichi,JPX ; Kondo Takanori,JPX, Multilayer capacitor.
  • Naito Yasuyuki,JPX ; Taniguchi Masaaki,JPX ; Kuroda Yoichi,JPX ; Kondo Takanori,JPX ; Murata Michihiro,JPX ; Tanino Yoshitaka,JPX, Multilayer capacitor.
  • Naito Yasuyuki,JPX ; Taniguchi Masaaki,JPX ; Kuroda Yoichi,JPX ; Kondo Takanori,JPX ; Murata Michihiro,JPX ; Tanino Yoshitaka,JPX, Multilayer capacitor.
  • Naito Yasuyuki,JPX ; Taniguchi Masaaki,JPX ; Kuroda Yoiohi,JPX ; Kondo Takanori,JPX ; Murata Michihiro,JPX ; Tanino Yoshitaka,JPX, Multilayer capacitor.
  • Naito, Yasuyuki; Taniguchi, Masaaki; Kuroda, Yoichi; Kondo, Takanori, Multilayer capacitor.
  • Yamada Hideshi (Nagaokakyo JPX) Kato Noboru (Nagaokakyo JPX), Multilayer capacitor.
  • Yamada Kenichi (Nagaokakyo JPX) Tachi Kunio (Nagaokakyo JPX), Multilayer capacitor.
  • Yasuyuki Naito JP; Masaaki Taniguchi JP; Yoichi Kuroda JP; Takanori Kondo JP, Multilayer capacitor.
  • Yasuyuki Naito JP; Masaaki Taniguchi JP; Yoichi Kuroda JP; Takanori Kondo JP, Multilayer capacitor.
  • Yasuyuki Naito JP; Masaaki Taniguchi JP; Yoichi Kuroda JP; Takanori Kondo JP, Multilayer capacitor.
  • Kaneko Toshimi (Nagaokakyo JPX) Yamamoto Hidetoshi (Nagaokakyo JPX) Sakai Hiromichi (Nagaokakyo JPX), Multilayer capacitor device.
  • Hernandez Jorge M. (Mesa AZ) Gilderdale Aleta (Chandler AZ), Multilayer capacitor elements.
  • Ngo Khai D. T. (Gainesville FL), Multilayer capacitor suitable for substrate integration and multimegahertz filtering.
  • Kuroda Yoichi,JPX ; Naito Yasuyuki,JPX ; Hori Haruo,JPX ; Kondo Takanori,JPX ; Asakura Kyoshin,JPX, Multilayer capacitor, electronic device and high frequency circuit using the same.
  • Naito, Yasuyuki; Taniguchi, Masaaki; Kuroda, Yoichi; Hori, Haruo; Figueroa, David G.; Rodriguez, Jorge P.; Watts, Nicholas R.; Holmberg, Nicholas L.; Hioki, Takashi, Multilayer capacitor, wiring board, decoupling circuit, and high frequency circuit incorporating the same.
  • Ritter Andrew P. ; Galvagni John L., Multilayer ceramic RC device.
  • Inomata Yasuyuki,JPX ; Okino Yoshikazu,JPX, Multilayer ceramic capacitor.
  • Suzuki Takashi,JPX ; Abe Satoru,JPX, Multilayer ceramic capacitor.
  • Ahiko Taisuke,JPX ; Togashi Masaaki,JPX, Multilayer ceramic capacitor for three-dimensional mounting.
  • Ingleson Howard G. (Grange-Over-Sands GB2) Pugh Pamela H. (Ulverston GB2), Multilayer discoidal capacitors.
  • Kubota Kenji (Nagaokakyo JPX) Sakai Norio (Nagaokakyo JPX) Kawabata Shoichi (Nagaokakyo JPX), Multilayer electronic component.
  • Togashi, Masaaki, Multilayer feedthrough capacitor.
  • Yamate Kazunori,JPX ; Watanabe Chikara,JPX, Multilayer feedthrough capacitor.
  • Murata, Satoru; Mihara, Hideyuki; Yamamoto, Etsuji; Nishinaga, Yoshihiro; Tamada, Minoru, Multilayer inductor.
  • Estes John C. ; Kommrusch Richard ; Huang Rong Fong, Multilayer lowpass filter with single point ground plane configuration.
  • Hirano Naohiko (Yokohama JPX), Multilayer package.
  • Nakao Tomoyuki,JPX ; Yamaguchi Shinya,JPX ; Mukai Makoto,JPX ; Ohtsu Shinichi,JPX, Multilayer printed board.
  • Itoh Takumi,JPX, Multilayer printed circuit board and high-frequency circuit device using the same.
  • Ohki Nobuaki (Hadano JPX) Sengoku Norio (Hadano JPX) Kobayashi Fumiyuki (Sagamihara JPX), Multilayer printed circuit board and method of producing the same.
  • Chen Paul T. H. (St. Paul MN), Multilayer printed circuit board with domain partitioning.
  • Hernandez Jorge M. (Mesa AZ), Multilayer printed wiring board.
  • Hernandez Jorge M. (Mesa AZ), Multilayer printed wiring board.
  • Iwane Yasushi,JPX, Multilayer printed wiring board with plurality of ground layers forming separate ground planes.
  • Fujishiro Yoshikazu (Akita-ken JPX) Ishigaki Takaya (Akita-ken JPX) Harada Hiraku (Yamagata-ken JPX), Multilayer through type capacitor array.
  • Hirano Naohiko (Kawasaki JPX), Multilayer wiring structure for attaining high-speed signal propagation.
  • White Curtis B. (Rockford IL), Multilayered distributed filter.
  • Kraus Charles J. (Poughkeepsie NY) Stoller Herbert I. (Wappingers Falls NY) Wu Leon L. (Hopewell Junction NY), Multilayered interposer board for powering high current chip modules.
  • Barrow, Michael, Multilayered printed circuit board with controlled 100 ohm impedance.
  • Viola Raymond D. (Oyster Bay NY) Hanley Gerard L. (Melville NY), Multilevel stripline transition.
  • Frederick W. Richard (Mundelein IL), Multiple function integrated capacitor.
  • Marx Dieter O. (Kanata CAX) Wong Larry K. (Kanata CAX), Multiple layer printed circuit board.
  • Sprietsma John T. ; Joy Steve ; Scheyer-Furnanz Julie, Multiple layer printed circuit board having power planes on outer layers.
  • Bajorek Christopher H. (Goldens Bridge NY) Chance Dudley A. (Danbury CT) Ho Chung W. (Chappaqua NY) Thompson David A. (South Salem NY), Multiple layer, ceramic carrier for high switching speed VLSI chips.
  • Figueroa, David G.; Chakravorty, Kishore K.; Do, Huong T.; Mosley, Larry Eugene; Rodriguez, Jorge Pedro; Brown, Ken, Multiple tier array capacitor.
  • Shinada Eiichi,JPX ; Arike Shigeharu,JPX ; Suzuki Takayuki,JPX ; Tsuru Yoshiyuki,JPX, Multiple wire printed circuit board and process for making the same.
  • Taisuke Ahiko JP; Masaaki Togashi JP, Multiterminal-multilayer ceramic capacitor.
  • Hunt Andrew T. ; Lin Wen-Yi ; Carpenter Richard W., Nanolaminated thin film circuitry materials.
  • Chaturvedi Rahul ; Kommrusch Richard, Narrow-band overcoupled directional coupler in multilayer package.
  • Cooper John H. (Murrysville PA) Fugate David W. (Cabot PA) Dietrich Fred M. (Saxonburg PA), Net current control device.
  • Okubo Akira (Takefu JPX), Noise filter.
  • Saito Yasuaki (Kyoto JPX), Noise filter.
  • Sakamoto Yukio (Fukui JPX), Noise filter.
  • Sakamoto Yukio (Kyoto JPX) Kaneko Toshimi (Kyoto JPX), Noise filter.
  • Hino Akira,JPX, Noise suppressing apparatus.
  • Meyer Dennis R. (17830 2nd. Ave. Plymouth MN 55447), Noise suppressor.
  • Mandai Haruhumi (Osaka JPX) Nakamura Kazutaka (Kyoto JPX) Naito Yasuyuki (Kyoto JPX) Iwai Kiyoshi (Kyoto JPX), Non-linear electrical resistor having varistor characteristics.
  • Hudis Martin ; Hutchinson Robert,GBX ; Marincic Nikola ; Arora Mulk, Non-symmetric capacitor.
  • Takekazu Okada JP; Toshihiro Makino JP; Akihito Masuda JP; Takashi Kawanami JP, Nonreciprocal circuit device.
  • Anthony, Jr., Anthony A.; Anthony, William M., Offset pathway arrangements for energy conditioning.
  • Watanabe, Kenichi, Optical disk apparatus.
  • Forehand Douglas W. ; Lamoreaux Ray, Optimized routing scheme for an integrated circuit/printed circuit board.
  • Brandt Randy L. (Orange CA), Orthogonal-field electrically variable magnetic device.
  • Anthony, Anthony A.; Anthony, William M.; Muccioli, James P., PREDETERMINED SYMMETRICALLY BALANCED AMALGAM WITH COMPLEMENTARY PAIRED PORTIONS COMPRISING SHIELDING ELECTRODES AND SHIELDED ELECTRODES AND OTHER PREDETERMINED ELEMENT PORTIONS FOR SYMMETRICALLY BALA.
  • Anthony,Anthony A.; Anthony,William M.; Muccioli,James P., PREDETERMINED SYMMETRICALLY BALANCED AMALGAM WITH COMPLEMENTARY PAIRED PORTIONS COMPRISING SHIELDING ELECTRODES AND SHIELDED ELECTRODES AND OTHER PREDETERMINED ELEMENT PORTIONS FOR SYMMETRICALLY BALA.
  • Jacobs Stephen M. (Cupertino CA) McTavish Mary S. (Fremont CA) Doljack Frank A. (Pleasanton CA), PTC conductive polymer compositions.
  • Hansson Tomas (Enkping SEX) Karlstrm Per-Olof (Vsters SEX), PTC element.
  • Bechtel Richard L. (Sunnyvale CA) Thomas Mammen (San Jose CA) Hively James W. (Sunnyvale CA), Package for an integrated circuit structure.
  • Katoh Takayuki (Itami JPX), Package for microwave integrated circuit.
  • Dehaine Gerard (Chatillon FRX) Kurzweil Karel (Saint-Nom-La-Breteche FRX), Package for very large scale integrated circuit.
  • Nishiuma Masahiko (Fussa JPX) Kamada Chiyoshi (Kokubunji JPX), Package having a structure for stabilizing and/or impedance-matching a semiconductor IC device accommodated therein.
  • Herbert Edward (1 Dyer Cemetery Rd. Canton CT 06019-2029), Packaging for electronic circuits using a capacitor as a structural member.
  • Anthony Anthony A., Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode fi.
  • Anthony A. Anthony, Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package.
  • Anthony Anthony A., Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package.
  • Anthony Anthony A., Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package.
  • Anthony Anthony A., Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package.
  • Anthony, Anthony A., Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package.
  • Anthony, Anthony A., Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package.
  • Anthony, Anthony A., Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package.
  • Anthony,Anthony A., Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package.
  • Renken Gerald W. (Edina MN) Gray Kimberly J. (Lakeville MN) Greenwood Michael W. (Maplegrove MN), Parallel planar signal transmission system.
  • Booth Richard B. (Wappingers Falls NY) Gephard Robert H. (Poughkeepsie NY) Gremban Bradley S. (Lake Katrine NY) Poetzinger Janet E. (Rochester MN) Shen David T. (Poughkeepsie NY), Parallel process interposer (PPI).
  • Anthony, William M.; Anthony, Anthony A., Passive electrostatic shielding structure for electrical circuitry and energy conditioning with outer partial shielded energy pathways.
  • Tafjord Kjartan (Huddinge SEX), Passive filter compensation network.
  • Stone David B. (Owego NY), Passive interposer including at least one passive electronic component.
  • Stone David Brian, Passive interposer including at least one passive electronic component.
  • Standler Ronald B. (Albuquerque NM), Passive overvoltage protection devices, especially for protection of computer equipment connected to data lines.
  • Anthony, Jr.,Anthony A.; Anthony,William M., Pathway arrangement.
  • Ansell Daniel F. (Coral Springs FL) Benck Jeffrey W. (Delray Beach FL) Bocchino Thomas A. (Boynton Beach FL) Deiso James W. (Boynton Beach FL) Richards Jose E. (Deerfield Beach FL) Shipley Mark L. (L, Personal computer with shielding of input/output signals.
  • Herbert Edward (Canton CT) Cebry Stephen E. (Burlington CT), Picture frame matrix transformer.
  • Kornrumpf William P. (Albany NY) Harnden ; Jr. John D. (Schenectady NY), Piezoelectic relay module to be utilized in an appliance or the like.
  • Chen Kouth,TWX ; Tzuang Ching-Kuang C.,TWX, Planar comb(-)line filters with minimum adjacent capacitive(-) coupling effect.
  • Brooks John,CAX, Planar-tubular composite capacitor array and electrical connector.
  • Sawada, Hirokazu; Hotta, Hisashi; Uesugi, Akio; Sasaki, Hirokazu; Endo, Tadashi, Planographic printing plate.
  • Anthony A. Anthony, Polymer fuse and filter apparatus.
  • Anthony Anthony A., Polymer fuse and filter apparatus.
  • Anthony Anthony A., Polymer fuse and filter apparatus.
  • Anthony, Anthony A., Polymer fuse and filter apparatus.
  • Anthony, Anthony A., Polymer fuse and filter apparatus.
  • Bhattacharyya Bidyut K. (Chandler AZ) Wilson J. D. (Phoenix AZ), Power distribution lid for IC package.
  • Okochi Sadao (Fussa JPX) Takoda Terutaka (Ome JPX), Power line filter.
  • Anthony Anthony A. (2308 Hampton Rd. Erie PA 16502), Power line filter and surge protection circuit components and circuits.
  • Warren George H. (Newport News VA), Power line filter for transient and continuous noise suppression.
  • ta Huang Kwang (Ventura CA) Milner Brian R. (Camarillo CA), Power line transient suppressors.
  • Speet Larry A. (Holland MI) Rentz Bruce A. (Kentwood MI), Power receptacle and associated filter.
  • Speet Larry A. (Holland MI) Rentz Bruce A. (Belmont MI) Wienczkowski Jan G. (Kentwood MI), Power receptacle and nested line conditioner arrangement.
  • Bhansali Ameet, Power-ground plane for a C4 flip-chip substrate.
  • Stachejko Vitaly (Willingboro NJ), Precision microwave delay circuit and method.
  • Meyer James A. (Campbell CA) Mikalauskas Frank (San Jose CA) Parks Howard L. (Los Gatos CA), Pressurized interconnection system for semiconductor chips.
  • Steigerwald Todd W. ; Jones Leroy, Printed circuit board (PCB) including channeled capacitive plane structure.
  • Miller Kevin L. (Austin TX) McMahan Robert L. (Cedar Park TX) Steigerwald Todd W. (Austin TX), Printed circuit board EMI shielding apparatus and associated methods.
  • Appelt Bernd K. ; Lauffer John M., Printed circuit board capacitor structure and method.
  • Belau, Horst; Held, Joachim; Meyer, Wolfram; Reindl, Hartwig, Printed circuit board configuration with a multipole plug-in connector.
  • Hatta Hironobu (Okazaki JPX), Printed circuit board for reducing noise.
  • Paurus Floyd G. (Boulder CO) Smith Archibald W. (Boulder CO) Szerlip Stanley R. (Longmont CO), Printed circuit board having an integrated decoupling capacitive element.
  • Ha Sun Ho,KRX ; Heo Young Wook,KRX, Printed circuit board having epoxy barrier around a throughout slot and ball grid array semiconductor package.
  • Lockwood John J. ; Pavlu ; III Edward J., Printed circuit board including a terminated power plane and method of manufacturing the same.
  • Colburn Richard H. (28341 Nicholas Cir. Saugus CA 91350) Hosmer Donald F. (75147 LaCresta Dr. Palm Desert CA 92211), Printed circuit board mount electro-magnetic interference suppressor.
  • Harada Takashi,JPX ; Sasaki Hideki,JPX, Printed circuit board with capacitors connected between ground layer and power layer patterns.
  • Lauffer John M. (Waverly NY) Schumacher Richard A. (Endicott NY), Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said board.
  • McGalliard James D. (11171 Fenwick Pl. Santa Ana CA 92705), Printed circuit fuse assembly.
  • Swarup Arvind,CAX, Printed lumped element stripline circuit ground-signal-ground structure.
  • Tohya Hirokazu,JPX ; Yoshida Shiro,JPX ; Shimada Yuzo,JPX, Printed wiring board with integrated coil inductor.
  • Carter Galen L. ; Norte David A. ; Yoon Woong K., Printed-circuit board-mountable ferrite EMI filter.
  • Stevenson, Robert A.; Haskell, Donald K.; Brendel, Richard L., Process for manufacturing an EMI filter feedthrough terminal assembly.
  • Imasu Satoshi,JPX ; Yoshida Ikuo,JPX ; Hayashida Tetsuya,JPX ; Yamagiwa Akira,JPX ; Takeura Shinobu,JPX, Process for mounting electronic device and semiconductor device.
  • Cosquer Jean M. (Saint Denis FRX) Fabre Alain J. (Levallois FRX) Poirier Robert (Taverny FRX), Protection arrangement for an electronic device sensitive to electromagnetic radiation.
  • Troxel Robert Vincent ; Cardon Jay Edward ; Ninh Loi Quang, Quad cable construction for IEEE 1394 data transmission.
  • Sweeney Richard E., RF amplifier assembly with reliable RF pallet ground.
  • Anderson Andrew Reino ; Backes Glen Brian ; Demulling Richard Thomas ; Louwagie Dominic ; Ortberg Todd Charles ; Sansone Edward F., RF directional coupler module.
  • Davis Thomas F. (Camp Hill PA) Iannella James F. (Harrisburg PA), RF filter having composite dielectric layer and method of manufacture.
  • Yoshikawa Noriyuki,JPX ; Tateoka Kazuki,JPX ; Sugimura Akihisa,JPX ; Kanazawa Kunihiko,JPX, RF power amplifying circuit device.
  • McSparran Joseph F. (Cherry Hill NJ) Blackman William (Cherry Hill NJ) Weaver Harry Z. (Newtown PA) O\Neill Jere W. (Succasunna NJ), RF signal shielding enclosure of electronic systems.
  • Anderson Andrew Reino ; Backes Glen Brian ; Demulling Richard Thomas ; Louwagie Dominic ; Ortberg Todd Charles ; Sansone Edward F., RF splitter/combiner module.
  • Val Christian (St. Remy-les Chevreuses FRX) Pinel Joseph (Villefranche-de-Lauragais FRX) Gibod Yves B. (St. Cyr-L\Ecole FRX), Radiation-hardened casing for an electronic component.
  • Suzuki, Shigetaka; Takayama, Akira, Radio frequency amplifier with a waveguide filter for isolating amplifying elements.
  • Brady Peter J. (Glendale AZ) Miller Carol (Mesa AZ) Powell David R. (Phoenix AZ), Receptacle assembly with both insulation displacement connector bussing and friction connector coupling of power conduct.
  • Roland A. Gilbert, Reconfigurable diplexer for communications applications.
  • Goad Stephen D. (Tuscon AZ), Reconfigurable thin-profile switched-mode power conversion array and method of operating the same.
  • Mandai Harufumi (Osaka JPX) Iwai Kiyoshi (Kyoto JPX) Naito Yasuyuki (Kyoto JPX), Reduction reoxidation type semiconductor ceramic condenser.
  • Enokihara, Akira; Okajima, Michio, Resonator and high-frequency filter.
  • Hidaka, Seiji; Ota, Michiaki; Abe, Shin, Resonator, filter, duplexer, and communication device.
  • Hidaka, Seiji; Ota, Michiaki; Fujii, Yasuo; Abe, Shin, Resonator, filter, duplexer, and communication device.
  • Holmes Francis A. (Hendersonville NC), Sandwich construction for current limiting positive temperature coefficient protective device.
  • Popek Marc H. (Indian Harbour Beach FL) Springer Kenneth D. (St. Petersburg FL) Beaudet William R. (Melbourne FL) DiStefano Ralph D. (Palm Bay FL), Sculptured stripline interface conductor.
  • Gupta Tapan K. (Monroeville PA) Straub William D. (Pittsburgh PA), Self-limiting capacitor formed using a plurality of thin film semiconductor ceramic layers.
  • Wang Tsing-Chow (San Jose CA) Liang Louis H. (Los Altos CA), Semi-conductor device interconnect package assembly for improved package performance.
  • Chance Dudley A. (Newton CT) Davidson Evan E. (Hopewell Junction NY) Dinger Timothy R. (Croton-on-Hudson NY) Goland David B. (Bedford Hills NY) Lapotin David P. (Carmel NY), Semiconductor chip interposer module with engineering change wiring and distributed decoupling capacitance.
  • Stager Mark P. ; Yee Abraham F. ; Padmanabhan Gobi R., Semiconductor chip package with interconnect layers and routing and testing methods.
  • Hiroki Fujii JP, Semiconductor device.
  • Kazumasa Yanagisawa JP; Toshio Sasaki JP; Satoru Nakanishi JP; Yoshihiko Yasu JP, Semiconductor device.
  • Miyauchi Akira (Kawasaki JPX) Nishimoto Hiroshi (Tokyo JPX) Okiyama Tadashi (Kawasaki JPX) Kitasagami Hiroo (Kawasaki JPX) Sugimoto Masahiro (Yokosuka JPX) Tamada Haruo (Yokohama JPX) Emori Shinji (U, Semiconductor device.
  • Lin Paul T. (Austin TX) McShane Michael B. (Austin TX) Wilson Howard P. (Austin TX), Semiconductor device having a pad array carrier package.
  • Ichimura Tooru (Hyogo JPX) Sakemi Kazuhiro (Hyogo JPX) Mori Shigeru (Hyogo JPX) Sakurai Mikio (Hyogo JPX), Semiconductor device having an improved immunity to a short-circuit at a power supply line.
  • Wenzel James F. (Austin TX) Chopra Mona A. (Austin TX) Foster Stephen W. (Dripping Springs TX), Semiconductor device having built-in high frequency bypass capacitor.
  • Higgins ; III Leo M. (Austin TX), Semiconductor device with integral decoupling capacitor.
  • Kobayashi, Toshiyuki; Kurihara, Yasutoshi; Ueno, Takumi; Maejima, Nobuyoshi; Nakajima, Hirokazu; Yamada, Tomio; Endoh, Tsuneo, Semiconductor devices.
  • Otsuka Kanji (Higashiyamato JPX) Okinaga Takayuki (Hanno JPX) Shirai Yuji (Hamura JPX) Miwa Takashi (Fussa JPX) Tsuboi Toshihiro (Kodaira JPX) Matsugami Shouji (Kokubunji JPX), Semiconductor integrated circuit device.
  • Nakura Toru,JPX ; Ueda Kimio,JPX, Semiconductor integrated circuit device including electrostatic protection circuit accommodating drive by plurality of power supplies and effectively removing various types of surge.
  • Taylor Gregory F. ; Geannopoulos George L. ; Mosley Larry E., Semiconductor package substrate with power die.
  • Krausse ; III George J. (Fort Collins CO), Semiconductor packaging with ground plane conductor arrangement.
  • Asada Kenji,JPX ; Hamano Toshio,JPX ; Nukiwa Masaru,JPX, Semiconductor unit having semiconductor device and multilayer substrate, in which grounding conductors surround conducto.
  • Colburn Richard H. (Saugus CA) Anderhalt Donald A. (Valencia CA) Stevenson Robert A. (Canyon Country CA), Series feed-through capacitor.
  • Swirbel Thomas J. (Davie FL) Barnardoni Lonnie L. (Boca Raton FL) Williams Melanie (Deerfield Beach FL) Davis James L. (Coral Springs FL), Shielded EPROM package.
  • Davis Wayne Samuel ; Whiteman ; Jr. Robert Neil ; Shirk Michael Eugene, Shielded electrical connector.
  • Carter Andrew L. (Saratoga CA), Shielded electrical connectors.
  • Anthony,David; Anthony,Anthony; Anthony,William, Shielded energy conditioner.
  • Linder William J. ; Harguth Robert S., Shielded integrated circuit capacitor connected to a lateral transistor.
  • Guzuk Andrzej T. (Pompano Beach FL) Roshitsh Todd W. (No. Lauderdale FL) Engstrom Scott M. (Coral Springs FL) Bernardoni Lonnie L. (Coral Springs FL), Shielded low-profile electronic component assembly.
  • Philippson Walter M. (Woodside NY) Brennan Robert J. (Ossining NY) Meighen Terrence (Stormville NY), Shielded plug and jack connector.
  • Inoue Akira (Itami JPX), Shielded semiconductor device.
  • Gilmore Peter B. (Plantation FL) Thompson Kenneth R. (Sunrise FL), Shielded semiconductor device package.
  • Akiba Yutaka (Fujisawa JPX) Matsumoto Kunio (Yokohama JPX) Iida Makoto (Kawasaki JPX) Maruyama Takashi (Ebina JPX) Hara Tsutomu (Fujisawa JPX) Yoshidome Hitoshi (Hadano JPX) Hirota Kazuo (Chigasaki J, Shielding method and circuit board employing the same.
  • Alexander Arthur R. (Valley Center CA), Side plated electromagnetic interference shield strip for a printed circuit board.
  • Kucharek Andrzej (Saratoga Mountain View CA) Marshall John (Saratoga San Jose CA) Lee James C. K. (Saratoga Los Altos CA) Amdahl Carlton G. (Saratoga San Jose CA) Yuan Leo (San Jose CA), Signal connection system for semiconductor chip.
  • Sugawa Shigetoshi (Atsugi JPX), Signal processor having avalanche photodiodes.
  • Kobayashi Yuji (Kanagawa JPX) Nakata Tetsuro (Kanagawa JPX), Signal transfer line having a DIN connector.
  • Liberkowski Janusz B. (5884 Macadam Ct. San Jose CA 95123), Signal-routing or interconnect substrate, structure and apparatus.
  • Engeler William E. (Scotia NY), Single phase signal processing system utilizing charge transfer devices.
  • Lau John H. ; Chen Yung Shih ; Chou Tai-Yu ; Wu Frank H. ; Chen Kuan Luen ; Koh Wei H., Single-core two-side substrate with u-strip and co-planar signal traces, and power and ground planes through split-wrap-.
  • Yamashita Nobuyuki (Hitachi JPX) Tahara Kazuo (Hitachi JPX) Chiba Akio (Hitachi JPX) Sobue Masahisa (Mito JPX) Abukawa Toshimi (Hitachiota JPX) Sakamoto Shin\ichi (Hitachi JPX) Suzuki Shun (Katsuta J, Sliding current collector made of ceramics.
  • Katagiri Masayuki,JPX ; Takei Hiromitsu,JPX, Small motor with improved connecting structure between coil, riser and varistor.
  • Wang, Chin-Li, Small size cross-coupled trisection filter.
  • Herbert Edward, Snubber for electric circuits.
  • Seale, Joseph B.; Bergstrom, Gary E., Solenoid cassette pump with servo controlled volume detection.
  • Shimada Akihiro,JPX ; Nogami Katsunori,JPX ; Murakami Toshiyuki,JPX ; Kaneko Atsuko,JPX, Solid electrolytic capacitor and process for producing the same.
  • Loewy Zvi Gerald ; Singh Bawa, Solid support with attached molecules.
  • Yamashita Hirofumi (Kawasaki JPX) Inoue Ikuko (Kawasaki JPX) Sasaki Michio (Yokohama JPX) Miyagawa Ryohei (Yokohama JPX), Solid-state imaging device with internal smear eliminator.
  • Wheeler Richard L. (San Jose CA), Special interconnect layer employing offset trace layout for advanced multi-chip module packages.
  • Forthun John A., Stackable chip package with flex carrier.
  • Ingalls Mark W. ; Arnold Eric D. ; Bates David A. ; Semans Bruce F., Standing axial-leaded surface mount capacitor.
  • Anderson Carl J. (Peekskill NY), Stripline cable with reduced crosstalk.
  • Shimizu Hiroyuki (Nagoya JPX) Ito Kenji (Nagoya JPX), Stripline filter device having a coupling dielectric layer between two stripline resonators.
  • Hirai Takami (Nishikamo JPX) Yano Shinsuke (Nagoya JPX), Stripline filter having internal ground electrodes.
  • Higgins ; Jr. Robert J. (Sunrise FL), Stripline filter with improved resonator structure.
  • Virga Kathleen L. (Redondo Beach CA) Shoda Craig (Torrance CA) Owens Joseph N. (Santa Monica CA), Stripline shielding techniques in low temperature co-fired ceramic.
  • Westbrook Scott R. (Los Altos CA), Structure for controlling impedance and cross-talk in a printed circuit substrate.
  • Hetzel Asmus,DEX ; Klink Erich,DEX ; Koehl Juergen,DEX ; Wendel Dieter,DEX ; Patel Parsotam Trikam, Structure for reducing cross-talk in VLSI circuits and method of making same using filled channels to minimize cross-talk.
  • Natarajan Slva (Gilbert AZ), Structure of a thermally and electrically enhanced plastic pin grid array (PPGA) package for high performance devices wi.
  • Zirbes, Glen, Structures and assembly methods for radio-frequency-identification modules.
  • Skinner Harry G. ; Delaplane Neil C. ; Mahajan Ravi V. ; Starkston Robert ; Lii Mirng-ji ; Edsall Ron, Substrate for reducing electromagnetic interference and enclosure.
  • Flick Carl (Pittsburgh PA) Ying Sui-Chun (Monroeville PA), Support structure for dynamoelectric machine stators spiral pancake winding.
  • Korenaga, Nobushige, Supporting system in exposure apparatus.
  • Cherniski Andrew M. ; Sandoval Alisa C., Suppressing EMI with PCB mounted ferrite attenuator.
  • Horikawa Katsuhiro,JPX ; Ando Akira,JPX, Surface acoustic wave device having polycrystalline piezoelectric ceramic layers.
  • Funada Yoshitsugu,JPX ; Tanioka Michinobu,JPX, Surface acoustic wave device mounted with a resin film and method of making same.
  • Anderson Michael J. ; Kennison Gregory ; Christensen Jeffrey E. ; Johnson Gary C. ; Aday Jon G., Surface acoustic wave device package and method.
  • Kadota, Michio, Surface acoustic wave filter with angled reflection by piezoelectric substrate reflection edges, duplexer, and communication device.
  • Oberhammer Wolfgang,CAX, Surface mount EMI gasket filter.
  • Ritter, Andrew P.; Blair, Andrew; Strawhorne, Maureen; Moore, Clare Ashley; Heistand, II, Robert H., Surface mount RC array with narrow tab portions on each of the electrode plates.
  • Haim Goldberger IL; Isaac Refaely IL; Ehud Elron IL, Surface mount coupler device.
  • Goldberger Haim,ILX ; Refaely Isaac,ILX ; Elron Ehud,ILX, Surface mount filter device.
  • DuPre David A. ; Galvagni John L. ; Ritter Andrew P., Surface mount multilayer capacitor.
  • DuPre David A. ; Galvagni John L. ; Ritter Andrew P., Surface mount multilayer capacitor.
  • Amano Toshinori (Nagaokakyo JPX) Sakai Seiji (Nagaokakyo JPX) Fujiki Yasuo (Nagaokakyo JPX) Ueyama Masanori (Nagaokakyo JPX) Sakamoto Yukio (Nagaokakyo JPX) Takagi Daisuke (Nagaokakyo JPX), Surge absorber.
  • Tomlinson John C. (892 Maderia Cir. Tallahassee FL 32312), Surge protector for vehicular traffic monitoring equipment.
  • Kiser Willie C. (Rio Rancho NM) Foreman Kevin G. (Sandia Park NM) Miller Paul J. (Albuquerque NM), Surge suppression device.
  • Newman ; Jr. Robert C. (Emmaus PA), Surge suppression system.
  • Fathy Aly Eid ; Geller Bernard Dov ; Perlow Stewart Mark ; Rosen Arye ; Johnson Henry Charles, Switch structure for antennas formed on multilayer ceramic substrates.
  • Ueno Norio (Kawasaki JPX) Kato Seiji (Yamato JPX) Iwata Atsushi (Tokorozawa JPX), Switched-capacitor filter.
  • Nossek Josef (Munich DEX), Switched-capacitor filter circuit having at least one simulated inductor and having a resonance frequency which is one-s.
  • Hayworth Wilson, Symmetrical feed-thru.
  • Novak Istvan, System and method for edge termination of parallel conductive planes in an electrical interconnecting apparatus.
  • Song Junehwa ; Yeo Boon-Lock, System and method for extracting spatially reduced image sequences in a motion compensated compressed format.
  • Goro Kitsukawa JP; Takesada Akiba JP; Hiroshi Otori JP; William R. McKee ; Jeffrey E. Koelling ; Troy H. Herndon, System with meshed power and signal buses on cell array.
  • Rose William J. (West Hartford CT) Aekins Robert (Stratford CT), Telecommunication connector with feedback.
  • Pelegris Dimitris J. (Mount Prospect IL), Telephone line overvoltage protection method and apparatus.
  • Yamano Tamio (Nagaokakyo JPX) Kugutsu Nobumasa (Nagaokakyo JPX) Morimoto Tadashi (Nagaokakyo JPX) Naito Yasuyuki (Nagaokakyo JPX), Temperature compensating ceramic dielectric.
  • Neil J. Goldfine, Test circuit on flexible membrane with adhesive.
  • Nagashima Toshio (Yokohama JPX) Saitoh Takeshi (Yokohama JPX) Hatashita Hiroshi (Tokyo JPX) Shinagawa Mitsuhisa (Fujisawa JPX), Thick film multilayer substrate.
  • Bakermans Frank C. (Raleigh NC) Trexler Charles J. (York PA), Thick film planar filter connector having separate ground plane shield.
  • Hernandez, Jorge M.; Feinberg, Andrew B., Thin decoupling capacitor for mounting under integrated circuit package.
  • Wark James M. ; Akram Salman, Thin film capacitor coupons for memory modules and multi-chip modules.
  • Wark James M. ; Akram Salman, Thin film capacitor coupons for memory modules and multi-chip modules.
  • Malladi Deviprasad (Campbell CA) Bogatin Eric L. (San Jose CA) Zand Bahram (Laguna Niguel CA), Thin film chip capacitor for electrical noise reduction in integrated circuits.
  • Ookubo Akira (Nagaokakyo JPX), Three terminal filter.
  • Sasov Yuriy Dmitrievich,RUX, Three-dimensional electronic module and a method of its fabrication and repair.
  • Dehaine Gerard,FRX ; Marbot Roland,FRX ; Moreau Michel,FRX ; Stricot Yves,FRX, Three-dimensional integrated circuit package having conductors at different fixed potentials.
  • Yamate Kazunori (Ibaraki JPX) Watanabe Chikara (Osaka JPX) Ishibashi Youichi (Ibaraki JPX), Three-terminal capacitor and assembly.
  • Park Jong M. (Suwon KRX), Three-terminal noise filter having M-shaped lead.
  • Okubo Akira (Takefu JPX), Three-terminal type noise filter.
  • Lee Soo-Cheol (Suweon KRX), Through type condenser.
  • Khandros, Igor Y.; Mathieu, Gaetan L., Tip structures.
  • Vora Pramod, Touch responsive electric power controller.
  • Soldner Keith D. (Coral Springs FL) Juskey Frank J. (Coral Springs FL) Freyman Bruce J. (Plantation FL) Miles Barry M. (Plantation FL), Transfer molded semiconductor device package with integral shield.
  • Herbert Edward, Transformer for switched mode power supplies and similar applications.
  • Fussell Gerald W. (5810 S. Ridgeway Drive Orlando FL 32805), Transient and surge protection apparatus.
  • Romerein Robert L.,CAX ; Crowhurst David B.,CAX, Transmission line for distribution network housing.
  • Scott Jeffrey W. (Austin TX), Tri-level capacitor structure in switched-capacitor filter.
  • Miyoshi Yamauchi JP; Mitsuhiro Noboru JP; Haruo Koizumi JP; Syuuji Matsuura JP; Toshifumi Akiyama JP, Tuner structure and cable modem tuner using the same.
  • Liu Donghang, Ultra-small capacitor array.
  • Kennedy ; III Robert M. ; Korony Gheorghe ; Liu Donghang ; Mevissen Jeffrey P. ; Heistand ; II Robert H., Ultra-small resistor-capacitor thin film network for inverted mounting to a surface.
  • Anthony, Anthony A.; Anthony, William M., Universal energy conditioning interposer with circuit architecture.
  • Anthony, Anthony A.; Anthony, William M., Universal energy conditioning interposer with circuit architecture.
  • Anthony,Anthony A.; Anthony,William M., Universal energy conditioning interposer with circuit architecture.
  • Anthony, Anthony A., Universal multi-functional common conductive shield structure for electrical circuitry and energy conditioning.
  • Anthony,Anthony A.; Anthony,William M., Universial energy conditioning interposer with circuit architecture.
  • Walsh Malcolm R. (Redwood City CA), Use of PTC devices.
  • Cowman Stephen P.,IEX ; Ratcliffe Alan J.,IEX ; Nicker Derek A.,GBX ; Shreeve John M.,GBX ; Oliver Anthony L.,GBX, Varistor manufacturing method.
  • Cowman Stephen P. (Dundalk IEX) Nicker Derek A. (Great Yarmouth GB2) Oliver Anthony L. (Great Yarmouth GB2), Varistor of generally cylindrical configuration.
  • Cowman Stephen P. (Dundalk IEX), Varistor structures.
  • Kramer Mark E. ; Schnell Robert E., Vehicular exterior rear view mirror actuator with emission suppression.
  • Robbins William L. (Newton MA), Viad chip capacitor and method for making same.
  • Utsumi Kazuaki (Tokyo JPX) Shohata Nobuaki (Tokyo JPX) Ohno Tomeji (Tokyo JPX), Voltage dependent nonlinear resistor.
  • Marek Alois (Untersiggenthal CHX), Voltage limiting feed-through unit.
  • Bennett John C. (Hampton VA), Voltage surge protector.
  • Ott Guenter (Schwanberg ATX) Zettl Franz (Deutschlandsberg ATX), Voltage-dependent resistor.
  • Cho Ching-Fai ; Maiershofer Helmut Carl ; Shin Do Bum ; Quil Avery Yee, Wide frequency band transition between via RF transmission lines and planar transmission lines.
  • Ari Niyazi (Nussbaumen CHX) Hansen Diethard (Berikon CHX) Hoitink Hendrik (Windisch CHX) Schr Hans (Basel CHX), Zine oxide surge arresters.
  • 섹션별 컨텐츠 바로가기

    AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

    AI-Helper 아이콘
    AI-Helper
    안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
    ※ AI-Helper는 부적절한 답변을 할 수 있습니다.

    선택된 텍스트

    맨위로