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Vertical electrical connector 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • 13-03
출원번호 US-0418310 (2012-04-13)
등록번호 US-D727268 (2015-04-21)
발명자 / 주소
  • Buck, Jonathan E.
  • Stoner, Stuart C.
  • Minich, Steven E.
  • Johnescu, Douglas M.
  • Smith, Stephen B.
출원인 / 주소
  • FCI Americas Technology LLC
대리인 / 주소
    Baker & Hostetler LLP
인용정보 피인용 횟수 : 11  인용 특허 : 671

초록

초록이 없습니다.

대표청구항

The ornamental design for a vertical electrical connector, as shown and described.

이 특허에 인용된 특허 (671)

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  221. O\Sullivan Michael (Willowbrook IL) Wetter James A. (Hoffman Estates IL), Electrical connector having terminal modules.
  222. Korsunsky Iosif (Harrisburg PA) Grabbe Dimitry G. (Middletown PA), Electrical connector having terminals which cooperate with an edge of a circuit board.
  223. Michael W. Fogg ; Russell D. Moser, Electrical connector having triad contact groups arranged in an alternating inverted sequence.
  224. Mickievicz Scott K. ; Helster David W. ; Defibaugh George R. ; Sipe Lynn Robert, Electrical connector including a housing that holds parallel circuit boards.
  225. Gettig William A. (Millheim PA) Shook Larry E. (Millheim PA), Electrical connector of the hermaphroditic type.
  226. Dynia Gregory G. (6517-F Woodlake Village Ct. Midlothian VA 23112), Electrical connector prong lock.
  227. Whiteman, Jr.,Robert N.; Ritter,Christopher D., Electrical connector receptacle.
  228. Barkus Lee A. (Millersburg PA) Sinisi David B. (Harrisburg PA), Electrical connector stiffener device.
  229. Davis, Wayne Samuel; Whiteman, Jr., Robert Neil, Electrical connector system.
  230. Fedder James L. (Etters PA) Sucheski Matthew M. (Harrisburg PA), Electrical connector system.
  231. Rigby,William J.; Blaise,Scott S., Electrical connector system.
  232. Minich,Steven E.; Morlion,Danny L. C., Electrical connector system with jogged contact tails.
  233. Consoli,John Joseph; Rothermel,Brent Ryan; Smith, Jr.,Graham Harry, Electrical connector with ESD protection.
  234. Swain,Wilfred J., Electrical connector with air-circulation features.
  235. Mitra Niranjan Kumar,NLX, Electrical connector with an element which positions the connection pins.
  236. Cohen, Thomas S.; Richard, Robert A., Electrical connector with conductive plastic features.
  237. Hillbish Warren Christian ; McCleerey Earl William, Electrical connector with contact assembly.
  238. Rothermel, Brent Ryan; Morgan, Chad William, Electrical connector with crosstalk canceling features.
  239. Chien, Chih-Ming C; Wang, Yi-Wen, Electrical connector with double mating interfaces for electronic components.
  240. Timothy B. Billman ; John H. Weaver, Jr., Electrical connector with grounding system.
  241. Timothy B. Billman ; John H. Weaver, Jr., Electrical connector with grounding system.
  242. Noschese Rocco J. ; Piorunneck Heinz, Electrical connector with high speed and high density contact strip.
  243. Korsunsky, Iosif R.; Gillespie, Brian J.; Walker, Kevin E.; Harlan, Tod M., Electrical connector with improved contact retention.
  244. Wei-Chen Lee, Electrical connector with improved grounding bus.
  245. Comerci Joseph D. ; Kotz Kenneth K. ; Mayo Michael, Electrical connector with improved terminal.
  246. O\Sullivan Michael (Willowbrook IL) Wetter James A. (Hoffman Estates IL), Electrical connector with improved terminal-receiving passage means.
  247. Achammer Daniel G. ; Banakis Emanuel G. ; Mead David G., Electrical connector with inserted terminals.
  248. Paagman, Bernardus L. F., Electrical connector with integrated PCB assembly.
  249. Olson, Stanley W., Electrical connector with metallized polymeric housing.
  250. Ferrill Jess Britton ; Pitts Terry Lee, Electrical connector with paired terminals.
  251. Davis,Wayne Samuel, Electrical connector with protection for electrical contacts.
  252. Stoner,Stuart C.; Daily,Christopher G.; Dodds,John D.; Swain,Wilfred James; Kolivoski,Christopher J.; Johnescu,Douglas M., Electrical connector with provisions to reduce thermally-induced stresses.
  253. Kocher Timothy Lee (Camp Hill PA) Veith William Edward (Harrisburg PA) Buchter Randolph Lee (Harrisburg PA), Electrical connector with stabilized contact.
  254. Hahn, Marlyn E.; Kline, Stanley A.; Shuey, Joseph B., Electrical connector with strain relief.
  255. Dutkowsky David J.,JPX ; Schell Mark S., Electrical connector with stress isolating solder tail.
  256. Rothermel, Brent Ryan; Morgan, Chad William; Sharf, Alex Michael; Helster, David Wayne, Electrical connector with wafers having split ground planes.
  257. Brunker David L. (Naperville IL) Nelson Richard A. (Glen Ellyn IL), Electrical connectors.
  258. Pierini John M. ; Weaver Christopher, Electrical connectors.
  259. Minich,Steven E.; Shuey,Joseph B.; Hull,Gregory A.; Smith,Stephen, Electrical connectors having contacts that may be selectively designated as either signal or ground contacts.
  260. Minich,Steven E.; Shuey,Joseph B.; Hull,Gregory A.; Smith,Stephen, Electrical connectors having contacts that may be selectively designated as either signal or ground contacts.
  261. Ngo,Hung Viet; Swain,Wilfred James; Daily,Christopher G., Electrical connectors having power contacts with alignment and/or restraining features.
  262. Buck, Jonathan E.; Harper, Donald K.; Potteiger, Lee William; Spickler, John M., Electrical connectors with alignment guides.
  263. Vandame Bertrand (Villepreux FRX), Electrical contact element.
  264. Marsh Edward K. (Orlando FL), Electrical contact for electrical connector assembly.
  265. Lee, Genn-Sheng; Szu, Ming-Lun, Electrical contact for retaining solder preform.
  266. McClune Donald W. (Hollidaysburg PA), Electrical contact system with cantilever mating beams.
  267. Copper,Charles Dudley; Laub,Michael, Electrical contact with plural arch-shaped elements.
  268. Middlehurst, Richard J.; Wood, Donald E.; Jetter, Robert S.; Foley, Robert G., Electrical contacts and socket assembly.
  269. Crane ; Jr. Stanford W. (Boca Raton FL) Portuondo Maria M. (Boca Raton FL), Electrical interconnect system having insulative shrouds for preventing mismating.
  270. Pope Richard A. ; Cherney Thomas M. ; Hardcastle David S., Electrical interconnection system and device.
  271. Fedder James L. (Etters PA) Sucheski Matthew M. (Harrisburg PA), Electrical modular connector.
  272. Lee Feng-Jui (4F-1 ; No. 92 ; Kuang-Hua S. St. Hsin Chu City TWX), Electrical plug.
  273. Krokaugger William G. (Chatsworth CA), Electrical plug assembly.
  274. Davis Wayne S. (Harrisburg PA), Electrical plug connector with blade receiving slots.
  275. Denlinger Keith R. (Lancaster PA) Rudy ; Jr. William J. (Annville PA) Stahl Daniel E. (Harrisburg PA), Electrical plug header.
  276. Joseph B. Shuey, Electrical power connector.
  277. Minich, Steven E.; Kolivoski, Christopher J., Electrical power connector.
  278. Minich, Steven E.; Kolivoski, Christopher J., Electrical power connector.
  279. Minich,Steven E.; Kolivoski,Christopher J., Electrical power connector.
  280. Swain,Wilfred James; Daily,Christopher G.; Kolivoski,Christopher J., Electrical power connectors with cooling features.
  281. Daily,Christopher G.; Swain,Wilfred J.; Stoner,Stuart C.; Kolivoski,Christopher J.; Johnescu,Douglas M., Electrical power contacts and connectors comprising same.
  282. Daily,Christopher G.; Swain,Wilfred J.; Stoner,Stuart C.; Kolivoski,Christopher J.; Johnescu,Douglas M., Electrical power contacts and connectors comprising same.
  283. Daily,Christopher G.; Swain,Wilfred J.; Stoner,Stuart C.; Kolivoski,Christopher J.; Johnescu,Douglas M., Electrical power contacts and connectors comprising same.
  284. Daily,Christopher G.; Swain,Wilfred J.; Stoner,Stuart C.; Kolivoski,Christopher J.; Johnescu,Douglas M., Electrical power contacts and connectors comprising same.
  285. Ngo,Hung Viet; Daily,Christopher G.; Swain,Wilfred J.; Stoner,Stuart C.; Kolivoski,Christopher J.; Johnescu,Douglas M., Electrical power contacts and connectors comprising same.
  286. Howard Guy W. (#3-1598 Sir Francis Drake Blvd. San Anselmo CA 94960) Dodd Brian W. (46 Juniper Rd. San Geronimo CA 94973), Electrical receptacle with releasable locking means.
  287. Ortega Jose L. (Camp Hill PA) Griesemer David A. (Harrisburg PA), Electrical shunt.
  288. Takase Hisato,JPX ; Yagi Masanori,JPX ; Matsuura Naoya,JPX ; Miyazawa Junnichi,JPX, Electrical terminal.
  289. Pemberton Donald Stuart (Stoke-on-Trent EN) Smith Gordon Roy Frank (Newcastle-under-Lyme EN), Electrical terminals.
  290. Barnett Roy (Nashua NH), Electrically connecting.
  291. Doutrich Ray C. ; Stoner Stuart C. ; Townsend Peter K. ; Fusselman David F., Electrically enhanced modular connector for printed wiring board.
  292. Doutrich Ray C. ; Stoner Stuart C. ; Townsend Peter K. ; Fusselman David F., Electrically enhanced modular connector for printed wiring board.
  293. Thomas Daniel L. (Portland OR), Electrically insulating thermally conductive pad for mounting electronic components.
  294. Centola, Bruno; Gomez, Claude; Ouazana, Christian, Electronic board assembly including two elementary boards each carrying connectors on an edge thereof.
  295. Casperson, Paul G., Electronic component heat sink attachment using a low force spring.
  296. Nguyen Hung N. (Bensalem PA), Electronic device interconnection techniques.
  297. Wojnarowski Robert John, Electronic device pad relocation, precision placement, and packaging in arrays.
  298. Takahashi Norihiro,JPX ; Kurotori Fumio,JPX ; Miyazawa Hideo,JPX ; Daikuhara Osamu,JPX ; Futaki Kazuyuki,JPX ; Suzuki Hiroyuki,JPX ; Yoshiike Takahiro,JPX ; Ikeda Kazuhiko,JPX, Fabrication method of connector having internal switch.
  299. Brid, Gregory Michael; Thomas, Jr., James C., Fan with motor ventilation system.
  300. Ishii Takashi,JPX, Female terminal with flexible contact area having inclined free edge portion.
  301. Hoebener Karl G. (Georgetown TX) Hubacher Eric M. (Austin TX) Partridge Julian P. (Austin TX), Fine pitch solder deposits on printed circuit board process and product.
  302. Sochor Jerzy R. (164 Rockview Irvine CA 92715), Flat receptacle contact for extremely high density mounting.
  303. Gillette Joseph G. ; Potter Scott G. ; Lall Pradeep, Flexible connector for circuit boards.
  304. Fjelstad Joseph ; DiStefano Thomas H. ; Karavakis Konstantine ; Faraci Anthony B. ; Nguyen Tan, Flexible connectors for microelectronic elements.
  305. Blanchfield, Michael Allen; Brown, III, John Bossert; Conner, Troy Everette, Floatable connector assembly with a staggered overlapping contact pattern.
  306. Hasircoglu, Alexander William; Henry, Randall R.; Fowler, David Keay; Sipe, Lynn Robert; Taylor, Attalee S.; Fedder, Jim, Floating interface for electrical connector.
  307. Stoner, Stuart C., Gender-neutral electrical connector.
  308. Piorunneck, Heinz; Noschese, Rocco J.; Ramirez, Fernando J., Ground shielded bi-level card edge connector.
  309. Yu, Hung-Chi, Grounded electrical connector.
  310. Timothy B. Billman, Grounding scheme for a high speed backplane connector system.
  311. Wagner Louis E. (Eggertsville NY) Flannery Harold F. (Batavia OH) Rakoczynski Randolph W. (Grand Island NY), Groundwater protection system.
  312. Stanley W. Olson, Header assembly for mounting to a circuit substrate.
  313. Ortega, Jose L.; Stoner, Stuart C.; Raistrick, Alan, Header assembly for mounting to a circuit substrate and having ground shields therewithin.
  314. Koseki Yoshitsugu,JPX ; Yu Hung-Chi,TWX, Header connector for future bus.
  315. Rudy ; Jr. William J. (Annville PA) Shaffer Howard R. (Millersburg PA) Stahl Daniel E. (Hummelstown PA), Heat dissipating EMI/RFI protective function box.
  316. Cheng, Andrew, Heat distributor for electrical connector.
  317. Kuzmin Gary F. ; Clemens Donald Lynn, Heat sink mounting assembly for surface mount electronic device packages.
  318. Russell, Mark C.; Flamm, Ron, Heatsink retention apparatus.
  319. Maurice Denis (Rimogne FRX), Hermaphrodite contact and a connection defined by a pair of such contacts.
  320. Harwath Frank A. (Downers Grove IL) Leonard Russell J. (Downers Grove IL), Hermaphroditic L. I. F. mating electrical contacts.
  321. Harper ; Jr. Donald K. ; Johnson Lewis R., Hermaphroditic contact.
  322. Horchler, David C.; Gray, Mark R., Hermaphroditic electrical connector.
  323. Kilpatrick, Jerry B.; Lincoln, Clifford F., Hermaphroditic electrical connector.
  324. Duclos Jean-Louis (Elancourt FRX), Hermaphroditic electrical contact member.
  325. Roath Alan L. (Madison OH) Bacnik James A. (Mentor OH) Venaleck John T. (Madison OH) Venaleck Howard J. (Painesville OH), Hermaphroditic interconnect system.
  326. Billman, Timothy B., High current connector.
  327. Grabbe Dimitry G. (Middletown PA) Granitz Richard F. (Harrisburg PA) Bakker Roel J. (York PA) Milbrand ; Jr. Donald W. (Mechanicsburg PA) Masterson Earl E. (Minneapolis MN), High density coax connector.
  328. Doutrich Ray C. (Lebanon PA), High density connector.
  329. Lemke Timothy A. ; Houtz Timothy W., High density connector.
  330. Olson Stanley W., High density connector having a ball type of contact surface.
  331. Fedder James L. (Etters PA), High density connector system.
  332. Shuey Joseph B., High density connector system.
  333. Korsunsky,Iosif R.; Gillespie,Brian J., High density connector with enhanced structure.
  334. Demler ; Jr. Henry W. (Clearwater FL) Dola Frank P. (Hudson FL) Kimmel David J. (Clearwater FL) Lauterbach John H. (Hudson FL) Sotolongo Thomas J. (Clearwater Beach FL) Zwieg Grover A. (Clearwater FL, High density controlled impedance connector.
  335. Joseph B. Shuey, High density electrical connector assembly.
  336. Billman, Timothy B.; Korsunsky, Iosif R., High density electrical connector assembly with reduced insertion force.
  337. Bradley Robert M. ; Perugini Michael N., High density electrical interconnect system having enhanced grounding and cross-talk reduction capability.
  338. Bross Arthur (Poughkeepsie NY) Walsh Thomas J. (Poughkeepsie NY), High density electronic connector and method of assembly.
  339. Larry M. Crofoot ; John T. Venaleck, High density interconnect system and method.
  340. Morlion Danny L. C.,BEX ; van Zanten Ab,NLX, High density interstitial connector system.
  341. Sadigh-Behzadi Amir-Akbar (Van Nuys CA), High density, controlled impedance connectors.
  342. Korsunsky,Iosif R.; Gillespie,Brian J.; Johnson,Lewis R.; Shipe,Joanne E.; Walker,Kevin E.; Brown,Robert W., High density, high speed connector.
  343. Blair Bryce W. (Hummelstown PA) Hall Lawrence A. (Harrisburg PA), High durability drawer connector.
  344. Arnold Richard M. (New Albany OH) Baker Paul A. (Columbus OH) Drucker Coleen A. (Morristown NJ) Gashler Robert J. (Westerville OH) Lipari Dominic T. (Reynoldsburg OH) Robin Max S. (Denville NJ) Schel, High frequency connector.
  345. Bousman Thomas W. (Mesa AZ), High frequency electronic assembly.
  346. Harwath Frank A., High performance card edge connector.
  347. Johnescu, Douglas M.; Buck, Jonathan E.; Smith, Stephen B.; Stoner, Stuart C., High speed backplane connector with impedance modification and skew correction.
  348. van Zanten Albertus,NLX, High speed connector and method of making same.
  349. Belopolsky,Yakov, High speed connectors that minimize signal skew and crosstalk.
  350. Belopolsky,Yakov, High speed connectors that minimize signal skew and crosstalk.
  351. Benham,John E.; Padro,Kenny; Godburn, Jr.,Robert D., High speed electrical connector.
  352. Lemke, Timothy A.; Hull, Gregory A.; Smith, Stephen B.; Houtz, Timothy W., High speed electrical connector.
  353. Whiteman, Jr., Robert Neil; Davis, Wayne Samuel, High speed electrical connector.
  354. Whiteman, Jr., Robert Neil; Davis, Wayne Samuel, High speed electrical connector.
  355. Cohen Thomas S. ; Stokoe Philip T. ; McNamara David M., High speed high density electrical connector.
  356. Cohen,Thomas S.; Kirk,Brian; Cartier, Jr.,Marc B., High speed high density electrical connector.
  357. Joseph B. Shuey ; Stuart C. Stoner, High speed modular electrical connector and receptacle for use therein.
  358. Joseph B. Shuey ; Stuart C. Stoner, High speed modular electrical connector and receptacle for use therein.
  359. Cohen, Thomas S., High speed pressure mount connector.
  360. Mac Mullin, Robert, High speed transmission electrical connector with improved conductive contact.
  361. Cohen Thomas S ; Stokoe Philip T. ; McNamara David M., High speed, high density electrical connector.
  362. Cohen, Thomas S.; Kirk, Brian; Cartier, Jr., Marc B., High speed, high density electrical connector.
  363. Stokoe Philip T. ; Cohen Thomas ; Allen Steven J., High speed, high density electrical connector.
  364. Stokoe, Philip T.; Bacon, Neil J.; Payne, Jason J.; Ren, Huilin, High speed, high density electrical connector and connector assembly.
  365. Cohen, Thomas S.; Cartier, Marc B.; Dunham, John R.; Payne, Jason J., High speed, high density electrical connector assembly.
  366. Perugini, Michael N.; Eastman, Gary D.; Langon, Alfred J.; Prew, Raymond A.; Saydam, Erol D., High speed, high density interconnection device.
  367. Avery, Hazelton P.; Sweeney, Kathleen A.; McGowen, Daniel B.; Nelson, Richard A.; Fromm, Galen F.; Humbert, Gary, High-density connector assembly with flexural capabilities.
  368. Nelson, Richard A.; Sweeney, Kathleen A.; Avery, Hazelton P.; Fromm, Galen F.; McGowan, Daniel B., High-density connector assembly with improved mating capability.
  369. Crane ; Jr. Stanford W. (3934 NW. 57th St. Boca Raton FL 33496), High-density electrical interconnect system.
  370. Crane ; Jr. Stanford W. (3934 NW. 57th St. Boca Raton FL 33496), High-density electrical interconnect system.
  371. Wiebking, David M.; Zarbock, Kurt T.; Fogg, Michael W., High-density receptacle connector.
  372. Fromm, Galen F.; Neer, Jay H., High-density, impedance-tuned connector having modular construction.
  373. Laurx,John C., High-density, robust connector with guide means.
  374. Ohnishi, Koji; Matsue, Masahiko, High-frequency electric connector having no ground terminals.
  375. Kent E. Regnier, High-speed connector with shorting capability.
  376. Lang, Harold Keith; Regnier, Kent E.; Banakis, Emanuel G.; Schmidgall, David R.; Yap, Yew Teck, High-speed differential signal connector particularly suitable for docking applications.
  377. Benham, John E.; Padro, Kenny; Godburn, Jr., Robert D., High-speed electrical connector.
  378. Benham,John E.; Godburn, Jr.,Robert D., High-speed electrical connector.
  379. Zaderej, Victor; Stiles, Kenneth M.; Regnier, Kent E., High-speed mezzanine connector with conductive housing.
  380. Shindo, Takeshi, High-speed transmission connector with a ground structure having an improved shielding function.
  381. Yaegashi Hirokatsu (Tokyo JPX) Fumikura Tadahiro (Tokyo JPX), High-speed transmission electrical connector.
  382. Moon Heon-Hee,KRX, High-speed variable length decoding apparatus.
  383. Sakurai Toshihiro (Tokyo JPX), IC Socket panel or the like.
  384. Huang Yao-Chi,TWX ; Lin Nick,TWX, IC socket having standoffs.
  385. Raistrick,Alan; Shuev,Joseph B., Impedance control in electrical connectors.
  386. Raistrick,Alan; Shuey,Joseph B., Impedance control in electrical connectors.
  387. Broeksteeg Johannes M. (Ag Oss NLX), Impedance matched backplane connector.
  388. Dola Frank P. (Hudson FL) Feldman Steven (Seminole FL), Impedance matched electrical connector.
  389. Bassler, Maxwill P.; Brunker, David L.; Dawiedczyk, Daniel L.; Lopata, John E., Impedance-tuned connector.
  390. Maxwill P. Bassler ; David L. Brunker ; Daniel L. Dawiedczyk ; John E. Lopata, Impedance-tuned connector.
  391. Brunker, David L.; Dawiedczyk, Daniel L.; Bassler, Maxwill P.; Casher, Patrick R., Impedance-tuned terminal contact arrangement and connectors incorporating same.
  392. Finsterwalder Klemens (Ratingen-Hsel DEX) Spirres Jrgen (Ratingen DEX), Impervious layer formation process and landfill adsorption system.
  393. Lok Gordon, Insert molded compression connector.
  394. Goodman Joseph R. (Lake City PA) Woratyla John A. (Camp Hill PA) Zell Dale R. (Elizabethtown PA), Insulation displacing connector with programmable ground bussing feature.
  395. Pretchel David A. (Madison OH) Venaleck John T. (Madison OH), Integrally molded card edge cable termination assembly, contact, machine and method.
  396. Herbst ; II Gerhardt G. (1161 N. Woodsmill Rd. ; Apt C Chesterfield MO 63017), Integrated circuit cooling apparatus.
  397. Variot Patrick (San Jose CA) Chia Chok J. (Campbell CA) Trabucco Robert T. (Los Altos CA), Integrated circuit having a coplanar solder ball contact array.
  398. Scott L. Noble, Integrated circuit socket having a built-in voltage regulator.
  399. Polonio John D. (625 NE. 22nd Ave. Canby OR 97013), Interconnection mechanisms for electronic components.
  400. Behun John R. (Poughkeepsie NY) Call Anson J. (Poughkeepsie NY) Cappo Francis F. (Wappingers Falls NY) Cole Marie S. (Wappingers Falls NY) Hoebener Karl G. (Georgetown TX) Klingel Bruno T. (Hopewell , Interconnection structure and test method.
  401. Gailus, Mark W., Interconnection system with improved high frequency performance.
  402. Shih Da-Yuan ; Lauro Paul ; Fogel Keith Edward ; Beaman Brian ; Norcott Maurice, Interconnector with contact pads having enhanced durability.
  403. Egitto,Frank D.; Lin,How T., Interposer for use with test apparatus.
  404. Nelson, Richard A.; Humbert, Gary; Sweeney, Kathleen A.; Avery, Hazelton P.; McGowan, Daniel B.; Fromm, Galen F., Interstitial ground assembly for connector.
  405. Sakurai,Toshikazu; Sakatani,Atsushi, Joint connector and method of assembling it.
  406. Bogiel,Steven B.; Carlson,Thomas J.; Hendrickson,William P.; McGowan,Daniel B.; Miller,Steven D.; Patel,Arvind, Laminated electrical terminal.
  407. Oesterheld Klaus (Woodside NY) Franovic Michael (Forest Hills NY) Martinez Carlos (Brooklyn NY), Lampholder having internal cooling passages.
  408. Mao James ; Franklin James Robert ; Chen Chi Ray, Landfill system and method for constructing a landfill system.
  409. Fogg Michael W. (Harrisburg PA) Hackman John A. (Elizabethtown PA) Markle Kenneth E. (York PA) Shuey John R. (Mechanicsburg PA), Lead frame and electrical connector.
  410. Swamy Deepak (Austin TX) Pecone Victor (Austin TX), Leadless high density connector.
  411. Aisenbrey, Thomas, Low cost electrical cable connector housings and cable heads manufactured from conductive loaded resin-based materials.
  412. Keglewitsch Josef (Addison IL) Vladic Daniel P. (Berwyn IL), Low cost electrical connector.
  413. Stoddard, Donald J.; Schumacher, Matthew J., Low cost high speed connector.
  414. Elco Richard A. ; Fusselman David F., Low cross and impedance controlled electric connector.
  415. Elco Richard A., Low cross talk and impedance controlled electrical cable assembly.
  416. Elco Richard A. ; Fusselman David F., Low cross talk and impedance controlled electrical connector.
  417. Elco, Richard A.; Lemke, Timothy A.; Houtz, Timothy W., Low cross talk and impedance controlled electrical connector with solder masses.
  418. Garcin Michel,FRX, Low cross-talk network connector.
  419. Arnett Jaime Ray ; Pharney Julian Robert, Low crosstalk connector configuration.
  420. Ishizuka Shigeo (Shizuoka JPX) Kuzuno Katsutoshi (Shizuoka JPX) Sakurai Kazuaki (Shizuoka JPX), Low insertion-force terminal.
  421. Bierck Barnes R. (P.O.Box 18134 Washington DC 20036), Low permeability waste containment construction and composition containing granular activated carbon and method of makin.
  422. Englert ; Jr. Michael W. (Middletown PA) Summers Donald J. (Shiremanstown PA), Low profile board to board connector.
  423. Lemke Timothy A. ; Houtz Timothy W., Low profile connector.
  424. Lemke Timothy A. ; Houtz Timothy W., Low profile connector.
  425. Richard J. Middlehurst ; Donald E. Wood ; Robert S. Jetter ; Robert G. Foley, Low profile connector assembly and pin and socket connectors for use therewith.
  426. Winings Clifford L. ; Marshall Robert E. ; Spickler John M., Low profile double deck connector with improved cross talk isolation.
  427. Wu, Jerry, Low profile electrical connector having improved contacts.
  428. French Jay L. (Middletown PA) Himes ; Jr. John L. (Hummelstown PA) Weber Ronald M. (Lebanon PA) Wise James H. (Palmyra PA), Low profile spring contact with protective guard means.
  429. Melton Cynthia M. (Bolingbrook IL) Cholewczynski Kenneth (Streamwood IL) Moore Kevin D. (Schaumburg IL) Raleigh Carl (Cary IL), Low temperature method for forming solder bump interconnections to a plated circuit trace.
  430. Wang Shaw-Jong,TWX ; Shen Chi-Jung,TWX ; Chang Hsin-Hua,TWX, Luminous disk.
  431. Furusawa Keisuke (Yokohama JPX) Orimo Takao (Machida JPX) Suzuki Takuya (Kawasaki JPX), Manufacturing method for a supermicro-connector.
  432. Brunker David L. ; Bassler Maxwill P. ; Gardner Michael J. ; Leonard Russell J., Matable electrical connectors having signal and power terminals.
  433. Stokoe, Philip T.; Cohen, Thomas S., Matrix connector.
  434. Minich,Steven E., Mechanically robust lead frame assembly for an electrical connector.
  435. Fukasawa Hideyuki (Hadano JPX) Kobayashi Mamoru (Hadano JPX) Wanami Masahiro (Hadano JPX), Method and apparatus for aligning solder balls.
  436. Denton Ronald D. (Spring TX), Method and apparatus for assembling ball grid array components on printed circuit boards by reflowing before placement.
  437. Hayes Donald J. (Plano TX) Boldman Michael T. (Garland TX) Wallace David B. (Dallas TX), Method and apparatus for dispensing spherical-shaped quantities of liquid solder.
  438. McGill Scott D. (Tucson AZ), Method and apparatus for filling a ball grid array.
  439. Chiu George W. (Palo Alto CA), Method and apparatus for forming solder balls and solder columns.
  440. Englert Christopher J. (Novi MI) Dragun James (Farmington Hills MI), Method and apparatus for improving degradation of an unsecured landfill.
  441. Jimarez Lisa J. ; Heim Craig G., Method and apparatus for insulating moisture sensitive PBGA's.
  442. Giroir, Didier; Hericourt, Olivier, Method and apparatus for providing logical unit definitions for telenet servers.
  443. Cuthbert, David, Method and apparatus for reducing signal timing skew on a printed circuit board.
  444. Lannie R. Bolde ; James Hennekens ; Gregory M. Johnson ; David Olson, Method and apparatus for removing known good die.
  445. Kehley Glenn Lee ; Myrto Glenn Edward ; Sherman John Henry, Method and apparatus for separable interconnecting electronic components.
  446. Kirby Thomas P. (Lake Worth FL) Greenwood Jonathon G. (Lake Worth FL) Juchniewicz Edward (Delray Beach FL) Neiconi Ovidiu (Boynton Beach FL), Method and apparatus for solder sphere placement using an air knife.
  447. Metzger Donald D. (Alma MI) Merriman Jeffrey E. (Mt. Pleasant MI), Method and reservoir for in-ground containment of liquid waste.
  448. Johary Ajay (Rochester MN), Method and transfer plate for applying solder to component leads.
  449. Szu Ming-Lun,TWX, Method for adjusting differential thermal expansion between an electrical socket and a circuit board.
  450. Wilson Howard P. (Austin TX) Martin Fonzell D. J. (Austin TX), Method for attaching conductive balls to a substrate.
  451. Angulas Christopher G. (Endicott NY) Flynn Patrick T. (Owego NY) Funari Joseph (Vestal NY) Kindl Thomas E. (Endwell NY) Orr Randy L. (Vestal NY), Method for bonding flexible circuit to circuitized substrate to provide electrical connection therebetween using differe.
  452. Sakemi Shoji (Fukuoka JPX) Sakai Tadahiko (Fukuoka JPX), Method for forming bump electrode.
  453. Mosquera RenA. (Laguna Niguel CA) Powell ; Sr. Jimmy W. (Naperville IL), Method for forming electrical terminal.
  454. Lakritz, Mark N.; Ordonez, Jose; Tubiola, Peter J., Method for forming elongated solder connections between a semiconductor device and a supporting substrate.
  455. Chiou Song-Rong,TWX ; Huang Nan-Tsung,TWX ; Tsai Hui-Tze,TWX, Method for insert molding a contact module.
  456. Chao-Hsu Chen TW; Ming-Wu Lee TW; Kun-Tsan Wu TW, Method for manufacturing a high density connector.
  457. Shimada Hiroaki,JPX ; Yasojima Koji,JPX ; Takeuchi Shigeyuki,JPX, Method for manufacturing insert-resin-molded product.
  458. Reed Carl G. (Clemmons NC), Method for producing contact shorting bar insert for modular jack assembly.
  459. da Costa Alves Francisco (Boca Raton FL) Suppelsa Anthony B. (Coral Springs FL) Thompson Kenneth R. (Sunrise FL), Method for solder application and reflow.
  460. Funari Joseph (Vestal NY) Moore Ronald J. (Binghamton NY), Method for soldering a semiconductor device to a circuitized substrate.
  461. Caletka,David Vincent; Darbha,Krishna; Henderson,Donald W.; Lehman,Lawrence P.; Thiel,George Henry, Method of accommodating in volume expansion during solder reflow.
  462. Braun Carol (Clifton VA) Correia George C. (Warrenton VA) Konecke-Lease Sheila (Leesburg VA) Cummings Richard W. (Dumfries VA), Method of aligning and mounting solder balls to a substrate.
  463. Tamura Akira (Kawasaki JPX) Sakai Hidehisa (Kawasaki JPX) Nishihara Mikio (Kawasaki JPX) Kawano Kyoichiro (Kawasaki JPX), Method of assembling a connector using frangible contact parts.
  464. Lee, Charles-Wee-Ming; Strack, Helmut, Method of assembling a semiconductor device package.
  465. Bitaillou Alex (Bretigny sur Orge FRX) Masson Jean (Noisy/Ecole FRX) Lemoine Jean-Marie (Saint-Michel-sur-Orge FRX), Method of bonding connecting pins to the eyelets of conductors formed on a ceramic substrate.
  466. Jaffe Donald (Emmaus PA) Kershner Richard C. (Whitehall PA) Panousis Nicholas T. (Wescosville PA), Method of bonding electronic components.
  467. Angulas Christopher G. (Endicott) Flynn Patrick T. (Owego) Funari Joseph (Vestal) Kindl Thomas E. (Endwell) Orr Randy L. (Vesal NY), Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different.
  468. Schwiebert Matthew K. (Palo Alto CA) Campbell Donald T. (Campbell CA) Heydinger Matthew (Mountain View CA) Kraft Robert E. (Santa Clara CA) Vander Plas Hubert A. (Palo Alto CA), Method of bumping substrates by contained paste deposition.
  469. Natarajan Siva (Gilbert AZ) Mallik Debendra (Chandler AZ), Method of controlling solder ball size of BGA IC components.
  470. Danner Paul A. (Beaverton OR), Method of fabricating solder ball array.
  471. Caletka David V. ; Johnson Eric A., Method of forming BGA interconnections having mixed solder profiles.
  472. Hwang Hyunsang (Seoul KRX), Method of forming a silicon insulating layer in a semiconductor device.
  473. Mandai Harufumi (Nagaokakyo JPX) Chigodo Yoshikazu (Nagaokakyo JPX) Tojyo Atsushi (Nagaokakyo JPX), Method of forming bump electrodes.
  474. Sakai Tadahiko (Fukuoka JPX), Method of forming solder bumps on electrodes of electronic component.
  475. Bitaillou Alexis (Bretigny sur Orge FRX) Grandguillot Michel (Verrieres le Buisson FRX), Method of forming solder terminals for a pinless ceramic module.
  476. Belgacem Haba ; Anthony B. Faraci, Method of making a connection to a microelectronic element.
  477. Hillbish Warren Christian ; McCleerey Earl William, Method of making a contact assembly.
  478. McKee Michael J. (New Cumberland PA) Pawlikowski Joseph M. (Lancaster PA), Method of making a pin grid array and terminal for use therein.
  479. Altman Leonard F. (Coral Springs FL) Flaugher Jill L. (Margate FL) Suppelsa Anthony B. (Coral Springs FL) Mullen ; III William B. (Boca Raton FL), Method of making high density solder bumps and a substrate socket for high density solder bumps.
  480. Thenaisie Jacky,FRX ; Heulot Jacques-Henri,FRX, Method of making miniature shielded connector with elbow contact shafts.
  481. Matsui Kiyoshi,JPX ; Ono Takayuki,JPX ; Kasai Kenichi,JPX ; Imai Tsutomu,JPX ; Suzuki Morio,JPX ; Fukasawa Hideyuki,JPX ; Shirai Mitugu,JPX ; Murakawa Toshitaka,JPX ; Siokawa Takeji,JPX ; Kuroda Take, Method of making multi-pin connector.
  482. Hayes Donald J. (Plano TX), Method of making solder interconnection arrays.
  483. Anderson ; Jr. Herbert R. (Patterson NY) Bross Arthur (Poughkeepsie NY) Cempa Julian G. (Deposit NY) Lussow Robert O. (Hopewell Junction NY) Myers Donald E. (Poughkeepsie NY) Walsh Thomas J. (Poughke, Method of manufacturing a high density connector system.
  484. Nishiyama Youichi (Tsu JPX) Ono Hisahiro (Tsu JPX), Method of manufacturing an electrical connector.
  485. Minich,Steven E.; Kolivoski,Christopher J., Method of manufacturing electrical power connector.
  486. Sakemi Shoji (Fukuoka JPX) Wada Yoshiyuki (Onojo JPX), Method of mounting an electronic part with bumps on a circuit board.
  487. Guzik Andrzej T. (Ft. Lauderdale FL), Method of mounting interrelated components.
  488. Beall Gary W. (Austin TX), Method of organic waste disposal.
  489. Quinones, Maria Clemens Y.; Baje, Gilmore S.; Estacio, Maria Christina B.; Gestole, Marvin R.; Ledon, Oliver M.; Mepieza, Santos E., Method of packaging a plurality of devices utilizing a plurality of lead frames coupled together by rails.
  490. Ritchie Leon T. (Mechanicsburg PA) Peppler Michael S. (Lancaster PA), Method of producing insulated terminals.
  491. Wydro, Sr., Richard A., Method of producing solder spheres.
  492. Fuchs Harold E. ; Law Henry Hon ; Muth Daniel George, Method of providing corrosion protection.
  493. Clawson Robert A. (Kokomo IN) Thome John R. (Fort Worth TX), Method of soldering components to printed circuit boards.
  494. Updike Theresa Ann ; King Richard Scott ; Coles Michael Thomas, Method of wave soldering thin laminate circuit boards.
  495. Whitfield Fred J. (1405 S. Village Way Santa Ana CA 92705) Doyel Arthur T. (4402 Casa Oro Yorba Linda CA 92686), Methods and materials for conducting heat from electronic components and the like.
  496. Spink, Jr., William E., Mezzanine-type electrical connector.
  497. Ko David Tso-Chin ; Zhao Jim ; Juntwait Eric, Micro connector assembly and method of making the same.
  498. Takahashi ; Eikichi ; Taguchi ; Toshihiko ; Fujikura ; Kazuo ; Sudo ; To shihisa, Microsphere of solder having a metallic core and production thereof.
  499. Kwong, Herman; Goulette, Richard R., Midplane configuration featuring surface contact connectors.
  500. Cohen,Thomas S.; Cartier, Jr.,Marc B.; Gallus,Mark W., Midplane especially applicable to an orthogonal architecture electronic system.
  501. Dixon Daniel A. (Naperville IL) Lee Hsin (Naperville IL) Mysiak Eugene J. (Cicero IL) Zielke Henry (Hoffman Estates IL), Miniature circular DIN connector.
  502. Thenaisie Jacky,FRX ; Heulot Jacques-Henri,FRX, Miniature shielded connector with elbow contact shafts.
  503. Crane, Jr., Stanford W.; Jeon, Myoung-soo; Nickel, Josh, Modular coaxial electrical interconnect system having a modular frame and electrically shielded signal paths and a method of making the same.
  504. Trout,David Allison; Whyne,Richard Nicholas; Blanchfield,Michael Allen, Modular connector family for board mounting and cable applications.
  505. Miskin Michael J. (Naperville IL) Zahlit Wayne A. (Downers Grove IL), Modular drawer connector.
  506. Paagman Bernardus L. F.,NLX, Modular electrical PCB assembly connector.
  507. Czaja Edwin E. (Mount Prospect IL), Modular electrical connector.
  508. Cohen, Thomas S., Modular electrical connector and connector system.
  509. Champion Patrick (Change FRX) Thenaisie Jacky (Le Mans FRX), Modular electrical-connection element.
  510. Champion Patrick (Le Mans FRX) Thenaisie Jacky (Le Mans FRX), Modular electrical-connection element.
  511. Lebo, Steve I., Modular electronics system package.
  512. McCoy Phillip A. (Laotto IN), Modular furniture power distribution system and electrical connector therefor.
  513. Shuey,Scott Anthony; Briant,Eric David; Glover,Douglas Wade, Modular high speed connector assembly.
  514. Johnescu, Douglas Michael; Clewell, Craig W.; Johnson, Lewis R., Modular mezzanine connector.
  515. Johnescu,Douglas Michael; Clewell,Craig W.; Johnson,Lewis R., Modular mezzanine connector.
  516. Johnescu,Douglas Michael; Clewell,Craig W.; Johnson,Lewis R., Modular mezzanine connector.
  517. Weber Ronald M. (Lebanon PA), Modular plug-in connection means for flexible power supply of electronic apparatus.
  518. LeMaster Dolan M., Modular power connector assembly.
  519. Marko Spiegel ; David E. Dunham, Modular shielded coaxial cable connector.
  520. Laphan, Dennis C.; Rojdev, Ilija, Molded casket shell and trim therefore.
  521. Blanchfield, Michael Allen; Garland, Michael Stephen; Conner, Troy Everette; Shiffler, James Charles, Multi-beam power contact for an electrical connector.
  522. Tengler John N. (Chico CA), Multi-conductor cable/contact connection assembly and method.
  523. Akaba Yukio (Chiba JPX) Sakuramoto Akihiko (Tokyo JPX), Multi-drop type bus line system.
  524. Allison, Jeffrey W.; Mostoller, Matthew E.; Rohrbaugh, Brian M., Multi-interface power contact and electrical connector including same.
  525. Romine Edward L. (Hoffman Estates IL) Byczek Roger W. (Westchester IL), Multi-pin electrical header.
  526. Brown, John B.; Weller, Steven A., Multi-sequenced contacts from single lead frame.
  527. Sasaki Takinori (Kawasaki JPX) Tayama Yukiharu (Tokyo JPX), Multicontact connector for signal transmission.
  528. Dodson Douglas A., Multiple fan cooling device.
  529. Wanjura Gunter (Kungsngen SEX), Multipolar screened connector having a common earth.
  530. Fogg,Michael W., Noise canceling differential connector and footprint.
  531. Egan, Philip A., Non-fluorocarbon oil and grease barrier methods of application and packaging.
  532. Ishigami, Yoshiaki, Optical connector and lens block connecting structure, and optical module.
  533. Tamura, Kenichi; Ishigami, Yoshiaki, Optical module.
  534. Rothermel,Brent Ryan; Morgan,Chad William; Davis,Wayne Samuel; Sharf,Alex Michael; Helster,David Wayne, Orthogonal connector.
  535. Davis, Wayne Samuel; Whiteman, Jr., Robert Neil, Orthogonal connector system.
  536. Ueda, Hirohisa; Kondo, Hiroki; Murayama, Toshisada, Piercing terminal and machine and method for crimping piercing terminal.
  537. Lappoehn, Jürgen, Plug connector that can be turned by 90°.
  538. Lapp철hn,J체rgen, Plug-and-socket connector.
  539. Lapp철hn,J체rgen, Plug-in connector.
  540. Wulff W.-Peter, Plug-in connector with contact surface protection in the plug-in opening area.
  541. Clark Stephen L. ; Shuey Joseph B. ; Ortega Jose L. ; Brown ; III John B., Power connector.
  542. Clark, Stephen L.; Shuy, Joseph B.; Ortega, Jose L.; Brown, III, John B., Power connector.
  543. Clark,Stephen L.; Shuey,Joseph B.; Ortega,Jose L.; Brown, III,John B., Power connector.
  544. Clark,Stephen L.; Shuey,Joseph B.; Ortega,Jose L.; Brown, III,John B., Power connector.
  545. Jared Joseph Smalley, Jr., Power connector.
  546. Rothermel, Brent Ryan; Sharf, Alex Michael; Glover, Douglas W., Power connector.
  547. Schell, Mark S.; Treece, Edward; Daily, Christopher, Power connector.
  548. Toh, Ser Kiat; Ng, Aik Leng; Chia, Thiam Hsin; Lim, Poh Teck, Power connector.
  549. Ling, Yun; Tong, Daniel, Power connector for high current, low inductance applications.
  550. Wagner, Douglas L., Power connector with male and female contacts.
  551. Allison, Jeffrey W., Power connector with vertical male AC power contacts.
  552. Swain, Wilfred J., Power contact having conductive plates with curved portions contact beams and board tails.
  553. Ngo,Hung Viet; Swain,Wilfred J., Power contact having current flow guiding feature and electrical connector containing same.
  554. Zanolli James R., Press fit print circuit board connector.
  555. Soes Lucas (Rosmalen NLX) van Dijk Petrus R. M. (\s-Hertogenbosch NLX), Prestressed shielding plates for electrical connectors.
  556. Ito Masahiro,JPX, Printed board connector having contacts with bent terminal portions extending into an under space of the connector housing.
  557. Bibee,Matthew L., Printed circuit board and method of reducing crosstalk in a printed circuit board.
  558. Longueville Jacques,BEX, Printed circuit board connector.
  559. Pape, Gunter; Kohler, Andreas, Printed circuit board connector.
  560. Worth Sidney V. (Flourtown PA), Printed circuit board connector.
  561. Bogursky Robert M. (Easton CT) Bradley Robert M. (Oakville CT) Jones John E. (Waterbury CT) Gugliotti Carmine (Waterbury CT), Printed circuit board connector system.
  562. Cohen, Thomas S.; Patel, Gautam L., Printed circuit board for differential signal electrical connectors.
  563. Morley Richard E. (Mason NH) Baker David A. (Mason NH), Printed circuit board heat sink.
  564. Kiat Toh Ser,SGX, Printed circuit board mounted electrical connector.
  565. LoVasco Francis (Roxbury Township NJ) Oien Michael A. (Chatham Township ; both of Morris County NJ), Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate.
  566. Ortega, Jose L.; Olson, Stanley W., Profiled header ground pin.
  567. Weber Ronald M. (Lebanon PA) Swengel ; Jr. Robert C. (York PA) Weidler Charles H. (Lancaster PA) Wise James H. (Palmyra PA), Programmable modular connector assembly.
  568. Weber Ronald M. (Lebanon PA) Van Scyoc William C. (Shippensburg PA), Programmable modular connector assembly.
  569. Terry John Burkhardt ; Robert Tan Li ; Aspy Keki Mehta ; Udo M. Stehling ; William T. Haygood, Jr. ; Francis C. Rix ; Dawn C. Wiser, Propylene impact copolymers.
  570. McGowan, Daniel B.; O'Malley, Brian; Regnier, Kent E., Pseudo-coaxial wafer assembly for connector.
  571. Lees William F., Punch and die for producing connector plates.
  572. Sweeney Richard E., RF amplifier assembly with reliable RF pallet ground.
  573. Bruns Michael W., Reduced crosstalk microstrip transmission-line.
  574. Smith,Stephen B.; De Geest,Jan; Sercu,Stefaan Hendrik Jozef, Reducing suck-out insertion loss.
  575. Glover Douglas W. (Harrisburg PA) Granitz Richard F. (Harrisburg PA), Reference conductor for improving signal integrity in electrical connectors.
  576. Healy ; Jr. Jerry V. (Raleigh NC), Replaceable intermediate socket and plug connector for a solid-state data transfer system.
  577. Mitra Niranjan,NLX ; Paagman Bernardus L. F.,NLX, Right-angle connector.
  578. Lebo, Steve I.; Sellner, Scott J., Ruggedized electronic module cooling system.
  579. Mindheim ; deceased Daniel J. (20020 Rodrigues Ave. ; Apt. D. late of San Jose CA) Mindheim ; executrix by Joyce E. (20020 Rodrigues Ave. ; Apt. D. Cupertino CA 95014), Safety socket assembly.
  580. Lorrain Henri L. P. (Brussels BEX), Safety unit for an electric 3-phase circuit.
  581. Larose, Claude, Saw tooth.
  582. Andrews Derek,NLX ; Paagman Bernardus,NLX, Selectively metallized connector with at least one coaxial or twin-axial terminal.
  583. Campbell Jeffrey Scott ; Holton James Thomas, Self-aligning flexible circuit connection.
  584. Olson, Stanley W.; Shuey, Joseph B., Self-centering connector with hold down.
  585. Broeksteeg Johannes M. (Hertogsingel NLX), Shielded back plane connector.
  586. Broeksteeg Johannes M. (Oss NLX), Shielded back plane connector.
  587. Gilissen Hermanus P. J. (Esch NLX) Broeksteeg Johannes M. (Oss NLX), Shielded backplane connector.
  588. Van Woensel, Johannes M. B.; Volstorf, James R., Shielded cable connector.
  589. Lemke Timothy, Shielded circuit board connector module.
  590. Van Woensel Johannes Maria Blasius,NLX, Shielded connector.
  591. Davis Wayne Samuel ; Shiu Leung Man, Shielded electrical connector.
  592. Lin Cheng-Te,TWX, Shielded electrical connector.
  593. McNamara David M. (Lyndeborough NH) Provencher Daniel B. (Weare NH) Stokoe Philip T. (Attleboro MA) Howard William E. (New Boston NH) Gailus Mark W. (Somerville MA), Shielded electrical connector.
  594. Niwa Takeo (Kawasaki JPX) Fujiura Yoshitsugu (Tokyo JPX) Kodama Hiromitsu (Kanazawa JPX), Shielded electrical connector.
  595. Wu Kun-Tsan,TWX, Shielded electrical connector.
  596. Bertoncini Daniel B. ; Stoner Stuart C. ; Doutrich Ray C., Shielded header.
  597. Daniel B. Bertoncini ; Stuart C. Stoner ; Ray C. Doutrich, Shielded header.
  598. Astbury, Jr., Allan L; Cohen, Thomas S., Shielded waferized connector.
  599. Winings,Clifford L.; Shuey,Joseph B.; Lemke,Timothy A.; Hull,Gregory A.; Smith,Stephen B.; Sercu,Stefaan Hendrik Jozef; Houtz,Timothy W.; Minich,Steven E., Shieldless, high-speed electrical connectors.
  600. Minich, Steven E.; Johnescu, Douglas M.; Sercu, Stefaan Hendrik Jozef; Buck, Jonathan E., Shieldless, high-speed, low-cross-talk electrical connector.
  601. Minich,Steven E.; Johnescu,Douglas M.; Sercu,Stefaan Hendrik Jozef; Buck,Jonathan E., Shieldless, high-speed, low-cross-talk electrical connector.
  602. Doutrich, Ray C., Shroud retention wafer.
  603. Ray C. Doutrich, Shroud retention wafer.
  604. Scholz James P. (New Cumberland PA) Griffith Gregory G. (Carlisle PA) Yohn Brent D. (Newport PA), Shunt connector.
  605. Mosquera Rene A. (Laguna Niguel CA) Lin Michael A. (Anaheim CA), Simplified contact connector system.
  606. Scholz, Wolfhard; Meyer zu Schlochtern-Maric, Katrin; Wadle, Armin, Skin cleansing gel having a heating effect.
  607. Fussell Don L. (16818 Bobcat Trail Cypress TX 77429), Snap on cable connector.
  608. Adam Weisz-Margulescu CA, Snap-on plug coaxial connector.
  609. Schmaling, David N.; Byrnes, Francis E., Snubber.
  610. Middlehurst, Richard J.; Wood, Donald E.; Jetter, Robert S.; Foley, Robert G., Socket assembly and female connector for use therewith.
  611. Frankeny Richard Francis (Elgin TX) Frankeny Jerome Albert (Taylor TX) Massey Danny Edward (Georgetown TX) Vanderlee Keith Allan (Austin TX), Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer.
  612. Dozier ; II Thomas H. ; Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Sockets for electronic components and methods of connecting to electronic components.
  613. Danner Paul A. (Beaverton OR), Solder ball array.
  614. Isaacs Phillip D. (Rochester MN) Knotts Gregg A. (Rochester MN) Swain Miles F. (Hayfield MN) Towne Burton A. (Austin MN), Solder ball connect pad-on-via assembly process.
  615. Acocella John (Hopewell Junction NY) Banks Donald R. (Pflugerville TX) Benenati Joseph A. (Hopewell Junction NY) Caulfield Thomas (Croton Fall NY) Hoebener Karl G. (Georgetown TX) Watson David P. (Be, Solder ball interconnected assembly.
  616. Namekawa Masatoshi (Tanashi JPX) Ibuki Yoshiteru (Tanashi JPX) Iguchi Norio (Tanashi JPX) Okuno Masatoshi (Nagano JPX), Solder ball supply device.
  617. Noschese Rocco (Wilton CT), Solder mounting of electrical contacts.
  618. Boyd Alexander (Largs GB6) French William (Bearsden GB6) Lees Stuart P. (Gourock GB6) Murray Kenneth S. (Inverkep GB6) Robertson Briand L. (Gourock GB6), Solder particle deposition.
  619. Fjelstad Joseph ; DiStefano Thomas H. ; Smith John W., Soldering with resilient contacts.
  620. Straub Jurgen,DEX, Soldering/unsoldering arrangement.
  621. Phillips Quentin, Stab connector assembly.
  622. Weber Ronald M. (Lebanon PA), Stackable connector assembly.
  623. Azuma Youichiro (Tokyo JPX) Kitamura Shigeyasu (Tokyo JPX), Stacking connector assembly of variable size.
  624. Studnicky, III, George B., Stage pin connector.
  625. Provencher Daniel B. (Weare NH) Stokoe Philip T. (Attleboro MA) McNamara David M. (Amherst NH), Stiffener for electrical connector.
  626. Murakami, Yoshinori, Structure of wiring connection.
  627. Nishiguchi Masanori (Yokohama JPX) Miki Atsushi (Yokohama JPX), Substrate for packaging a semiconductor device.
  628. Apap Joseph A. (Endicott NY) Brown Mark A. (Whitney Point NY) Emerick Alan J. (Warren Center PA) Miller Thomas L. (Vestal NY) Murray James R. (Owego NY) Sissenstein ; Jr. David W. (Endwell NY), Substrate soldering in a reducing atmosphere.
  629. Glover Douglas W. (Harrisburg PA) Harner Donald R. (Camp Hill PA), Surface mount HDI contact.
  630. Gaudenzi Gene J. (Purdys NY) Mosley Joseph M. (Boca Raton FL) Tuozzolo Vito J. (Boca Raton FL) Milliken John C. (Patterson NY), Surface mount chip package having an array of solder ball contacts arranged in a circle and conductive pin contacts arra.
  631. Hartman John E. (Painesville OH) Venaleck John T. (Madison OH), Surface mount compatible connector system with mechanical integrity.
  632. McCoy Michael J. (Lyndhurst OH) Hartman John E. (Painesville OH) Wesbster John L. (Painesville OH), Surface mount compatible connector system with solder strip and mounting connector to PCB.
  633. Paagman Bernardus L. F.,NLX, Surface mount connector with integrated PCB assembly.
  634. Chroneos ; Jr. Robert J. ; Ekhlassi Hamid, Surface mount connector with pins in vias.
  635. Weiss Michael L. (Coral Springs FL), Surface mount interposer.
  636. Kassa, Kenneth E.; Pandey, Vinayak, Surface mount socket contact providing uniform solder ball loading and method.
  637. Taylor Attalee S., Surface mount socket for an electronic package, and contact for use therewith.
  638. Degani Yinon (Highland Park NJ) Dudderar Thomas D. (Chatham NJ) Woods ; Jr. William L. (Keithville LA), Surface mount solder assembly of leadless integrated circuit packages to substrates.
  639. Schmedding George R. (Hummelstown PA), Surface mountable electrical connector.
  640. Minich,Steven E., Surface-mount connector.
  641. Belopolsky, Yakov; Zahlit, Wayne Arnold, Surface-mounted right-angle electrical connector.
  642. Sample Stephen P. ; Goode Terry L., Switching midplane and interconnecting system for interconnecting large numbers of signals.
  643. Helfgott Theodore (Highland Park NJ) Corn Michael R. (Brentwood TN), System and process for treatment of biodegradable waste.
  644. Herriot Robert G., System, method, apparatus and article of manufacture for identity-based caching (#15).
  645. Frangioso, Jr.,Ralph C.; Wierzbicki,Robert; Schillinger,Michael L., Techniques for connecting midplane connectors through a midplane.
  646. Smorzaniuk ; Adam ; Lindlau ; Paul F., Terminal block with encapsulated heat sink.
  647. Matthews Russell H. (Modesto CA), Terminal bus junction with multiple, displaced contact points.
  648. Schell Howard C. (Westerville OH), Terminal grounding unit.
  649. Richard Scott Kline, Terminal module having open side for enhanced electrical performance.
  650. Masao Ohkita TW; Chao-Chung Cheng TW; Nick Lin TW; Fang-Chu Liao TW, Terminal of socket connector.
  651. Lemke Timothy A. (Carlisle PA), Terminator and corresponding receptacle for multiple electrical conductors.
  652. Li, Che-Yu; Fan, Zhineng; Van, Linh, Test and burn-in connector.
  653. Kresge John S. ; Wilcox James R., Thermal stress relieving substrate.
  654. Block Jacob (Rockville MD) Rice Roy W. (Alexandria VA) Morgan Charles R. (Brookeville MD), Thermally conductive elastomer.
  655. Block Jacob (Rockville MD) Lau John W. K. (Gaithersburg MD), Thermally conductive elastomer containing alumina platelets.
  656. Liberty James (Hollis NH) Jones Peter (Londonderry NH), Thermally conductive electrical assembly.
  657. Liberty James (Hollis NH) Jones Peter (Londonderry NH), Thermally conductive interface materials and methods of using the same.
  658. Li, Che-Yu; Fan, Zhineng; Brown, Dirk D., Thermally enhanced interposer and method.
  659. Wen Jemmy,TWX, Trench-shaped read-only memory and its method of fabrication.
  660. Cobaugh Robert F. (Elizabethtown PA) Lynch James E. (Harrisburg PA) Taylor Attalee S. (Palmyra PA), Trifurcated card edge terminal.
  661. Lin, Wei-Chung; Lin, Chih-Nan; Chung, Jui-Kuang; Chung, Wei-Te, Triple mating configurations of connector.
  662. Fuerst Charles Floyd (Brooklyn Park MN), Tuning fork connector.
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  664. Cohen, Thomas S.; Astbury, Jr., Allan L; Allen, Steven J., Waferized power connector.
  665. DeBusk Thomas A., Wastewater treatment system and method.
  666. Shinchi Akira (Shizuoka JPX), Waterproof electrical connector.
  667. Zimmerman ; Jr. John A. (Hershey PA) Long William B. (Camp Hill PA), Wiring line tap.
  668. Anhalt John W. (Orange CA), Zero insertion force connector.
  669. Sinclair William Y. (Frenchtown NJ), Zero insertion force connector.
  670. Kozel Charles A. (McHenry IL), Zero insertion force miniature grid array socket.
  671. Wang Hsing-Sheng (Chungli TWX), Zero insertion force socket.

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  3. Johnescu, Douglas M.; Buck, Jonathan E., Electrical connector having ribbed ground plate.
  4. Buck, Jonathan E.; Stoner, Stuart C.; Minich, Steven E.; Johnescu, Douglas M.; Smith, Stephen B., Electrical ground shield.
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  7. Au, Ching; Peng, David; Zegzula, Dennis, Surface mount device.
  8. Au, Ching; Peng, David; Zegzula, Dennis, Surface mount device.
  9. Au, Ching; Peng, David; Zegzula, Dennis, Surface mount device.
  10. Buck, Jonathan E.; Stoner, Stuart C.; Minich, Steven E.; Johnescu, Douglas M.; Smith, Stephen B., Vertical electrical connector.
  11. Buck, Jonathan E.; Stoner, Stuart C.; Minich, Steven E.; Johnescu, Douglas M.; Smith, Stephen B., Vertical electrical connector.
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