Commissariat á l'énergie atomique et aux énergies alternatives
대리인 / 주소
Occuhiuti & Rohlicek LLP
인용정보
피인용 횟수 :
1인용 특허 :
4
초록▼
An electronic device includes a heat source, a heat-absorbing cold point, a thermally insulating material for insulating the heat source from the cold point with a conductivity at a use-temperature of electronic device, that is below a thermal-conductivity threshold, and a thermal bridge having firs
An electronic device includes a heat source, a heat-absorbing cold point, a thermally insulating material for insulating the heat source from the cold point with a conductivity at a use-temperature of electronic device, that is below a thermal-conductivity threshold, and a thermal bridge having first and second ends connected by pads to the heat source and the cold point, and a thermal switch. The thermal bridge extends between the two ends and switches reversibly between conductive and non-conductive states. It includes material of variable thermal conductivity capable of switching over, in response to an addition of energy, between a conductive phase and a resistive phase, and a control module for causing the thermal switch to switch between the conductive state and the resistive state.
대표청구항▼
1. An apparatus comprising an electronic device, said electronic device comprising: a heat-generating heat source;a cold point capable of absorbing heat;a thermally insulating material for insulating said heat source from said cold point, said thermally insulating material having a thermal conductiv
1. An apparatus comprising an electronic device, said electronic device comprising: a heat-generating heat source;a cold point capable of absorbing heat;a thermally insulating material for insulating said heat source from said cold point, said thermally insulating material having a thermal conductivity at a use-temperature of said electronic device, said thermal conductivity being below a thermal-conductivity threshold;a thermal bridge, comprising a first end, which is connected to said heat source by an end pad, a second end, which is connected to said cold point by an end pad, and a thermal switch; said thermal bridge extending between said first end and said second end, wherein said thermal switch is capable of switching reversibly between a conductive state, in which a thermal conductivity at said use-temperature takes a first value above said thermal-conductivity threshold to thermally connect said end pads of said thermal bridge to each other, and a resistive state, in which said thermal conductivity at said use-temperature takes a second value below said first value to thermally insulate said two end pads of said thermal bridge from each other;said thermal switch comprising a material of variable thermal conductivity capable of switching over, in response to an addition of energy, between a conductive phase, in which a thermal conductivity of said material at said use-temperature attains said first value to thermally connect said end pads of said thermal bridge when said thermal switch is in said conductive state, and a resistive phase, in which said thermal conductivity of said material at said use-temperature attains said second value to thermally insulate said end pads of said thermal bridge from each other when said thermal switch is in said resistive state; anda control module for causing said thermal switch to switch between said conductive state and said resistive state. 2. The apparatus of claim 1, wherein said control module is configured to cause said thermal switch to automatically switch between said conductive state and said resistive state independently of information indicative of a temperature of one of said heat source and said cold point. 3. The apparatus of claim 1, wherein said second value is less than or equal to said thermal conductivity of said thermally insulating material at said use temperature. 4. The apparatus of claim 1, wherein said electronic device further comprises a block extending in a substrate plane, said block comprising a contact face in thermal contact with said heat source and said cold point, said block comprising a first material, said first material having a thermal conductivity, at a use-temperature of said plate, that is below said thermal-conductivity threshold, wherein said first and second ends of said thermal bridge are defined on said contact face, and wherein said electronic device further comprises a track made of a thermally conductive material to thermally connect said first and second ends, said track being buried inside said block so as to be separated from said contact face by said first material, said thermally conductive material having a thermal conductivity, at said use-temperature, that is above said thermal-conductivity threshold. 5. The apparatus of claim 1, wherein said material of variable thermal conductivity comprises a mixture of thermally insulating fluid and nanoparticles, said thermally insulating fluid having a value of thermal conductivity, at said use-temperature, that is less than or equal to said thermal-conductivity threshold, and wherein said nanoparticles have a value of thermal conductivity that is greater than or equal to said first value at said use-temperature, said nanoparticles being self-aligning along electrical field lines when an electric field is present. 6. The apparatus of claim 1, wherein said electronic device comprises several units of said thermal bridge extending between first and second respective ends, and wherein at least one of said heat source and cold point is capable of shifting, inside said electronic device, from a first end of a first of said thermal bridges to a distinct end of a second of said thermal bridges, wherein said control module is configured for, in response to shifting of said one of said heat source and cold point, identifying a thermal bridge that connects said heat source to said cold point, commanding a switch-over of a switch of said identified thermal bridge from said resistive state to said conductive state, and commanding switch-over of switches of thermal bridges that do not connect a heat source to a cold point from said conductive state to said resistive state. 7. The apparatus of claim 1, wherein a ratio of said first value to said second value is at least greater than or equal to two. 8. The apparatus of claim 1, wherein a ratio of said first value to said second value is at least greater than or equal to five. 9. The apparatus of device according to claim 1, wherein said control module is configured to cause said thermal switch to automatically switch between said conductive state and said resistive state as a function of information indicative of a temperature of one of said heat source and said cold point. 10. The device according to claim 9, wherein said electronic device comprises at least one of a sensor and an estimator for making a measurement of a physical parameter indicative of a temperature at one of said heat source and said cold point. 11. The apparatus of claim 1, wherein said material of variable thermal conductivity comprises a solid electrolyte. 12. The device according to claim 11, wherein said solid electrolyte comprises a metal sulfite. 13. The device according to claim 11, wherein said solid electrolyte comprises a germanium-based chalcogenide. 14. The device according to claim 11, wherein said solid electrolyte comprises ZnCdS. 15. The device according to claim 11, wherein said solid electrolyte comprises GdOx/Cu-Te. 16. An apparatus comprising a plate to direct heat within an electronic device, said plate comprising: a block extending in a substrate plane and having a contact face for thermal contact with a heat source and a cold point said block comprising: a first material having a thermal conductivity, at a use-temperature of said plate, that is below a thermal-conductivity threshold; anda thermal bridge comprising a first end defined on said contact face, and a second end defined on said contact face, said first and second ends of said thermal bridge being connected to said cold point and to said heat source by corresponding first and second end pads, said thermal bridge further comprising a track made of a thermally conductive material to thermally connect said first end and said second end, said track being buried inside said block so as to be separated from said contact face by said first material, said thermally conductive material having a thermal conductivity, at said use-temperature, that is above said thermal conductivity threshold;said thermal bridge further comprising, between at least one of said end pads and said track, a thermal switch capable of switching reversibly between a conductive state, in which said thermal conductivity, at said use-temperature, attains a first value above said conductivity threshold to thermally connect said two end pads of said thermal bridge, and a resistive state, in which said thermal conductivity, at said use-temperature, attains a second value below said first value to thermally insulate said end pads of said thermal bridge. 17. The plate according to claim 16, wherein said track extends between a first part in proximity to said first end pad and a second part in proximity to said second end pad, wherein a first thermal switch is placed between said first end pad and said first part of said track, and wherein a second thermal switch is placed between said second end pad and said second part of said track. 18. The plate according to claim 17, wherein said plate comprises several thermally conductive tracks forming a grating, at least one first track of this grating straddling a second track of said grating so that said first and second tracks face each other in a straddling region, and a third thermal switch interposed between said first and second tracks in said straddling region to thermally connect said first and second tracks and, alternately, to thermally insulate said first and second tracks in response to a switch-over command.
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이 특허에 인용된 특허 (4)
Wolf David A. (Baltimore MD), Heat pipe thermal switch.
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