초록 ▼

At least one cooling channel is positioned adjacent to an electronic component. The cooling channel communicates with plenums at each of two opposed axial ends. A dielectric fluid is received in the cooling channel. The cooling channel is provided with at least one electrode. A potential is applied

At least one cooling channel is positioned adjacent to an electronic component. The cooling channel communicates with plenums at each of two opposed axial ends. A dielectric fluid is received in the cooling channel. The cooling channel is provided with at least one electrode. A potential is applied to the at least one electrode such that an electric field magnitude at the downstream end of the channel is less than an upstream electric field magnitude, and such that a dielectrophoretic force on a bubble in the cooling channel will force it downstream.

대표청구항 ▼

1. An electronic component and cooling system comprising; at least one cooling channel positioned adjacent to an electronic component, said at least one cooling channel communicating with plenums at each of two opposed axial ends;a dielectric fluid received in said cooling channel; andsaid cooling c

1. An electronic component and cooling system comprising; at least one cooling channel positioned adjacent to an electronic component, said at least one cooling channel communicating with plenums at each of two opposed axial ends;a dielectric fluid received in said cooling channel; andsaid cooling channel being provided with at least two electrodes, and a voltage potential is applied to each of said at least two electrodes so that an electric field is formed in said cooling channel such that the electric field magnitude at the downstream end of said cooling channel is less than an upstream electric field magnitude, and such that a dielectrophoretic force on a bubble in said cooling channel will force it downstream; andat least one of said at least two electrodes are electrically resistive electrodes such that its voltage potential varies along its length to create said downstream force. 2. The system as set forth in claim 1, wherein there are a plurality of electronic components, and a plurality of said at least one cooling channel. 3. An electronic component and cooling system comprising: at least one cooling channel positioned adjacent to an electronic component, said at least one cooling channel communicating with plenums at each of two opposed axial ends;a dielectric fluid received in said cooling channel; andsaid cooling channel being provided with at least two electrodes, and a voltage potential is applied to each of said at least two electrodes so that an electric field is formed in said cooling channel such that the electric field magnitude at the downstream end of said cooling channel is less than an upstream electric field magnitude, and such that a dielectrophoretic force on a bubble in said cooling channel will force it downstream; andsaid at least two electrodes includes a plurality of segmented electrodes, and a voltage potential variation is provided by differing potential applied to said segments of said electrodes to create said downstream force. 4. A control stack comprising: a plurality of generally planar electronic controls stacked in a direction generally perpendicular to their generally planar shape;cooling channels positioned intermediate adjacent ones of said plurality of electronic controls, and said cooling channels communicating with plenums at each of two opposed axial ends of said cooling channels;a dielectric fluid received in said cooling channels; andsaid cooling channels being provided with a plurality of electrodes, with adjacent ones of said electrodes extending in a non-parallel direction along an axial direction between said plenums, and such that said adjacent electrodes extend in a direction with an axial component, and a lateral component, and with said lateral component from one said adjacent electrode being opposed to a lateral component from a next said adjacent electrode, and such that a channel defined between said adjacent electrodes increases in width from a smaller upstream end to a larger downstream end, and such that when a voltage potential is applied to adjacent electrodes then a dielectrophoretic force on a bubble in said cooling channel will force it towards said larger downstream end. 5. The control stack as set forth in claim 4, wherein said plurality of electrodes extend along a generally linear direction. 6. The control stack as set forth in claim 4, wherein said adjacent ones of said electrodes extend along a curved direction. 7. The control stack as set forth in claim 4, wherein said electronic controls are central processing unit cores. 8. The control stack as set forth in claim 4, wherein heat transfer fins are included in said plenums adjacent outer walls to assist in dissipation of heat from the dielectric liquid to the environment. 9. The control stack as set forth in claim 4, wherein there are a plurality of sub-channels in each of said cooling channels defined by said plurality of electrodes. 10. The control stack as set forth in claim 9, wherein there are laterally adjacent ones of said sub-channels positioned between each of said plurality of electronic controls, and said adjacent ones of said sub-channels forcing bubbles in opposed axial directions, by having said larger downstream ends at opposed ends. 11. The control stack as set forth in claim 10, wherein at least some of said adjacent sub-channels are defined by a common electrode and another of said electrodes. 12. The control stack as set forth in claim 10, wherein there are laterally outer ones of said sub-channels defined by one of said electrodes and an axially extending outer wall. 13. A control stack comprising: a plurality of generally planar central processing units stacked in a direction generally perpendicular to their generally planar shape;cooling channels positioned intermediate adjacent ones of said plurality of central processing units, and said cooling channels communicating with plenums at each of two opposed axial ends of said cooling channels;a dielectric fluid received in said cooling channels;said cooling channels provided with a plurality of electrodes, with adjacent ones of said electrodes extending in a non-parallel direction along an axial direction between said plenums, and such that said adjacent electrodes extend in a direction with an axial component, and a lateral component, and with said lateral component from one said adjacent electrode being opposed to a lateral component from a next said adjacent electrode, and such that a sub-channel defined between said adjacent electrodes increases in width from a smaller upstream end to a larger downstream end, and such that when a voltage potential is applied to the electrodes then a dielectrophoretic force on a bubble in said cooling channel will force it towards said larger downstream end;heat transfer fins included in said plenums adjacent outer walls to assist in dissipation of heat from the dielectric liquid to the environment; anda plurality of sub-channels in each of said cooling channels defined by said plurality of electrodes. 14. The control stack as set forth in claim 13, wherein there are laterally adjacent ones of said sub-channels positioned between each of said plurality of electronic controls, and said adjacent ones of said sub-channels forcing bubbles in opposed axial directions, by having said larger downstream ends at opposed ends. 15. The control stack as set forth in claim 14, wherein at least some of said adjacent sub-channels are defined by a common electrode and another of said electrodes. 16. The control stack as set forth in claim 13 wherein there are laterally outer ones of said sub-channels defined by one of said electrodes and an axially extending outer wall. 17. The control stack as set forth in claim 13, wherein said plurality of electrodes extend along a generally linear direction. 18. The control stack as set forth in claim 13, wherein said adjacent ones of said electrodes extend along a curved direction.