Methods of manufacture of bottom port multi-part surface mount MEMS microphones
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01L-021/00
H04R-031/00
H04R-011/04
H01L-023/12
B81C-001/00
B81C-003/00
H04R-019/04
H04R-019/01
H01L-021/78
B81B-007/00
H01L-023/10
B81B-003/00
H04R-019/00
출원번호
US-0149475
(2014-01-07)
등록번호
US-9040360
(2015-05-26)
발명자
/ 주소
Minervini, Anthony D.
출원인 / 주소
Knowles Electronics, LLC
대리인 / 주소
Sughrue Mion, PLLC
인용정보
피인용 횟수 :
9인용 특허 :
161
초록▼
Methods for manufacturing multiple bottom port, surface mount microphones, each containing a micro-electro-mechanical system (MEMS) microphone die, are disclosed. Each surface mount microphone features a substrate with metal pads for surface mounting the package to a device's printed circuit board a
Methods for manufacturing multiple bottom port, surface mount microphones, each containing a micro-electro-mechanical system (MEMS) microphone die, are disclosed. Each surface mount microphone features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphones are manufactured from panels of substrates, sidewall spacers, and lids. Each MEMS microphone die is substrate-mounted and acoustically coupled to the acoustic port disposed in the substrate. The panels are joined together, and each individual substrate, sidewall spacer, and lid cooperate to form an acoustic chamber for its respective MEMS microphone die. The joined panels are then singulated to form individual MEMS microphones.
대표청구항▼
1. A method for manufacturing a plurality of solder reflow surface mount microelectromechanical system (MEMS) microphones, the method comprising: providing an unsingulated panel comprised of a plurality of individual lids, wherein each lid has top and bottom surfaces and comprises at least one condu
1. A method for manufacturing a plurality of solder reflow surface mount microelectromechanical system (MEMS) microphones, the method comprising: providing an unsingulated panel comprised of a plurality of individual lids, wherein each lid has top and bottom surfaces and comprises at least one conductive layer and at least one non-conductive layer, wherein the at least one conductive layer comprises the bottom surface of the lid, and wherein the bottom surface has an attachment region and an interior region, the attachment region positioned between the interior region and the edges of the lid, and completely bounding the interior region;providing an unsingulated panel comprised of a plurality of individual sidewall spacers, wherein each sidewall spacer has top and bottom surfaces and comprises at least two conductive layers with a center layer of non-conductive material having a predefined thickness disposed between the two conductive layers, wherein one conductive layer comprises the top surface of the sidewall spacer and the other conductive layer comprises the bottom surface of the sidewall spacer, and wherein the sidewall spacer further comprises an opening having walls covered with conductive material, and the opening walls extend through the center layer to the top surface and the bottom surface;providing an unsingulated panel comprised of a plurality of individual substrates, wherein each substrate comprises: a base layer comprising at least one layer of non-conductive material, wherein the base layer has a planar top surface and a planar bottom surface, the top surface having an interior region and an attachment region, the attachment region disposed between the interior region and the edges of the base layer, and completely bounding the interior region;a first plurality of metal pads disposed on the top surface of the base layer, wherein at least one pad of the first plurality of metal pads is located in the attachment region of the top surface of the base layer;a second plurality of metal pads disposed on the bottom surface of the base layer, the second plurality of metal pads arranged to be within the edges of the base layer;one or more electrical pathways disposed completely within the base layer, wherein the pathways electrically couple one or more of the first plurality of metal pads on the top surface of the base layer to one or more of the second plurality of metal pads on the bottom surface of the base layer, and wherein the at least one metal pad located in the attachment region of the top surface of the base layer is electrically coupled to one or more of the second plurality of metal pads; andan acoustic port disposed in the interior region of the base layer and passing completely through the base layer, wherein one of the second plurality of metal pads is a sealing ring that completely surrounds the acoustic port in the base layer;mounting a MEMS microphone die on the top surface of the base layer of each individual substrate in the unsingulated panel of individual substrates, and electrically coupling each MEMS microphone die to at least one of the first plurality of metal pads on the top surface of the base layer of its respective substrate in the unsingulated panel of substrates;attaching the unsingulated panel of substrates, the unsingulated panel of sidewall spacers and the unsingulated panel of lids to each other in a predetermined order; wherein the bottom surface of each sidewall spacer is coupled to the attachment region of the top surface of its respective substrate such that the opening of each sidewall spacer and the interior region of the top surface of each substrate are respectively aligned, and the conductive material on the opening walls of each sidewall spacer is electrically coupled to its respective at least one metal pad located in the attachment region of each substrate;wherein the top surface of each sidewall spacer is coupled to the attachment region of the bottom surface of its respective lid such that the opening of each sidewall spacer and the interior region of the bottom surface of each lid are respectively aligned, and the conductive layer of each lid is electrically coupled to the conductive material on the opening walls of its respective sidewall spacer; andwherein the interior region of the top surface of each substrate, the opening walls of its respective sidewall spacer, and the interior region of the bottom surface of its respective lid, when the panels are attached, define the acoustic chamber for each of their respective MEMS microphone die; andsingulating the attached panels into a plurality of individual MEMS microphones, wherein each substrate, and its respective sidewall spacer and lid cooperatively form a housing that has surfaces substantially perpendicular to the bottom surface of the substrate. 2. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein the method further comprises electrically coupling at least one passive electrical element between one of the first plurality of metal pads and one of the second plurality of metal pads. 3. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 2, wherein the method further comprises forming the at least one passive electrical element within the base layer of the substrate. 4. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 2, wherein the method further comprises providing the at least one passive electrical element within the base layer of each substrate in the unsingulated panel of substrates, and the at least one passive electrical element comprises a dielectric or resistive material that is different from the non-conductive material used in the base layer of each respective substrate. 5. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 2, wherein, for each MEMS microphone, the at least one passive electrical element is disposed within the base layer of the substrate and comprises a dielectric or resistive material that is different from the non-conductive material of the base layer. 6. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 5, wherein, for each MEMS microphone, the at least one passive electrical element is configured to filter one or more of an input signal, an output signal, or input power. 7. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein the method further comprises attaching the unsingulated panel of lids to the unsingulated panel of sidewall spacers with a first conductive material, and attaching the unsingulated panel of substrates to the unsingulated panel of sidewall spacers with a second conductive material. 8. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein the housing protects the MEMS microphone die from at least one of light, electromagnetic interference, and physical damage. 9. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein the method further comprises providing each substrate in the unsingulated panel of substrates a material layer that that substantially blocks environmental contaminants from entering the acoustic chamber through the acoustic port. 10. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein the acoustic port in each substrate in the unsingulated panel of substrates is disposed in a position offset from the centerpoint of its respective substrate. 11. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein the center layer of the each sidewall spacer in the unsingulated panel of sidewall spacers comprises multiple layers of conductive and non-conductive material, and the conductive material on the opening walls of each sidewall spacer electrically couples the conductive layers to each other. 12. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein the method further comprises plating the first and second pluralities of metal pads on the base layer of each substrate with a metal that is different from the metal used for the first and second pluralities of metal pads of each substrate in the panel of unsingulated substrates. 13. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein the base layer of each substrate in the panel of unsingulated substrates further comprises at least one additional non-conductive layer and at least one additional conductive layer. 14. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein the acoustic port in each substrate in the panel of unsingulated substrates is a first acoustic port, and each lid in the panel of unsingulated lids further comprises a second acoustic port. 15. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 14, wherein each lid in the unsingulated panel of lids further comprises a material layer that that substantially blocks environmental contaminants from reaching its respective MEMS microphone die through the second acoustic port. 16. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein, for each MEMS microphone, electrical continuity is present between the conductive layer in its lid, the conductive material on the opening walls of its sidewall spacer, and at least one of its second plurality of metal pads. 17. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein, for each MEMS microphone, the at least one non-conductive layer of the lid, the center layer of non-conductive material of the sidewall spacer, and the non-conductive material of the base layer each have a substantially similar predetermined coefficient of thermal expansion. 18. A method for manufacturing a plurality of solder reflow surface mount microelectromechanical system (MEMS) microphones, the method comprising: providing an unsingulated panel comprised of a plurality of individual top portions, wherein each top portion has upper and lower surfaces and comprises at least one metal layer and at least one printed circuit board material layer, wherein the at least one metal layer comprises the lower surface of the top portion, and wherein the lower surface has a coupling area and an inner area, the coupling area being arranged between the inner area and the edges of the top portion, and completely surrounding the inner area;providing an unsingulated panel comprised of a plurality of individual spacer portions, wherein each spacer portion has upper and lower surfaces and comprises at least two metal layers with at least one printed circuit board material layer of predefined thickness disposed between the two metal layers, wherein one metal layer comprises the upper surface of the spacer portion and the other metal layer comprises the lower surface of the spacer portion, and wherein the spacer portion further comprises a window having walls covered with a metal layer, and the window walls extend through the printed circuit board material layer to the upper surface and the lower surface;providing an unsingulated panel comprised of a plurality of individual bottom portions, wherein each bottom portion comprises: a base layer that comprises at least one layer of printed circuit board material, wherein the base layer has a substantially flat upper surface and a substantially flat lower surface, the upper surface having an inner area and a coupling area, the coupling area located between the inner area and the edges of the base layer, and completely surrounding the inner area;a plurality of metal pads located on the upper surface of the base layer, wherein at least one pad of the plurality of metal pads is positioned in the coupling area of the upper surface of the base layer;a plurality of solder pads located on the lower surface of the base layer, the plurality of solder pads arranged to be within the edges of the base layer;one or more electrical connections passing through the base layer, wherein the connections electrically couple one or more of the plurality of metal pads on the upper surface of the base layer to one or more of the plurality of solder pads on the lower surface of the base layer, and wherein the at least one metal pad positioned in the coupling area of the upper surface of the base layer is electrically coupled to one or more of the plurality of solder pads;an acoustic port located in the inner area of the base layer and passing completely through the base layer, wherein one of the second plurality of solder pads is a solder pad ring that completely surrounds the acoustic port in the base layer; andat least one passive electrical element electrically coupled between one of the plurality of metal pads and one of the plurality of solder pads;physically coupling a MEMS microphone die on the top surface of the base layer of each individual bottom portion in the unsingulated panel of individual bottom portions, and electrically coupling each MEMS microphone die to at least one of the first plurality of metal pads on the top surface of the base layer of its respective bottom portion in the unsingulated panel of bottom portions, the MEMS microphone die being arranged directly over the acoustic port in its respective bottom portion;physically coupling the unsingulated panel of top portions, the unsingulated panel of spacer portions, and the unsingulated panel of bottom portions to each other in a predetermined order; wherein a conductive material physically couples the lower surface of each spacer portion to the coupling area of the upper surface of its respective bottom portion such that the window of each spacer portion and the inner area of the upper surface of each bottom portion are respectively aligned, and the metal layer on the window walls of each spacer portion is electrically coupled to the at least one metal pad positioned in the coupling area of its respective bottom portion;wherein a conductive material physically couples the upper surface of the spacer portion to the coupling area of the lower surface of its respective top portion such that the window of the spacer portion and the inner area of the lower surface of its respective top portion are aligned, and the metal layer of the top portion is electrically coupled to the metal layer on the window walls of its respective spacer portion;wherein electrical continuity is present between the metal layer in each top portion, its respective metal layer on the window walls of its respective spacer portion, and its respective at least one of the plurality of solder pads; andwherein the inner area of the upper surface of each bottom portion, the window walls of its respective spacer portion, and the inner area of the lower surface of its respective top portion, when the panels are coupled, define the internal acoustic chamber for each of their respective MEMS microphone die;singulating the coupled panels into a plurality of individual MEMS microphones, wherein each bottom portion, and its respective spacer portion and top portion cooperatively form a housing that has surfaces substantially perpendicular to the lower surface of the bottom portion and that protects the MEMS microphone die from at least one of light, electromagnetic interference, and physical damage. 19. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 18, wherein, for each MEMS microphone, the housing further comprises a material layer that substantially blocks environmental contaminants from entering the acoustic chamber through the acoustic port. 20. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 18, wherein the acoustic port in each bottom portion in the unsingulated panel of bottom portions is disposed in a position offset from the centerpoint of its respective bottom portion. 21. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 20, wherein for the base layer of each bottom portion of the unsingulated panel of bottom portions comprises at least one passive electrical element disposed within the base layer of the bottom portion and comprises a dielectric or resistive material that is different from the printed circuit board material of the base layer. 22. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 20, wherein, for each MEMS microphone, the at least one passive electrical element is configured to filter one or more of an input signal, an output signal, or input power. 23. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 20, wherein, for each MEMS microphone, the printed circuit board layer of the spacer portion further comprises additional layers of printed circuit board material alternating with additional metal layers, and the conductive material on the window walls electrically couples the additional metal layers to each other. 24. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 20, wherein, for each MEMS microphone, the base layer of the bottom portion further comprises at least one additional non-conductive layer and at least one additional conductive layer. 25. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 20, wherein, for each MEMS microphone, the base layer of the bottom portion further comprises a material layer that that substantially blocks environmental contaminants from entering the acoustic chamber through the acoustic port. 26. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 18, wherein the acoustic port in each bottom portion in the panel of unsingulated bottom portions is a first acoustic port, and each top portion in the panel of unsingulated top portions further comprises a second acoustic port. 27. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 26, wherein, for each MEMS microphone, the housing further comprises a material that substantially blocks environmental contaminants from entering the acoustic chamber through the second acoustic port. 28. A method for manufacturing a plurality of solder reflow surface mount microelectromechanical system (MEMS) microphones, the method comprising: providing an unsingulated panel comprised of a plurality of individual base substrates, wherein each base substrate comprises: a core layer comprised of at least one layer of FR-4 printed circuit board material, wherein the core layer has a substantially flat top surface and a substantially flat bottom surface, the top surface having a die mount region and an attachment region, the attachment region positioned between the die mount region and the edges of the core layer, and completely surrounding the die mount region;a plurality of metal pads located on the top surface of the core layer, wherein at least one pad of the plurality of metal pads is located in the attachment region of the top surface of the core layer;a plurality of solder pads located on the bottom surface of the core layer, the plurality of solder pads arranged to be within the edges of the core layer;a plurality of electrical connections passing through the core layer that electrically couple one or more of the plurality of metal pads on the top surface of the core layer to one or more of the plurality of solder pads on the bottom surface of the core layer, and wherein the at least one metal pad located in the attachment region of the top surface of the core layer is electrically coupled to one or more of the plurality of solder pads;an acoustic port located in the interior region of the core layer and passing completely through the core layer, wherein one of the second plurality of solder pads is a solder pad ring that completely surrounds the acoustic port in the base substrate; anda pressure-equalizing MEMS microphone die having an internal acoustic channel mounted in the die mount region of the core layer, and electrically coupled to one or more of the metal pads on the top surface of the core layer, the internal acoustic channel of the MEMS microphone die being arranged directly over the acoustic port in the core layer of its respective base substrate;providing a plurality of enclosure elements, the plurality comprising: an unsingulated panel comprised of a plurality of individual first enclosure elements, wherein each first enclosure element has having substantially flat top and bottom surfaces and comprises at least two metal layers with multiple FR-4 printed circuit board material layers of predefined thickness disposed between the two metal layers, wherein one metal layer comprises the top surface of the first enclosure element and the other metal layer comprises the bottom surface of the first enclosure elements;an unsingulated panel comprised of a plurality of individual second enclosure elements, wherein each second enclosure element has substantially flat top and bottom surfaces and comprises at least one metal layer, a FR-4 printed circuit board material layer, wherein the metal layer comprises the bottom surface of the second enclosure element, and wherein the bottom surface has an attachment region and an inner region, the attachment region being arranged between the attachment region and the edges of the second enclosure element, and completely surrounding the attachment region;physically coupling the unsingulated panel of first enclosure elements and the unsingulated panel of second enclosure elements to each other to form an unsingulated panel of enclosures, wherein the top surface of each first enclosure element is physically coupled to the attachment region of the bottom surface of its respective second enclosure element with a conductive material; wherein each first enclosure element further comprises an interior open volume with walls, thereby exposing the inner region of the bottom surface of its respective second enclosure element; andwherein the interior open volume walls of each first enclosure element have a metal layer that is electrically connected to the bottom surface metal layer of its respective second enclosure element;joining the unsingulated panel of base substrates and the unsingulated panel of enclosures to form a housing that has an internal acoustic chamber for the MEMS microphone die, and that protects the MEMS microphone die from at least one of light, electromagnetic interference, and physical damage, wherein the bottom surface metal layer of each first enclosure element is physically joined to the attachment region of its respective base substrate with a conductive material, and wherein the interior open volume of each first enclosure element is aligned with the die mount region of its respective base substrate, and the metal pad positioned in each attachment region is electrically coupled to the metal layer of the interior open volume walls in its respective first enclosure element; wherein the interior region of the bottom surface of each second enclosure element, the interior open volume walls of its respective first enclosure element, and the die mount region of its respective base substrate define the internal acoustic chamber for its respective MEMS microphone die;wherein electrical continuity exists between the metal layer of each second enclosure element, the metal-covered interior open volume walls of its respective enclosure element, and one or more of the plurality of solder pads on its respective base substrate; andsingulating the coupled panels into a plurality of individual MEMS microphones, wherein, for each MEMS microphone, the length of the base substrate and the length of the enclosure are substantially equal, and the width of the base substrate and the width of the enclosure are substantially equal. 29. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 28, the method further comprising providing at least one passive electrical element within the core layer of each base substrate in the unsingulated panel of base substrates, and electrically coupling the at least one passive electrical element between one of the plurality of metal pads and one of the plurality of solder pads. 30. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 28, wherein, for each MEMS microphone, the housing further comprises a material layer that substantially blocks environmental contaminants from entering the acoustic chamber through the acoustic port of the MEMS microphone. 31. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 28, wherein the acoustic port in each base substrate in the unsingulated panel base substrates is a first acoustic port, and each second enclosure element in the panel of unsingulated second enclosure elements further comprises a second acoustic port that passes completely through respective second enclosure element. 32. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 31, wherein, for each MEMS microphone, the housing further comprises a material that substantially blocks environmental contaminants from entering the acoustic chamber through the second acoustic port of the MEMS microphone. 33. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 28, wherein the core layer of each base substrate in the panel of unsingulated base substrates comprises at least one passive electrical element disposed within the core layer of the base substrate and comprises a dielectric or resistive material that is different from the FR-4 printed circuit board material of the core layer. 34. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 33, wherein, for each MEMS microphone, the core layer of the base substrate the at least one passive electrical element is configured to filter one or more of an input signal, an output signal, or input power. 35. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 28, wherein, for each MEMS microphone, the core layer of the base substrate the first enclosure element further comprises additional metal layers alternating with the FR-4 printed circuit board material layers, and the metal layer of the interior open volume walls electrically couples the additional metal layers to each other. 36. A method for manufacturing a plurality of solder reflow surface mount microelectromechanical system (MEMS) microphones, the method comprising: providing a plurality of pressure-equalizing MEMS microphone die, each MEMS microphone die having an internal acoustic channel;providing an unsingulated panel comprised of a plurality of individual first housing elements, wherein each first housing element has substantially flat top and bottom surfaces and comprises at least a metal layer and at least one printed circuit board material layer, wherein the metal layer comprises the bottom surface of the first housing element, wherein the bottom surface has an attachment region and an interior region, the attachment region located between the interior region and the edges of the first housing element and completely surrounding the interior region;providing an unsingulated panel comprised of a plurality of individual second housing elements, wherein each second housing element has substantially flat top and bottom surfaces and comprises at least first and second metal layers with at least one printed circuit board material layer of predefined thickness disposed between the first and second metal layers, wherein the first metal layer comprises the top surface of the second housing element and the second metal layer comprises the bottom surface of the second housing element, wherein the second housing element further comprises an aperture having metal-covered walls, and the aperture walls extend through the printed circuit board material layer to the top and bottom surfaces of the second housing element;providing an unsingulated panel comprised of a plurality of individual third housing elements, wherein each third housing element comprises: a core layer comprised of at least one layer of printed circuit board material, wherein the core layer has a substantially flat top surface and a substantially flat bottom surface, wherein the top surface has an interior region and an attachment region, the attachment region being arranged between the interior region and the edges of the core layer, and the attachment region completely surrounds the interior region;a plurality of metal pads disposed on the top surface of the core layer, wherein at least one pad of the plurality of metal pads is positioned in the attachment region of the top surface of the core layer;a plurality of solder pads disposed on the bottom surface of the core layer, the plurality of solder pads arranged to be within a perimeter of the bottom surface of the core layer;an acoustic port located in the interior region of the core layer and passing completely through the core layer, wherein the acoustic port is disposed in a position offset from the centerpoint of the third housing element, and wherein one of the second plurality of solder pads is a solder pad ring that completely surrounds the acoustic port in the core layer; andone or more electrical vias located inside the core layer, wherein the vias electrically couple one or more of the plurality of metal pads on the top surface of the core layer to one or more of the plurality of solder pads on the bottom surface of the core layer, and wherein a via electrically couples the at least one metal pad positioned in the attachment region of the top surface of the core layer to one or more of the plurality of solder pads;mounting one of the plurality of MEMS microphone die to the top surface of the core layer of each third housing element in the panel of unsingulated third housing elements, and electrically coupling the mounted MEMS microphone to the plurality of metal pads on the top surface of the core layer of its respective third housing element;attaching the unsingulated panel of first housing elements, the unsingulated panel of second housing elements, and the unsingulated panel of third housing elements to each other in a predetermined order; wherein a conductive material physically couples the attachment region of the bottom surface of each first housing element to the top surface of its respective second housing element to such that the interior region of the bottom surface of each first housing element and the aperture of its respective second housing element are aligned, and the metal layer of each first housing element is electrically coupled to the metal-covered aperture walls of its respective second housing element;wherein a conductive material physically couples the bottom surface of each second housing element to the attachment region of the top surface of its respective third housing element such that the aperture of each second housing element and the interior region of the top surface of its respective third housing element are aligned, and the metal-covered aperture walls of each second housing element are electrically coupled to the at least one metal pad positioned in the attachment region of the its respective housing element;wherein the interior region of the bottom surface of each first housing element, the aperture walls of its respective second housing element, and the interior region of the top surface of its respective third housing element, when the panels are attached, define the acoustic chamber that is a front volume for its respective MEMS microphone die, and acoustically couples its respective acoustic port to the MEMS microphone die; andwherein electrical continuity exists between the metal layer of each first housing element, the metal-covered aperture walls of its respective second housing element, and one or more of the plurality of solder pads on its respective third housing element; andsingulating the coupled panels into a plurality of individual MEMS microphones, wherein the first housing element, and it respective second, and third housing elements cooperatively form a housing that has surfaces substantially perpendicular to the bottom surface of the third housing element, that has an internal acoustic chamber for the MEMS microphone die, and that protects the MEMS microphone die from at least one of light, electromagnetic interference, and physical damage. 37. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 36, wherein the method further comprises electrically coupling at least one passive electrical element between one of the plurality of metal pads and one of the plurality of solder pads. 38. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 36, wherein, for each MEMS microphone, the housing further comprises a material that substantially blocks environmental contaminants from entering the acoustic chamber through the acoustic port. 39. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 36, wherein the acoustic port in each third housing element in the unsingulated panel of third housing elements is a first acoustic port, and each first housing element in the unsingulated panel of first housing elements further comprises a second acoustic port. 40. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 39, wherein, for each MEMS microphone, the housing further comprises a material that substantially blocks environmental contaminants from entering the acoustic chamber through the second acoustic port. 41. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 36, wherein, for each MEMS microphone, the core layer of each third housing element of the panel of unsingulated third housing elements comprises at least one passive electrical element disposed within the core layer of the third housing element and comprises a dielectric or resistive material that is different from the printed circuit board material of the core layer. 42. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 41, wherein, for each MEMS microphone, the core layer of the third housing element the at least one passive electrical element is configured to filter one or more of an input signal, an output signal, or input power. 43. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 36, wherein, for each MEMS microphone, the core layer of the third housing element the second housing element further comprises additional metal layers interposed between the multiple layers of printed circuit board material, and the metal-covered walls of the aperture electrically couples the additional metal layers to each other.
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Carney Francis J. ; Carson George Amos ; Celaya Phillip C. ; Fuerhaupter Harry ; Jones Frank Tim ; Klosterman Donald H. ; Melton Cynthia M. ; Knapp James Howard ; Nelson Keith E., Microelectronic package including a polymer encapsulated die.
Carney Francis J. ; Carson George Amos ; Celaya Phillip C. ; Fuerhaupter Harry ; Jones Frank Tim ; Klosterman Donald H. ; Melton Cynthia M. ; Knapp James Howard ; Nelson Keith E., Microelectronic package including a polymer encapsulated die, and method for forming same.
Pasqualoni Anthony M. (Hamden CT) Mahulikar Deepak (Madison CT) Jewell Francis S. (Meriden CT) Hoffman Paul R. (Modesto CA) Brathwaite George (Hayward CA) McNabb Richard (Manteca CA) Ramirez German (, Polymer plug for electronic packages.
Giachino Joseph M. (Farmington Hills MI) Haeberle Russell J. (Canton MI) Crow Joseph W. (Livonia MI), Semiconductor variable capacitance pressure transducer assembly.
Guzuk Andrzej T. (Pompano Beach FL) Roshitsh Todd W. (No. Lauderdale FL) Engstrom Scott M. (Coral Springs FL) Bernardoni Lonnie L. (Coral Springs FL), Shielded low-profile electronic component assembly.
Knecht Thomas A. (Crystal Lake IL) Mancini Brian M. (Carol Stream IL) Achille Jean-Robert (Bloomingdale IL) Sieben David J. (Palatine IL), Shielding apparatus for non-conductive electronic circuit packages.
Masato Higuchi JP; Atsushi Hirakawa JP; Shinobu Uesugi JP; Koichi Kanryo JP, Surface acoustic wave device having a package including a conductive cap that is coated with sealing material.
Rector Louis ; Hyatt Hugh M. ; Minervini Anthony ; Swensen Robert ; Neuhalfen Andrew J. ; Elliott Andrew W. S., Surface-mountable device for protection against electrostatic damage to electronic components.
Brown Reed S. (Indianapolis IN) Brzezinski Alex M. (Indianapolis IN) Jue Tinyee (Shreveport LA) Woods ; Jr. William L. (Keithville LA) Zieles Robert S. (Indianapolis IN), Telephone handset construction.
Harris Daryl ; Kaschke Kevin D. ; Bond David L., Telephone set having a microphone for receiving or an earpiece for generating an acoustic signal via a keypad.
Gueorguiev, Svetoslav Radoslavov; Furst, Claus Erdmann; Joergensen, Tore Sejr, Apparatus and method for high voltage I/O electro-static discharge protection.
Nielsen, John; Mortensen, Anders Svava; Larsen, Rene Rye; Popper, Robert A.; Nandy, Dibyendu; Midtgaard, Jacob, Signal processing platform in an acoustic capture device.
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