초록 ▼

This invention pertains to fabrication of devices. One embodiment is a method of substrate cleaning and electroless deposition of a cap layer for an integrated circuit. The method is performed on a substrate having a surface comprising a metal and dielectric damascene metallization layer. The method

This invention pertains to fabrication of devices. One embodiment is a method of substrate cleaning and electroless deposition of a cap layer for an integrated circuit. The method is performed on a substrate having a surface comprising a metal and dielectric damascene metallization layer. The method comprises exposing the surface of the substrate to a cleaning solution sufficient to clean the surface of the substrate and exposing the surface of the substrate to an electroless deposition solution sufficient to deposit the cap layer. Other embodiments of the present invention include solutions to clean the substrate and solutions to accomplish electroless deposition.

대표청구항 ▼

1. A method of depositing a cap layer on a substrate surface, comprising: (A) exposing the substrate surface to a first cleaning solution;after exposing the substrate surface to a first cleaning solution, spinning off the first cleaning solution without drying or dewetting the substrate surface, rin

1. A method of depositing a cap layer on a substrate surface, comprising: (A) exposing the substrate surface to a first cleaning solution;after exposing the substrate surface to a first cleaning solution, spinning off the first cleaning solution without drying or dewetting the substrate surface, rinsing the substrate with deionized water, and spinning off excess liquid from the substrate without drying or dewetting the substrate surface;(B) after spinning off excess liquid from the substrate without drying or dewetting the substrate surface, exposing the substrate surface to a second cleaning solution;after exposing the substrate surface to a second cleaning solution, spinning off the second cleaning solution without drying or dewetting the substrate surface, rinsing the substrate with deionized water, and spinning off excess liquid from the substrate without drying or dewetting the substrate surface; and(C) after spinning off excess liquid from the substrate without drying or dewetting the substrate surface, depositing the cap layer on the substrate surface with an electroless deposition solution;wherein the substrate surface is not dried or dewetted from (A) through (C). 2. The method of claim 1, further comprising: wherein at least the second cleaning solution comprises only components that substantially do not obstruct the performance of the electroless deposition solution if present therein, andwherein the substrate is not dried or dewetted until after depositing the cap layer. 3. The method of claim 2, further comprising: one or more act(s) to rinse the substrate with deionized water or with deionized water having one or more surfactant(s). 4. The method of claim 2, further comprising: rinsing the substrate with deionized water or with deionized water having one or more surfactant(s); andspinning the substrate to remove the deionized water substantially without dewetting or drying the surface of the substrate. 5. The method of claim 1, wherein the first cleaning solution comprises one or more hydroxycarboxylic acid(s) or one or more non-alkali metal salt(s) of one or more hydroxycarboxylic acid(s). 6. The method of claim 1, wherein the second cleaning solution comprises one or more hydroxycarboxylic acid(s) or one or more non-alkali metal salt(s) of one or more hydroxycarboxylic acid(s). 7. The method of claim 2, wherein the second cleaning solution comprises one or more hydroxycarboxylic acid(s) or one or more non-alkali metal salt(s) of one or more hydroxycarboxylic acid(s); andthe electroless deposition solution comprises the one or more hydroxycarboxylic acid(s) or the one or more non-alkali metal salt(s) of the one or more hydroxycarboxylic acid(s). 8. The method of claim 2, wherein the first cleaning solution comprises one or more hydroxycarboxylic acid(s) or one or more non-alkali metal salt(s) of one or more hydroxycarboxylic acid(s); and the electroless deposition solution comprises the one or more hydroxycarboxylic acid(s) or the one or more non-alkali metal salt(s) of the one or more hydroxycarboxylic acid(s). 9. The method of claim 1, wherein the first cleaning solution comprises: one or more hydroxycarboxylic acid(s) or one or more non-alkali metal salt(s) of one or more hydroxycarboxylic acid(s);one or more surfactant(s);one or more reducing agent(s); andoptionally, one or more pH adjustor(s);the pH of the first cleaning solution is >0.5 and 2.5 and 5 and 8 and 0.5 and 2.5 and 5 and 8 and 0.5 and 2.5 and 5 and 0.5 and 2.5 and 5 and 8 and 1 and 1 and <6. 30. The method of claim 1, further comprising: wetting the substrate with deionized water and spinning off excess liquid from the substrate without drying or dewetting the substrate surface before exposing the substrate surface to the first cleaning solution. 31. The method of claim 1, further comprising: before (A), rinsing the substrate with deionized water and spinning off excess liquid from the substrate without drying or dewetting the substrate surface. 32. A method of claim 1, further comprising: wherein at least the second cleaning solution comprises only components that substantially do not obstruct the performance of the electroless deposition solution if present therein;wherein the cleaning solution is substantially free of sulfur; andwherein the substrate is not dried or dewetted until after depositing the cap layer. 33. The method of claim 32, further comprising: one or more act(s) to rinse the substrate with deionized water or with deionized water having one or more surfactant(s). 34. The method of claim 32, further comprising: rinsing the substrate with deionized water or with deionized water having one or more surfactant(s); andspinning the substrate to remove the deionized water substantially without dewetting or drying the surface of the substrate. 35. The method of claim 32, wherein the first cleaning solution comprises one or more hydroxycarboxylic acid(s) or one or more non-alkali metal salt(s) of one or more hydroxycarboxylic acid(s). 36. The method of claim 32, wherein the second cleaning solution comprises one or more hydroxycarboxylic acid(s) or one or more non-alkali metal salt(s) of one or more hydroxycarboxylic acid(s).