A cooling system for an integrated circuit die comprises a heat exchanger and a heat transfer device. The heat transfer device is formed of a plurality of stacked foils. The stacked foils are fused at a heat exchanger region abutting the heat exchanger, and are fused at a die region abutting the int
A cooling system for an integrated circuit die comprises a heat exchanger and a heat transfer device. The heat transfer device is formed of a plurality of stacked foils. The stacked foils are fused at a heat exchanger region abutting the heat exchanger, and are fused at a die region abutting the integrated circuit die, but are flexible between the heat exchanger region and the die region.
대표청구항▼
1. A cooling system for an integrated circuit die, the cooling system comprising: a heat exchanger adjacent the integrated circuit die; anda heat transfer device formed of a plurality of stacked foils, the plurality of stacked foils having: a die region abutting the integrated circuit die,a heat exc
1. A cooling system for an integrated circuit die, the cooling system comprising: a heat exchanger adjacent the integrated circuit die; anda heat transfer device formed of a plurality of stacked foils, the plurality of stacked foils having: a die region abutting the integrated circuit die,a heat exchanger region abutting the heat exchanger,an intermediate region separating the die region and the heat exchanger region,wherein each of the stacked foils extends from the die region through the intermediate region to the heat exchange region,wherein all of the plurality of stacked foils in each of the die region and the heat exchanger region are fused together throughout using sinter welds between all adjacent foils among the plurality of stacked foils forming a rigid section, andwherein the all of the plurality of stacked foils in the intermediate region are unfused allowing the intermediate region to be flexible. 2. The cooling system of claim 1, further comprising an adhesive interface securing the integrated circuit die to the die location of the heat transfer device. 3. The cooling system of claim 1, wherein the adhesive interface is an epoxy layer selected to impede thermal conduction between the heat transfer device and the integrated circuit die as little as possible. 4. The cooling system of claim 1, further comprising: a pressure plate secured to the heat exchanger; anda spring disposed between the pressure plate and the die location of the heat transfer device to retain the heat transfer device in contact with the integrated circuit die. 5. The cooling system of claim 4, further comprising a thermal interface layer between the integrated circuit die and the die location of the heat transfer device. 6. The cooling system of claim 5, wherein the thermal interface layer is a layer of thermal grease or a thermal pad for providing thermal conduction between the heat transfer device and the integrated circuit die. 7. The cooling system of claim 4, wherein the spring is a leaf spring. 8. The cooling system of claim 1, wherein the integrated circuit die and the heat exchanger are mounted on a printed wiring board. 9. The cooling system of claim 8, wherein the integrated circuit die is mounted on the printed wiring board via a ball grid array secured to the printed wiring board with solder balls. 10. The cooling system of claim 1, further comprising at least one additional fused heat exchanger region of the heat exchanger device, the at least one additional fused heat exchanger region abutting the heat exchanger. 11. The cooling system of claim 1, wherein the plurality of stacked foils are formed of aluminum, silver, or copper. 12. The cooling system of claim 1, wherein the plurality of stacked foils comprises one hundred or more stacked foils. 13. The cooling system of claim 12, wherein the plurality of stacked foils comprises two hundred or more stacked foils. 14. The cooling system of claim 1, wherein each of the plurality of stacked foils is 1/500th of an inch thick, or less. 15. The cooling system of claim 1, wherein each of the plurality of stacked foils is 1/1000th of an inch thick, or less. 16. A cooling system for an integrated circuit die, the cooling system comprising: a heat exchanger adjacent the integrated circuit die; anda heat transfer device formed of a plurality of stacked foils, the plurality of stacked foils having: a die region abutting the integrated circuit die,a plurality of heat exchanger regions, each heat exchanger region abutting the heat exchanger, anda plurality of intermediate regions, each of the intermediate regions separating the die region and a respective one of the heat exchanger regions,wherein all of the plurality of stacked foils in each of the die region and the heat exchanger regions are fused together throughout forming a rigid section, andwherein the all of the plurality of stacked foils in each of the intermediate regions are unfused allowing each of the intermediate regions to be flexible.
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