IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0659291
(2012-10-24)
|
등록번호 |
US-9061316
(2015-06-23)
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발명자
/ 주소 |
|
출원인 / 주소 |
|
대리인 / 주소 |
Wood, Herron & Evans, LLP
|
인용정보 |
피인용 횟수 :
0 인용 특허 :
17 |
초록
▼
A device for dispensing a heated liquid, such as a hot melt adhesive, includes a vertically oriented mounting plate; a melter subassembly including an adhesive manifold, a heater, and a pump adapted to dispense the heated liquid; a control subassembly adapted to control one or more components of the
A device for dispensing a heated liquid, such as a hot melt adhesive, includes a vertically oriented mounting plate; a melter subassembly including an adhesive manifold, a heater, and a pump adapted to dispense the heated liquid; a control subassembly adapted to control one or more components of the melter subassembly; and a subassembly cover coupled to the mounting plate for movement between an open condition and a closed condition. The subassembly cover thermally insulates the melter assembly from the control assembly when in the closed condition.
대표청구항
▼
1. An apparatus for dispensing adhesive, comprising: a vertically oriented mounting plate having front and back sides;a melter subassembly including an adhesive manifold, a heater, and a pump, the melter subassembly removably coupled to the front side of the mounting plate and configured to controll
1. An apparatus for dispensing adhesive, comprising: a vertically oriented mounting plate having front and back sides;a melter subassembly including an adhesive manifold, a heater, and a pump, the melter subassembly removably coupled to the front side of the mounting plate and configured to controllably dispense a heated adhesive;a control subassembly coupled to the front side of the mounting plate and spaced apart from the melter subassembly;the control subassembly including a controller in communication with the melter subassembly; and a subassembly cover coupled to the mounting plate for movement between an open condition and a closed condition, the subassembly cover thermally insulating the melter subassembly from the control subassembly when in the closed condition. 2. The apparatus of claim 1, wherein the subassembly cover is removably coupled to the mounting plate. 3. The apparatus of claim 1, wherein the subassembly cover is hingedly coupled to the mounting plate for movement between the open and closed conditions. 4. The apparatus of claim 1, wherein the melter subassembly is removably hingedly coupled to the mounting plate for movement between a first position adjacent the mounting plate and a second position pivoted away from the mounting plate to facilitate access to both sides of the melter subassembly. 5. The apparatus of claim 4, further comprising a latch for securing the melter subassembly in the first position. 6. The apparatus of claim 1, wherein the mounting plate includes first and second terminal ends, and wherein the melter subassembly is coupled to the mounting plate proximate the first terminal end, and the control subassembly is coupled to the mounting plate proximate the second terminal end. 7. The apparatus of claim 1, wherein the melter subassembly includes an outlet, the apparatus further comprising a dispensing hose rotatably coupled to said outlet. 8. The apparatus of claim 1, further comprising at least one mounting bracket coupled to the mounting plate and facilitating mounting the apparatus on a vertical surface. 9. The apparatus of claim 1, further comprising a plurality of rolling elements operatively coupled to the apparatus and facilitating rolling movement of the apparatus on a floor surface. 10. The apparatus of claim 1, wherein the subassembly cover includes at least a first section hingedly coupled to the mounting plate, the first section enclosing the melter subassembly in the closed condition. 11. The apparatus of claim 10, wherein said subassembly cover includes a second section hingedly coupled to the mounting plate, the second section enclosing the control subassembly in the closed condition. 12. The apparatus of claim 11, wherein when the subassembly cover first section and the subassembly cover second section are in the closed condition, the first section and second section are spaced apart to define a thermal gap between the melter subassembly and the control subassembly. 13. The apparatus of claim 1, further comprising a lift-off hinge coupling the mounting plate and the melter subassembly, wherein the mounting plate and melter subassembly are removably and rotatably coupled by the lift-off hinge. 14. The apparatus of claim 1, further comprising a stand having a vertical surface, and wherein the mounting plate is coupled to the vertical surface of the stand. 15. An apparatus for dispensing adhesive, comprising: a vertically oriented mounting plate having front and back sides;a melter subassembly including an adhesive manifold, a heater, and a pump; the melter subassembly pivotally coupled to the front side of the mounting plate for movement between a first position adjacent the mounting plate and a second position pivoted away from the mounting plate to facilitate access to both sides of the melter subassembly; the melter subassembly further including at least one outlet receiving melted adhesive from the manifold; anda dispensing hose coupled with the at least one outlet and dispensing melted adhesive therethrough. 16. The apparatus of claim 15, further comprising: a control subassembly coupled to the front side of the mounting plate and spaced apart from the melter subassembly;the control subassembly including a controller in communication with the melter subassembly. 17. An apparatus for dispensing adhesive, comprising: a melter subassembly comprising a hopper for receiving unmelted adhesive, a heater communicating with the hopper and melting adhesive received from the hopper, a reservoir communicating with the heater and receiving melted adhesive therefrom, and an adhesive manifold communicating with the reservoir;the hopper, heater, and reservoir arranged in a vertically aligned configuration whereby adhesive is moved by gravity from the hopper, through the heater, to the reservoir; andat least one outlet couplable to a dispensing hose and receiving melted adhesive from the manifold for dispensing through the hose. 18. The apparatus of claim 17, further comprising a pump operably coupled with the adhesive manifold and pumping adhesive from the adhesive manifold through the at least one outlet for dispensing through the hose. 19. The apparatus of claim 18, wherein the pump is offset laterally from the vertically aligned hopper, heater, and reservoir. 20. The apparatus of claim 19, wherein the pump extends along a direction parallel to the vertically aligned hopper, heater, and reservoir. 21. The apparatus of claim 17, further comprising a cyclone in communication with the hopper and feeding solid adhesive to the hopper. 22. The apparatus of claim 17, further comprising: a sensor associated with the hopper, the sensor sensing a level of adhesive material in the hopper; anda controller communicating with the melter subassembly and controlling operation thereof to dispense adhesive;the controller receiving signals from the sensor related to the level of adhesive in the hopper. 23. The apparatus of claim 17, wherein a material handling volume of at least one of the hopper, heater, or reservoir is selected to minimize exposure of adhesive to heat from the melter subassembly. 24. The apparatus of claim 17, wherein the manifold includes a bottom surface opposite the vertically aligned hopper, heater, and reservoir; the at least one outlet located on the bottom surface of the manifold. 25. The apparatus of claim 17, wherein the heater has a melting surface matched to the particular size of adhesive used. 26. A method of dispensing hot melt adhesive, the method comprising: delivering unmelted adhesive through an inlet conduit into a cyclone using pressurized air;receiving the unmelted adhesive into a hopper from the cyclone;passing the unmelted adhesive by gravity feed from the hopper to a heater vertically aligned with the hopper;melting the adhesive with the heater;receiving the melted adhesive into a manifold; andpumping melted adhesive through a dispensing hose coupled with an outlet. 27. The method of claim 26, wherein pumping melted adhesive through a dispensing hose comprises pumping the melted adhesive through an outlet located at the bottom of the manifold. 28. The method of claim 26, further comprising: sensing a level of adhesive in the hopper; andcontrolling the delivery of unmelted adhesive into the cyclone based on the sensed level of adhesive.
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