Methods of manufacture of top port surface mount MEMS microphones
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01L-021/00
H04R-031/00
H04R-011/04
H01L-023/12
B81C-001/00
H04R-019/04
H01L-021/78
B81B-007/00
H01L-023/10
B81B-003/00
H04R-019/00
출원번호
US-0321525
(2014-07-01)
등록번호
US-9067780
(2015-06-30)
발명자
/ 주소
Minervini, Anthony D.
출원인 / 주소
Knowles Electronics, LLC
대리인 / 주소
Sughrue Mion, PLLC
인용정보
피인용 횟수 :
7인용 특허 :
160
초록▼
Methods for manufacturing multiple top port, surface mount microphones, each containing a micro-electro-mechanical system (MEMS) microphone die, are disclosed. Each surface mount microphone features a substrate with metal pads for surface mounting the package to a device's printed circuit board and
Methods for manufacturing multiple top port, surface mount microphones, each containing a micro-electro-mechanical system (MEMS) microphone die, are disclosed. Each surface mount microphone features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphones are manufactured from a panel of unsingulated substrates, and each MEMS microphone die is substrate-mounted. Individual covers, each with an acoustic port, are joined to the panel of unsingulated substrates, and each individual substrate and cover pair cooperates to form an acoustic chamber for its respective MEMS microphone die, which is acoustically coupled to the acoustic port in the cover. The completed panel is singulated to form individual MEMS microphones.
대표청구항▼
1. A method for manufacturing a plurality of solder reflow surface mount microelectromechanical system (MEMS) microphones, the method comprising: providing an unsingulated panel comprised of a plurality of individual rectangular substrates, each rectangular substrate including: a rigid base layer co
1. A method for manufacturing a plurality of solder reflow surface mount microelectromechanical system (MEMS) microphones, the method comprising: providing an unsingulated panel comprised of a plurality of individual rectangular substrates, each rectangular substrate including: a rigid base layer comprised of multiple sub-layers of non-conductive material, each sub-layer having a predetermined coefficient of thermal expansion, wherein the base layer has a planar top surface and a planar bottom surface, the top surface having an interior region and an attachment region, the attachment region disposed between the interior region and the edges of the base layer, and completely bounding the interior region;a first plurality of metal pads disposed on the top surface of the base layer and defined by a first solder mask layer;a second plurality of flat metal pads disposed on the bottom surface of the base layer and defined by a second solder mask layer, the second plurality of metal pads arranged to be within a perimeter of the bottom surface of the base layer; andone or more electrical pathways disposed completely within the base layer, wherein the pathways electrically couple one or more of the first plurality of metal pads on the top surface of the base layer to one or more of the second plurality of metal pads on the bottom surface of the base layer;mounting a MEMS microphone die to the top surface of each individual substrate in the panel of unsingulated substrates, and electrically coupling the MEMS microphone die to at least one of the first plurality of metal pads on the top surface of its respective substrate;providing a plurality of single-piece rectangular covers, wherein each rectangular cover is formed from a solid material and has a predetermined shape that comprises a top portion, and a substantially vertical and continuous sidewall portion that adjoins the top portion at an angle and that completely surrounds and supports the top portion, the sidewall portion having a predetermined height, an exterior sidewall surface, an interior sidewall surface, and an attachment surface, wherein each single-piece rectangular cover further comprises an acoustic port disposed in the top portion of the rectangular cover and passing completely through the rectangular cover, wherein the acoustic port is disposed in a position offset from a centerpoint of the top portion of the rectangular cover;attaching one rectangular cover to each substrate of the panel of unsingulated substrates having a MEMS microphone die mounted thereon, wherein the attachment surface of the sidewall portion of the rectangular cover being attached is aligned with and attached to the attachment region of the top surface of its respective individual substrate, andwherein the predetermined height of the sidewall portion of the rectangular cover, the interior surface of the sidewall portion of the rectangular cover, and an interior surface of the top portion of the rectangular cover, in cooperation with the interior region of the top surface of its respective individual substrate, define an acoustic chamber for its respective MEMS microphone die and provide a protective enclosure for its respective MEMS microphone die to reduce electromagnetic interference; andsingulating the substrate panel into discrete surface mount MEMS microphones. 2. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein, for one or more of the substrates of the panel of unsingulated substrates, at least one passive electrical element is electrically coupled between one of the first plurality of metal pads and one of the second plurality of metal pads. 3. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 2, wherein, for each individual substrate of the panel of unsingulated substrates that includes at least one passive electrical element, the at least one passive electrical element is disposed within the base layer of the individual substrate. 4. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 3, wherein, for each individual substrate of the panel of unsingulated substrates that includes at least one passive electrical element, the at least one passive electrical element includes a dielectric or resistive material that is different from the sub-layers of non-conductive material in the base layer of the individual substrate. 5. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 2, wherein, for each individual substrate in the panel of unsingulated substrates, the at least one passive electrical element is configured to filter one or more of an input signal, an output signal, or input power. 6. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein, for one or more of the plurality of individual rectangular covers, the rectangular cover further comprises an acoustic material that substantially blocks contaminants from entering the acoustic chamber through the acoustic port. 7. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein, for one or more of the substrates of the panel of unsingulated substrates, one or more sub-layers of the base layer include FR-4 printed circuit board material. 8. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein, for each individual microphone, the enclosure protects the MEMS microphone die from at least one of light and physical damage. 9. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein, for each individual microphone, a diaphragm of the MEMS microphone die defines a front volume and a back volume within the acoustic chamber, and the acoustic port disposed in the rectangular cover is acoustically coupled to the diaphragm by the front volume. 10. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 9, wherein, for each individual microphone, the interface between the attachment surface of the sidewall portion of the rectangular cover and the attachment region of the top surface of the substrate is sealed to maintain acoustic pressure within the front volume. 11. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein the MEMS microphone die is a pressure-equalizing MEMS microphone die. 12. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein, for each individual microphone, the acoustic port in the rectangular cover is a first acoustic port, and the base layer of the substrate further comprises a second acoustic port disposed in the interior region of the base layer and passing completely through the base layer, wherein the second acoustic port is disposed in a position offset from a centerpoint of the substrate, and wherein one of the second plurality of metal pads is a metal ring that completely surrounds the second acoustic port in the base layer. 13. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 12, wherein, for each individual substrate in the panel of unsingulated substrates, the second acoustic port further comprises a barrier that substantially blocks contaminants from entering the acoustic chamber through the second acoustic port. 14. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 13, wherein, for each individual substrate in the panel of unsingulated substrates, the barrier is a film of polymeric material. 15. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 13, wherein, for each individual substrate in the panel of unsingulated substrates, the barrier is a hydrophobic material. 16. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 12, wherein, for each individual MEMS microphone, the MEMS microphone die is positioned over the second acoustic port in the base layer. 17. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein, for each individual substrate in the panel of unsingulated substrates, the base layer further comprises a recess disposed therein, and the MEMS microphone die is positioned over the recess. 18. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein, for each individual substrate in the panel of unsingulated substrates, the base layer further comprises an internal cavity with an aperture in the top surface of the base layer, and the MEMS microphone die is positioned over the aperture in the top surface of the base layer. 19. A method for manufacturing a plurality of solder reflow surface mount microelectromechanical system (MEMS) microphones, the method comprising: providing an unsingulated panel of rectangular base portions, each individual rectangular base portion including: a rigid base layer comprised of comprised of multiple sub-layers of printed circuit board material, each sub-layer having a predetermined coefficient of thermal expansion, wherein the base layer has a substantially flat upper surface and a substantially flat lower surface, the upper surface having an inner area and a coupling area, the coupling area located between the inner area and the edges of the base layer, and completely surrounding the inner area;a plurality of metal pads located on the upper surface of the base layer and defined by a first solder mask;a plurality of flat solder pads located on the lower surface of the base layer and defined by a second solder mask layer, the plurality of solder pads arranged to be within a perimeter of the lower surface of the base layer;one or more electrical connections passing through the base layer, wherein the connections electrically couple one or more of the plurality of metal pads on the upper surface of the base layer to one or more of the plurality of solder pads on the lower surface of the base layer; andat least one passive electrical element disposed within the base layer and electrically coupled between one of the plurality of metal pads and one of the plurality of solder pads;mounting a MEMS microphone die to the upper surface of each individual base portion in the unsingulated panel of base portions, and electrically coupling each MEMS microphone die to at least one of the plurality of metal pads on the upper surface of the base layer of its respective base portion; andproviding a plurality of rectangular cover portions, each rectangular cover portion formed from a single piece of solid material and having a predetermined shape, each rectangular cover portion having a top portion and a substantially vertical and continuous sidewall portion that adjoins the top portion at an angle and that completely surrounds and supports the top portion, the sidewall portion having a predetermined height, an exterior surface, an interior surface, and a coupling surface, wherein each rectangular cover further comprises an acoustic port disposed in the top portion of the rectangular cover and passing completely through the rectangular cover, wherein the acoustic port is disposed in a position offset from a centerpoint of the top portion of the rectangular cover;coupling one rectangular cover portion to each base portion of the panel of unsingulated base portions having a MEMS microphone die mounted thereon, wherein the coupling surface of the sidewall portion of the cover portion being coupled is aligned with and mechanically coupled to the coupling area of the base layer of its respective base portion;wherein the predetermined height of the sidewall portion of the cover portion, the interior surface of the sidewall portion of the cover portion, and the interior surface of the top portion of the cover portion, in cooperation with the interior region of the upper surface of the base layer of its respective base portion, define an acoustic chamber for the MEMS microphone die and provide a protective enclosure for its respective MEMS microphone die; andwherein the overall length of base portions having a MEMS microphone die mounted thereon and their respective cover portions are substantially equal, and the overall width of the base portions having a MEMS microphone die mounted thereon and their respective cover portions are substantially equal; andsingulating the panel of base portions into discrete surface mount MEMS microphones. 20. A solder reflow surface mount MEMS microphone according to claim 19, wherein, for each individual base portion in the panel of unsingulated base portions, the at least one passive electrical element comprises a dielectric or resistive material that is different from the non-conductive material in the base layer of the base portion. 21. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 19, wherein, for each individual MEMS microphone, the enclosure protects the MEMS microphone die from at least one of light, electromagnetic interference, and physical damage. 22. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 19, wherein, for each individual rectangular cover portion, the rectangular cover portion further comprises an acoustic material that substantially blocks contaminants from entering the acoustic chamber through the acoustic port. 23. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 19, wherein, for each individual MEMS microphone, a diaphragm of the MEMS microphone die defines a front volume and a back volume within the acoustic chamber, and the acoustic port disposed in the top portion of the cover portion is acoustically coupled to the diaphragm; and wherein the interface between the coupling surface of the sidewall portion of the cover portion and the coupling area of the upper surface of the base layer of the base portion is sealed to maintain acoustic pressure within the front volume. 24. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 19, wherein, for each individual microphone, the acoustic port in the rectangular cover portion is a first acoustic port, and the base portion further comprises a second acoustic port located in the inner area of the base layer and passing completely through the base layer, wherein the second acoustic port is disposed in a position offset from a centerpoint of the base portion, wherein one of the second plurality of solder pads is a solder pad ring that completely surrounds the second acoustic port in the base layer, and wherein the MEMS microphone die is positioned over the second acoustic port. 25. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 24, wherein, for each individual base portion in the panel of unsingulated base portions, the second acoustic port further comprises a barrier of polymeric material that substantially blocks contaminants from entering the acoustic chamber through the second acoustic port. 26. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 24, wherein, for each individual base portion in the panel of unsingulated base portions, the second acoustic port further comprises a barrier of hydrophobic material that substantially blocks contaminants from entering the acoustic chamber through the second acoustic port. 27. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 19, wherein, for each individual base portion in the panel of unsingulated base portions, the at least one passive electrical element is configured to filter one or more of an input signal, an output signal, or input power. 28. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 19, wherein, for each individual base portion in the panel of unsingulated base portions, the at least one passive electrical element comprises a dielectric or resistive material that is different from the printed circuit board material in the base layer of the base portion. 29. A method for manufacturing a plurality of solder reflow surface mount microelectromechanical system (MEMS) microphones, the method comprising: providing an unsingulated panel comprising a plurality of rectangular base elements, each individual base element including: a rigid core layer comprised of multiple sub-layers of FR-4 printed circuit board material, each sub-layer having a predetermined coefficient of thermal expansion, wherein the core layer has a substantially flat top surface and a substantially flat bottom surface, the top surface having a die mount region and an attachment region, the attachment region positioned between the die mount region and the edges of the core layer, and completely surrounding the die mount region;a plurality of metal pads located on the top surface of the core layer and defined by a first solder mask;a plurality of flat solder pads located on the bottom surface of the core layer and defined by a second solder mask, the plurality of solder pads arranged to be within a perimeter of the bottom surface of the core layer, wherein the solder pads are plated with at least one metal;a plurality of electrical connections passing through the core layer that electrically couple one or more of the plurality of metal pads on the top surface of the core layer to one or more of the plurality of solder pads on the bottom surface of the core layer; andat least one passive electrical element disposed within the core layer and electrically coupled between one of the plurality of metal pads and one of the plurality of solder pads; anda pressure-equalizing MEMS microphone die having an internal acoustic channel mounted in the die mount region of the core layer, and electrically coupled to one or more of the metal pads on the top surface of the core layer;providing a plurality of single-piece rectangular cover elements formed from a solid material and having a predetermined shape, each rectangular cover element having a top region and a continuous wall region, the continuous wall region supporting the top region and adjoining the top region at a substantially perpendicular angle and having a predetermined height, an exterior surface, an interior surface, and an attachment surface, and an acoustic port located in the top region of the cover element and passing completely through the top region, wherein the acoustic port is disposed in a position offset from a centerpoint of the cover element;coupling a rectangular cover element to each base element of the panel of unsingulated base elements, one cover element to each individual base element, wherein each cover element is coupled to its respective base element such that the attachment surface of the wall region of the cover element is aligned with and physically coupled to the attachment region of the top surface of the core layer of its respective base element, thereby forming a protective enclosure for its respective MEMS microphone die;wherein the interior of the protective enclosure is an acoustic chamber having a volume defined by the predetermined height of wall region of the cover element, and the width and length of the top region of the cover element;wherein a diaphragm of the MEMS microphone die defines a front volume and a back volume within its respective acoustic chamber, and the acoustic port disposed in the cover element is acoustically coupled to the diaphragm; andwherein the interface between the attachment surface of the continuous wall region of cover element and the attachment area of the top surface of the core layer of the base element is sealed to prevent the escape of acoustic pressure from the front volume; andsingulating the panel of base elements into discrete surface mount MEMS microphones. 30. A solder reflow surface mount MEMS microphone according to claim 29, wherein, for each individual base element in the panel of unsingulated base elements, the at least one passive electrical element comprises a dielectric or resistive material that is different from the FR-4 printed circuit board material in the core layer of the base element. 31. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 29, wherein, for each individual MEMS microphone, the enclosure protects the MEMS microphone die from at least one of light, electromagnetic interference, and physical damage. 32. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 29, wherein for each individual cover element, the cover element further comprises an acoustic material that substantially blocks contaminants from entering the acoustic chamber through the acoustic port. 33. A solder reflow surface mount MEMS microphone according to claim 29, wherein, for each individual base element in the panel of unsingulated base elements, the core layer of the base element further comprises an internal cavity with an aperture in the top surface of the core layer, and the MEMS microphone die is positioned over the aperture in the top surface of the core layer. 34. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 29, wherein, for each individual base element in the panel of unsingulated base elements, the at least one passive electrical element is configured to filter one or more of an input signal, an output signal, or input power. 35. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 29, wherein, for each individual base element in the panel of unsingulated base elements, the at least one passive electrical element comprises a dielectric or resistive material that is different from the printed circuit board material in the core layer of the base element. 36. A method for manufacturing a plurality of solder reflow surface mount microelectromechanical system (MEMS) microphones, the method comprising: providing a plurality of pressure-equalizing MEMS microphone die, each having an internal acoustic channel;providing an unsingulated panel that includes a plurality of first housing elements each having a rectangular shape, the first housing elements further including: a rigid core layer comprised of multiple layers of FR-4 printed circuit board material, each layer of FR-4 material having a predetermined coefficient of thermal expansion, wherein the core layer has a substantially flat top surface and a substantially flat bottom surface, wherein the top surface has an die mount region and an attachment region, the attachment region being arranged between the die mount region and the edges of the core layer, and the attachment region completely surrounds the die mount region;a plurality of metal pads disposed on the top surface of the core layer and defined by a first solder mask layer, wherein the metal pads are plated with at least one metal;a plurality of flat solder pads disposed on the bottom surface of the core layer and defined by a second solder mask layer, the plurality of solder pads arranged to be within a perimeter of the bottom surface of the core layer, wherein the solder pads are plated with at least one metal;one or more electrical vias located inside the core layer, wherein the vias electrically couple one or more of the plurality of metal pads on the top surface of the core layer to one or more of the plurality of solder pads on the bottom surface of the core layer; andat least one passive electrical element disposed within the core layer and electrically coupled between one of the plurality of metal pads and one of the plurality of solder pads, wherein the at least one passive electrical element includes a dielectric or resistive material that is different from the printed circuit board material in the core layer;providing a plurality of second housing elements each having a rectangular shape, each second housing element formed from a single piece of solid material, and having a substantially flat top region and a continuous wall region, the continuous wall region supporting the top region and adjoining the top region at a substantially perpendicular angle, the continuous wall region having a predetermined height, an exterior surface, an interior surface, and an attachment surface, and an acoustic port located in the top region of the second housing element and passing completely through the second housing element, wherein the acoustic port is disposed in a position offset from a centerpoint of the second housing element;coupling one of the plurality of MEMS microphone die to one or more of the first housing elements in the unsingulated panel of first housing elements, wherein each MEMS microphone die is disposed in the die mount region of the core layer of its respective first housing element, and electrically coupled to one or more of the metal pads on the top surface of the core layer of its respective first housing element;assembling a protective housing for each MEMS microphone die mounted on a first housing element in the unsingulated panel of first housing elements by coupling one of the second housing elements to each first housing element in the unsingulated panel of first housing elements having a MEMS microphone die mounted thereon, wherein the attachment surface of the wall region of the second housing element is aligned with and physically coupled to the attachment region of the top surface of the core layer of the first housing element, thereby forming a protective enclosure for the MEMS microphone die, andwherein the interior of the protective enclosure is an acoustic chamber having a volume defined by the predetermined height of wall region of the second housing element, and the width and length of the top region of the second housing element; andsingulating the panel of first housing elements into discrete surface mount MEMS microphones. 37. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 36, wherein the enclosure of each surface mount MEMS microphone protects its respective MEMS microphone die from at least one of light, electromagnetic interference, and physical damage. 38. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 36, wherein, for one or more of the first second housing elements in the unsingulated panel of first housing elements, the top region of the second housing element further includes an acoustic material that substantially blocks contaminants from passing through the acoustic port. 39. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 36, wherein, for each first housing element in the unsingulated panel of first housing elements, the core layer of the first housing element further comprises an internal cavity with an aperture in the top surface of the core layer, and the MEMS microphone die is positioned over the aperture in the top surface of the core layer. 40. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 36, wherein, for each first housing element in the unsingulated panel of first housing elements, the at least one passive electrical element is configured to filter one or more of an input signal, an output signal, or input power.
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Kaiser William J. (Los Angeles CA) Pister Kristofer S. J. (Pacific Palisades CA) Stafsudd Oscar M. (Los Angeles CA) Nelson Phyllis R. (Mar Vista CA) Burstein Amit (N. Hollywood CA), CMOS integrated microsensor with a precision measurement circuit.
Fasano Benjamin V. ; Indyk Richard F. ; Kamath Sundar M. ; Knickerbocker John U. ; Langenthal Scott I. ; O'Connor Daniel P. ; Reddy Srinivasa S. N., Ceramic substrate having a sealed layer.
Sprenkels Adrianus J. (Enschede NLX) Bergveld Piet (Enschede NLX), Electroacoustic transducer of the so-called “electret”type, and a method of making such a transducer.
Sprenkels Adrianus J. (Enschede NLX) Bergveld Piet (Enschede NLX), Electroacoustic transducer of the so-called “electret”type, and a method of making such a transducer.
Ristic Ljubisa (Paradise Valley AZ) Koury Daniel N. (Mesa AZ) Schmiesing John E. (Tempe AZ) Gutteridge Ronald J. (Paradise Valley AZ) Hughes Henry G. (Scottsdale AZ), Electronic device enclosure including a conductive cap and substrate.
McNeal Norman E. (Carlsbad CA) Nagy Richard A. (Leucadia CA) Norell Ronald A. (Carlsbad CA), Epoxy-glass integrated circuit package having bonding pads in a stepped cavity.
Sjursen,Walter P.; Mahoney,Derek D.; Margicin,John M.; Fritz,Frederick J.; Aceti,John G.; Preves,David A.; Palanisamy,Ponnusamy, Hearing aid with large diaphragm microphone element including a printed circuit board.
Lesinski S. George (324 Bishopsbridge Dr. Cincinnati OH 45255) Henderson H. Thurman (4010 Clifton Ave. Cincinnati OH 45220), Implantable auditory system with micromachined microsensor and microactuator.
Glenn Thomas P. ; Hollaway Roy D.,PHX ; Panczak Anthony E., Method of making integrated circuit package having adhesive bead supporting planar lid above planar substrate.
Johannsen, Ib; Larsen, Niels Bent; Mullenborn, Matthias; Rombach, Pirmin Hermann Otto, Method of providing a hydrophobic layer and a condenser microphone having such a layer.
Johannsen, Ib; Larsen, Niels Bent; Mullenborn, Matthias; Rombach, Pirmin Hermann Otto, Method of providing a hydrophobic layer and condenser microphone having such a layer.
Volant, Richard P.; Angell, David; Canaperi, Donald F.; Kocis, Joseph T.; Petrarca, Kevin S.; Stein, Kenneth J.; Wille, William C., Micro electromechanical switch having self-aligned spacers.
Carney Francis J. ; Carson George Amos ; Celaya Phillip C. ; Fuerhaupter Harry ; Jones Frank Tim ; Klosterman Donald H. ; Melton Cynthia M. ; Knapp James Howard ; Nelson Keith E., Microelectronic package including a polymer encapsulated die.
Carney Francis J. ; Carson George Amos ; Celaya Phillip C. ; Fuerhaupter Harry ; Jones Frank Tim ; Klosterman Donald H. ; Melton Cynthia M. ; Knapp James Howard ; Nelson Keith E., Microelectronic package including a polymer encapsulated die, and method for forming same.
Pasqualoni Anthony M. (Hamden CT) Mahulikar Deepak (Madison CT) Jewell Francis S. (Meriden CT) Hoffman Paul R. (Modesto CA) Brathwaite George (Hayward CA) McNabb Richard (Manteca CA) Ramirez German (, Polymer plug for electronic packages.
Giachino Joseph M. (Farmington Hills MI) Haeberle Russell J. (Canton MI) Crow Joseph W. (Livonia MI), Semiconductor variable capacitance pressure transducer assembly.
Guzuk Andrzej T. (Pompano Beach FL) Roshitsh Todd W. (No. Lauderdale FL) Engstrom Scott M. (Coral Springs FL) Bernardoni Lonnie L. (Coral Springs FL), Shielded low-profile electronic component assembly.
Knecht Thomas A. (Crystal Lake IL) Mancini Brian M. (Carol Stream IL) Achille Jean-Robert (Bloomingdale IL) Sieben David J. (Palatine IL), Shielding apparatus for non-conductive electronic circuit packages.
Masato Higuchi JP; Atsushi Hirakawa JP; Shinobu Uesugi JP; Koichi Kanryo JP, Surface acoustic wave device having a package including a conductive cap that is coated with sealing material.
Rector Louis ; Hyatt Hugh M. ; Minervini Anthony ; Swensen Robert ; Neuhalfen Andrew J. ; Elliott Andrew W. S., Surface-mountable device for protection against electrostatic damage to electronic components.
Brown Reed S. (Indianapolis IN) Brzezinski Alex M. (Indianapolis IN) Jue Tinyee (Shreveport LA) Woods ; Jr. William L. (Keithville LA) Zieles Robert S. (Indianapolis IN), Telephone handset construction.
Harris Daryl ; Kaschke Kevin D. ; Bond David L., Telephone set having a microphone for receiving or an earpiece for generating an acoustic signal via a keypad.
Gueorguiev, Svetoslav Radoslavov; Furst, Claus Erdmann; Joergensen, Tore Sejr, Apparatus and method for high voltage I/O electro-static discharge protection.
Nielsen, John; Mortensen, Anders Svava; Larsen, Rene Rye; Popper, Robert A.; Nandy, Dibyendu; Midtgaard, Jacob, Signal processing platform in an acoustic capture device.
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