System for transmitting electrical current to a bodily tissue
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
A61N-001/00
A61N-001/36
A61N-001/04
A61N-001/375
A61N-001/362
출원번호
US-0513318
(2010-12-01)
등록번호
US-9072896
(2015-07-07)
국제출원번호
PCT/US2010/058525
(2010-12-01)
§371/§102 date
20120808
(20120808)
국제공개번호
WO2011/068849
(2011-06-09)
발명자
/ 주소
Dar, Amit
Feldman, Shai
Glukhovsky, Arkady
Springer, Shmuel
Regev, Einan
출원인 / 주소
Bioness Inc.
대리인 / 주소
Cooley LLP
인용정보
피인용 횟수 :
4인용 특허 :
72
초록▼
In some embodiments, an apparatus includes a substantially rigid base and a flexible substrate. The substantially rigid base has a first protrusion and a second protrusion, and is configured to be coupled to an electronic device. The flexible substrate has a first surface and a second surface, and i
In some embodiments, an apparatus includes a substantially rigid base and a flexible substrate. The substantially rigid base has a first protrusion and a second protrusion, and is configured to be coupled to an electronic device. The flexible substrate has a first surface and a second surface, and includes an electrical circuit configured to electronically couple the electronic device to at least one of an electrode a battery, or an antenna. The flexible substrate is coupled to the base such that a first portion of the second surface is in contact with the first protrusion. A second portion of the second surface is non-parallel to the first portion.
대표청구항▼
1. An apparatus, comprising: a rigid base having a protrusion, the base configured to be coupled to an electronic device; anda flexible substrate having a first surface and a second surface and including an electrical circuit configured to electronically couple the electronic device to an antenna, t
1. An apparatus, comprising: a rigid base having a protrusion, the base configured to be coupled to an electronic device; anda flexible substrate having a first surface and a second surface and including an electrical circuit configured to electronically couple the electronic device to an antenna, the antenna coupled directly to the flexible substrate, the flexible substrate coupled to the base such that a first portion of the second surface is in contact with the protrusion, a second portion of the second surface is non-parallel to the first portion. 2. The apparatus of claim 1, wherein at least a first portion of the flexible substrate is disposed within a first slot defined by the base, at least a second portion of the flexible substrate is disposed within a second slot defined by the base, the first slot different than the second slot. 3. The apparatus of claim 1, wherein the base defines a plurality of slots, each slot of the plurality of slots configured to receive a portion of the flexible substrate. 4. The apparatus of claim 1, wherein: a first portion of the first surface of the flexible substrate includes at least a portion of the electrical circuit, the portion of the electrical circuit configured to be in electrical communication with an electrical contact disposed on a first portion of the electronic device; andthe base includes a second protrusion configured to engage a second portion of the electronic device when the electronic device is coupled to the base, the second portion of the electronic device different than the first portion of the electronic device. 5. The apparatus of claim 1, further comprising: a hydrogel electrode coupled to the second surface of the substrate, the substrate further including a conductive region electrically coupled to the electrical circuit and a plurality of non-conductive regions configured to facilitate retention of the hydrogel electrode with respect to the second surface of the substrate. 6. An apparatus, comprising: a flexible housing configured to be disposed about at least a portion of a stimulator assembly, the stimulator assembly including at least a battery, an electrode, and a stimulus generator, the housing including a receiving portion configured to receive at least a portion of the stimulus generator, the receiving portion defining a first opening configured to receive a protrusion of the stimulus generator when the stimulus generator is received in the receiving portion such that the stimulus generator is electrically coupled to the battery, the receiving portion defining a second opening different than the first opening, the second opening configured to receive a protrusion of a base of the stimulator assembly such that the protrusion can limit movement of the stimulus generator with respect to the housing when the stimulus generator is received in the receiving portion of the housing. 7. The apparatus of claim 6, wherein a portion of the housing is configured to form a substantially fluid-tight seal proximate to the receiving portion when at least the portion of the stimulus generator is received in the receiving portion. 8. The apparatus of claim 6, wherein the housing defines a recess configured to receive a fastening member of the stimulator assembly, the fastening member configured to limit movement of the housing relative to the stimulator assembly when the housing is disposed about the portion of the stimulator assembly and the fastening member is received in the recess. 9. The apparatus of claim 6, wherein the housing is configured to substantially maintain the stimulus generator in electrical communication with an electrical pathway coupled to a substrate of the stimulator assembly when the stimulus generator is received in the receiving portion, the electrical pathway electrically couples the stimulus generator to at least one of the electrode or the battery. 10. A method, comprising the steps of: folding a tab portion of a flexible substrate such that the tab portion of the flexible substrate is in contact with a bottom side of a body portion of the flexible substrate and such that an electrical circuit formed on a top side of the flexible substrate extends about an edge of the fold, the flexible substrate configured to be coupled to a body. 11. The method of claim 10, further comprising: coupling at least a portion of the flexible substrate to a rigid base. 12. The method of claim 10, further comprising: disposing a first portion of the flexible substrate including the electrical circuit over a protrusion of a rigid base such that the first portion of the flexible substrate is non-parallel to a second portion of the flexible substrate. 13. The method of claim 10, further comprising: weaving at least a portion of the flexible substrate through a slot defined by a rigid base. 14. The method of claim 10, wherein the tab portion is a first tab portion, further comprising: folding a second tab portion of the flexible substrate such that the second tab portion of the flexible substrate is in contact with the bottom side of the body portion of the flexible substrate and such that the electrical circuit extends about an edge of the fold of the second tab portion. 15. An apparatus, comprising: a hydrogel electrode; anda substrate including a lower surface, a conductive region, and a plurality of discrete non-conductive regions, the conductive region electrically coupled to an electrical circuit of the substrate and to the hydrogel electrode, the plurality of discrete non-conductive regions configured to facilitate coupling of the hydrogel electrode with the lower surface of the substrate, at least one non-conductive region of the plurality of discrete non-conductive regions extending beyond a surface of the conductive region. 16. An apparatus, comprising: a hydrogel electrode; anda substrate including a lower surface, a conductive region, and a plurality of discrete non-conductive regions, the conductive region electrically coupled to an electrical circuit of the substrate and to the hydrogel electrode, the plurality of discrete non-conductive regions configured to facilitate coupling of the hydrogel electrode with the lower surface of the substrate, at least one non-conductive region of the plurality of discrete non-conductive regions is at least one of (1) a solder mask, (2) a cavity formed in a surface of the conductive region, or (3) formed by a coating applied to a surface of the conductive region. 17. The apparatus of claim 16, wherein at least one non-conductive region of the plurality of discrete non-conductive regions is formed by a coating applied to the surface of the conductive region. 18. The apparatus of claim 16, wherein at least one non-conductive region of the plurality of discrete non-conductive regions is a cavity formed in a surface of the conductive region. 19. The apparatus of claim 16, wherein at least one non-conductive region of the plurality of discreet non-conductive regions is a solder mask. 20. The apparatus of claim 1, wherein the electrical circuit is configured to electronically couple the electronic device to at least one of an electrode or a battery.
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