[특허]Microwave energy interactive insulating structure

Graphic Packaging International, Inc.

검색어에 아래의 연산자를 사용하시면 더 정확한 검색결과를 얻을 수 있습니다.
검색연산자

검색도움말
검색연산자	기능	검색시 예
()	우선순위가 가장 높은 연산자	예1) (나노 (기계 \| machine))
공백	두 개의 검색어(식)을 모두 포함하고 있는 문서 검색	예1) (나노 기계) 예2) 나노 장영실
\|	두 개의 검색어(식) 중 하나 이상 포함하고 있는 문서 검색	예1) (줄기세포 \| 면역) 예2) 줄기세포 \| 장영실
!	NOT 이후에 있는 검색어가 포함된 문서는 제외	예1) (황금 !백금) 예2) !image
*	검색어의 *란에 0개 이상의 임의의 문자가 포함된 문서 검색	예) semi*
""	따옴표 내의 구문과 완전히 일치하는 문서만 검색	예) "Transform and Quantization"

과학기술 지식인프라 ScienceON

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

특허 상세정보

MyON담기

내보내기 페이스북 공유 트위터 공유 카카오톡 공유

Microwave energy interactive insulating structure

특허상세정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H05B-006/80 H05B-006/64 B32B-001/02 B65D-081/34
출원번호	US-0070091 (2008-02-15)
등록번호	US-9073689 (2015-07-07)
발명자 / 주소	Files, John Cameron Middleton, Scott W.
출원인 / 주소	Graphic Packaging International, Inc.
대리인 / 주소	Womble Carlyle Sandridge & Rice, LLP
인용정보	피인용 횟수 : 1 인용 특허 : 150

초록

A microwave energy interactive structure for heating, browning, and/or crisping a food item in a microwave oven includes a plurality of layers including a layer of microwave energy interactive material and a substantially continuous tie layer. The tie layer includes a thermoplastic material. Upon sufficient exposure to microwave energy, the tie layer softens and allows the adjacent layers to separate from one another to define a void between the respective layers.

대표
청구항
▼

1. A microwave energy interactive structure comprising: a support layer having a first side and a second side opposite one another;a susceptor film joined to the first side of the support layer, the susceptor film comprising a layer of microwave energy interactive material supported on a first polymer film, wherein the susceptor film is joined to the first side of the support layer so that the layer of microwave energy interactive material is positioned between the first polymer film and the first side of the support layer; anda second polymer film joined to the second side of the support layer, the second polymer film being joined to the second side of the support layer by a substantially continuous tie layer, wherein the tie layer comprises a thermoplastic material, and wherein a void forms within the tie layer in response to microwave energy, and the void is spaced apart from at least one of the support layer and the second polymer film within the tie layer so that a portion of the thermoplastic material of the tie layer is disposed between the void and the at least one of the support layer and the second polymer film. 2. The structure of claim 1, wherein the susceptor film remains joined to the first side of the support layer when the void is formed in the tie layer. 3. The structure of claim 1, wherein the void is a thermal insulating void. 4. The structure of claim 3, wherein the thermal insulating void is a first thermal insulating void of a plurality of thermal insulating voids formed within the tie layer. 5. The structure of claim 1, wherein the tie layer includes an area having a first bond strength, andan area having a second bond strength greater than the first bond strength, wherein the void forms proximate to the first area. 6. The structure of claim 1, wherein the thermoplastic material has a softening temperature, andthe tie layer comprises at least one other material that does not soften at the softening temperature of the thermoplastic material. 7. The structure of claim 6, wherein the thermoplastic material is a first thermoplastic material, andthe other material is a second thermoplastic material having a softening temperature greater than the softening temperature of the first thermoplastic material, wherein the void forms proximate to the first thermoplastic material. 8. The structure of claim 6, wherein the void forms proximate to the thermoplastic material. 9. The structure of claim 1, wherein the thermoplastic material has an affinity for each of the support layer and the second polymer film, andthe tie layer comprises at least one other material that has an affinity for at least one of the support layer and the second polymer film that differs from the respective affinity of the thermoplastic material. 10. The structure of claim 1, wherein the thermoplastic material comprises a polymer. 11. The structure of claim 10, wherein the polymer is selected from the group consisting of a polyolefin, a polyamide, a polyester, a thermoplastic elastomer, any copolymer thereof, and any combination thereof. 12. The structure of claim 10, wherein the polymer is selected from the group consisting of polypropylene, polyethylene, low density polyethylene, any copolymer thereof, and combination thereof. 13. The structure of claim 1, wherein the tie layer further comprises a colorant in an amount of from about 1 wt % to about 15 wt % of the tie layer. 14. The structure of claim 13, wherein the colorant is selected from the group consisting of titanium dioxide, carbon black, and any combination thereof. 15. The structure of claim 1, wherein the support layer is a moisture-providing layer. 16. The structure of claim 15, wherein the support layer comprises paper, paperboard, or any combination thereof. 17. The structure of claim 1, further comprising a reagent layer including at least one reagent that generates a gas in response to heat. 18. The structure of claim 17, wherein the reagent layer is disposed between the support layer and the second polymer film. 19. The structure of claim 17, wherein the reagent layer is disposed between the layer of microwave energy interactive material and the support layer. 20. The structure of claim 1, wherein the second polymer film includes a first side facing the support layer and a second side opposite the first side, andthe first side of the second polymer film includes printed matter. 21. A method of making the structure of claim 1, the method comprising: joining the layer of microwave energy interactive material of the susceptor film to the first side of the support layer with the substantially continuous layer of adhesive; andjoining the second polymer film to the second side of the support layer. 22. The method of claim 21, wherein joining the second polymer film to the second side of the support layer comprises extruding the tie layer onto the second side of the support layer, andbringing the second side of the second polymer film into contact with the tie layer. 23. The method of claim 22, wherein the method further comprises passing the structure susceptor film, support layer, tie layer, and second polymer film through a patterned nip assembly to define an area having a first bond strength and an area having a second bond strength greater than the first bond strength, wherein the void forms proximate to the area having the first bond strength. 24. The method of claim 21, wherein joining the second polymer film to the second side of the support layer comprises forming the tie layer between the second polymer film and the second side of the support layer. 25. The method of claim 24, wherein the method further comprises passing the susceptor film, support layer, tie layer, and second polymer film through a patterned nip assembly to define an area having a first bond strength and an area having a second bond strength greater than the first bond strength, wherein the void forms proximate to the area having the first bond strength. 26. The method of claim 21, wherein the second polymer film includes a first surface facing the support layer and a second surface opposite the first surface, andthe method further comprises printing the first surface of the second polymer film before joining the second polymer film to the support layer. 27. A microwave energy interactive structure comprising: a support layer having a first side and a second side opposite one another;a susceptor film joined to the first side of the support layer, the susceptor film comprising a layer of microwave energy interactive material supported on a first polymer film, wherein the susceptor film is joined to the first side of the support layer so that the layer of microwave energy interactive material is positioned between the first polymer film and the first side of the support layer; anda second polymer film joined to the second side of the support layer, the second polymer film being joined to the second side of the support layer by a tie layer having a thickness, wherein the tie layer comprises a first polymer and a second polymer, and wherein a void forms within the tie layer proximate to the first polymer in response to microwave energy, and the void is spaced apart from at least one of the support layer and the second polymer film in the tie layer so that a portion of the first polymer is disposed between the void and the at least one of the support layer and the second polymer film. 28. The structure of claim 27, wherein the first polymer and the second polymer each have a softening temperature, andthe softening temperature of the first polymer is less than the softening temperature of the second polymer. 29. A microwave energy interactive structure comprising: a support layer having a first side and a second side opposite one another;a susceptor film joined to the first side of the support layer, the susceptor film comprising a layer of microwave energy interactive material supported on a first polymer film, wherein the susceptor film is joined to the first side of the support layer so that the layer of microwave energy interactive material is positioned between the first polymer film and the first side of the support layer; anda second polymer film joined to the second side of the support layer by a substantially continuous tie layer having a thickness, the second polymer film being joined to the second side of the support layer by the tie layer to define areas having a first bond strength of the tie layer and areas having a second bond strength greater than the first bond strength, wherein voids form within the tie layer proximate to the areas having the first bond strength in response to microwave energy, and wherein the voids are spaced apart from at least one of the support layer and the second polymer film in the tie layer so that a portion of the tie layer is disposed between the void and the at least one of the support layer and the second polymer film. 30. The structure of claim 29, wherein the areas having the second bond strength are defined by applying pressure to the susceptor film, support layer, tie layer, and second polymer film. 31. The structure of claim 27, wherein the first polymer is a thermoplastic polymer, andthe second polymer is a thermoset polymer. 32. The structure of claim 27, wherein the first polymer and the second polymer each have an affinity for each of the support layer and the second polymer film, andthe affinity of the first polymer for at least one of the support layer and the second polymer film differs from the respective affinity of the second polymer for the at least one of the support layer and the second polymer film. 33. The structure of claim 27, wherein the susceptor film remains joined to the first side of the support layer when the void is formed within the tie layer. 34. The structure of claim 33, wherein the void is a first void of a plurality of voids formed within the tie layer. 35. The structure of claim 27, wherein the support layer comprises moisture. 36. The structure of claim 27, wherein the support layer comprises at least one of paper, paperboard, or a polymer film. 37. The structure of claim 29, wherein the susceptor film remains joined to the first side of the support layer when the voids are formed in the tie layer. 38. The structure of claim 29, wherein the support layer comprises moisture. 39. The structure of claim 29, wherein the support layer comprises at least one of paper, paperboard, or a polymer film. 40. A method of making the structure of claim 29, the method comprising: joining the layer of microwave energy interactive material of the susceptor film to the first side of the support layer with the substantially continuous layer of adhesive; andjoining the second polymer film to the second side of the support layer. 41. The method of claim 40, wherein joining the second polymer film to the second side of the support layer comprises extruding the tie layer onto the second side of the support layer, andbringing the second side of the second polymer film into contact with the tie layer. 42. The method of claim 41, wherein the method further comprises passing the structure susceptor film, support layer, tie layer, and second polymer film through a patterned nip assembly to define the areas having the first bond strength and the areas having the second bond strength. 43. The method of claim 40, wherein joining the second polymer film to the second side of the support layer comprises forming the tie layer between the second polymer film and the second side of the support layer. 44. The method of claim 43, wherein the method further comprises passing the susceptor film, support layer, tie layer, and second polymer film through a patterned nip assembly to define the areas having the first bond strength and the areas having the second bond strength. 45. A microwave energy interactive structure comprising: a support layer having a first side and a second side opposite one another;a susceptor film joined to the first side of the support layer, the susceptor film comprising a layer of microwave energy interactive material supported on a first polymer film, wherein the susceptor film is joined to the first side of the support layer so that the layer of microwave energy interactive material is positioned between the first polymer film and the first side of the support layer; anda second polymer film joined to the second side of the support layer, the second polymer film being joined to the second side of the support layer by a substantially continuous tie layer, wherein the tie layer comprises a thermoplastic material, wherein at least one void forms within the tie layer in response to microwave energy, and wherein the at least void is free from contact with at least one of the support layer and the second polymer film within the tie layer so that a portion of the thermoplastic material of the tie layer is disposed between the at least one void and the at least one of the support layer and the second polymer film.

이 특허에 인용된 특허 (150)

이 특허를 인용한 특허 피인용횟수: 1

Linton, Joshua M.. Apparatus for providing customizable heat zones in an oven. USP20190410251223.

IPC 상위 출원인

내보내기

상세정보
내보내기 구분	파일저장 인쇄 메일전송
구성항목	관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표IPC 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 공고번호, 공고일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표출원인, 출원인국적, 출원인주소, 발명자, 발명자E, 발명자코드, 발명자주소, 발명자 우편번호, 발명자국적, 대표IPC, IPC코드, 요약, 미국특허분류, 대리인주소, 대리인코드, 대리인(한글), 대리인(영문), 국제공개일자, 국제공개번호, 국제출원일자, 국제출원번호, 우선권, 우선권주장일, 우선권국가, 우선권출원번호, 원출원일자, 원출원번호, 지정국, Citing Patents, Cited Patents
저장형식	Text(ASCII format) Excel format PIAS분석(.xls)
메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
안내	> 총 건의 자료가 검색되었습니다. > 다운받으실 자료의 인덱스를 입력하세요. (1-10,000) > 검색결과의 순서대로 최대 10,000건 까지 다운로드가 가능합니다. > 데이타가 많을 경우 속도가 느려질 수 있습니다.(최대 2~3분 소요) > 다운로드 파일은 UTF-8 형태로 저장됩니다. 파일의 내용이 제대로 보이지 않을실 때는 웹브라우저 상단의 보기 -> 인코딩 -> 자동선택 여부를 확인하십시오 > ~ > Text(ASCII format) Excel format

과학기술 지식인프라 ScienceON

ScienceON Chatbot

연합인증

특허 상세정보

Microwave energy interactive insulating structure

초록

대표
청구항
▼

이 특허에 인용된 특허 (150)

이 특허를 인용한 특허 피인용횟수: 1

IPC 상위 출원인

과제정보

상세정보조회

원문조회

IPC 상세정보(version : 201201)

연구과제 성과물(0)

참여연구원의 다른 문헌(0)

처리중입니다.

잠시만 기다려주세요.

ScienceON Chatbot

연합인증

특허 상세정보

Microwave energy interactive insulating structure

초록

대표청구항 ▼

이 특허에 인용된 특허 (150)

이 특허를 인용한 특허 피인용횟수: 1

IPC 상위 출원인

과제정보

상세정보조회

원문조회

IPC 상세정보(version : 201201)

연구과제 성과물(0)

참여연구원의 다른 문헌(0)

처리중입니다.

잠시만 기다려주세요.

대표
청구항
▼