An image display device having improved properties, comprising an image display panel, heat dispersion material positioned proximate to the image display panel, an open frame positioned proximate to the heat dispersion material opposite the image display panel, and a plurality of electronic componen
An image display device having improved properties, comprising an image display panel, heat dispersion material positioned proximate to the image display panel, an open frame positioned proximate to the heat dispersion material opposite the image display panel, and a plurality of electronic components engaging the open frame, the image display device exhibits a support factor of less than about 375 mm-W/m° K.
대표청구항▼
1. A method for improving a characteristic of the frame system of an image display device comprising: providing frame system which comprises a support member to which is attached an image display panel;providing a heat dispersion material having an in-plane thermal conductivity of at least about 250
1. A method for improving a characteristic of the frame system of an image display device comprising: providing frame system which comprises a support member to which is attached an image display panel;providing a heat dispersion material having an in-plane thermal conductivity of at least about 250 W/m-K and a thermal anisotropic ratio of no less than about 10 positioned proximate to the image display panel, the heat dispersion material comprising at least one sheet of compressed particles of exfoliated graphite, wherein the frame system exhibits a support factor of less than about 150 mm-W/m-K, where the support factor is determined by multiplying the thickness of the support member by its in-plane thermal conductivity and further wherein the image display device exhibits improved temperature uniformity as compared to an image display device having a frame system which exhibits a support factor of less than about 150 mm-W/m-K but does not include a heat dispersion material having an in-plane thermal conductivity of at least about 250 W/m-K and a thermal anisotropic ratio of no less than about 10 positioned proximate to the image display panel. 2. The method of claim 1, wherein the improved characteristic comprises increased luminance, decreased image sticking, improved thermal properties, or combinations thereof. 3. The method of claim 2, further comprising providing an open frame positioned proximate to the heat dispersion material opposite the image display panel, wherein the open frame including a height and a width, wherein the heat dispersion material is positioned so as to substantially span the height and the width. 4. The method of claim 2, wherein the image display device exhibits a support factor of 0 mm-W/m-K. 5. A frame system for an image display device having improved luminance comprising: a support member to which is attached an the image display panel;heat dispersion material having an in-plane thermal conductivity of at least about 250 W/m-K and a thermal anisotropic ratio of no less than about 10 positioned proximate to the image display panel, the heat dispersion material comprising at least one sheet of compressed particles of exfoliated graphite; andan open frame positioned proximate to the heat dispersion material opposite the image display panel, wherein the frame system exhibits a support factor of less than about 150 mm-W/m-K, where the support factor is determined by multiplying the thickness of the support member by its in-plane thermal conductivity and further wherein the image display device exhibits improved temperature uniformity as compared to an image display device having a frame system which exhibits a support factor of less than about 150 mm-W/m-K but does not include a heat dispersion material having an in-plane thermal conductivity of at least about 250 W/m-K and a thermal anisotropic ratio of no less than about 10 positioned proximate to the image display panel. 6. The frame system of claim 5, further including a first cross support spanning the open frame and a plurality of second printed circuit boards engaging the first cross support. 7. The frame system of claim 5, wherein the open frame including a height and a width, wherein the heat dispersion material substantially spans the height and the width. 8. The frame system of claim 5, which exhibits a support factor of 0 mm-W/m-K. 9. The frame system of claim 5, which further comprises at least one fan. 10. A frame system for an image display device exhibiting decreased image sticking comprising: a support member to which is attached an image display panel;heat dispersion material having an in-plane thermal conductivity of at least about 250 W/m-K and a thermal anisotropic ratio of no less than about 10 positioned proximate to the image display panel, the heat dispersion material comprising at least one sheet of compressed particles of exfoliated graphite;an open frame positioned proximate to the heat dispersion material opposite the image display panel; anda plurality of electronic components engaging the open frame, wherein the frame system exhibits a support factor of less than about 150 mm-W/m-K, where the support factor is determined by multiplying the thickness of the support member present in the frame system by its in-plane thermal conductivity and further wherein the image display device exhibits improved temperature uniformity as compared to an image display device having a frame system which exhibits a support factor of less than about 150 mm-W/m-K but does not include a heat dispersion material having an in-plane thermal conductivity of at least about 250 W/m-K and a thermal anisotropic ratio of no less than about 10 positioned proximate to the image display panel. 11. The frame system of claim 10, further including a first cross support spanning the open frame and a plurality of second printed circuit boards engaging the first cross support. 12. The frame system of claim 11, further including a second cross support spanning the open frame wherein at least one of the second printed circuit boards engages the second cross support. 13. The frame system of claim 10, wherein the open frame is composed of steel. 14. The frame system of claim 10, wherein the open frame including a height and a width, wherein the heat dispersion material substantially spans the height and the width. 15. The frame system of claim 10, which exhibits a support factor of 0 mm-W/m-K. 16. A frame system for an image display device having improved thermal properties comprising: a support member to which is attached an image display panel;heat dispersion material having an in-plane thermal conductivity of at least about 250 W/m-K and a thermal anisotropic ratio of no less than about 10 positioned proximate to the image display panel, the heat dispersion material comprising at least one sheet of compressed particles of exfoliated graphite;an open frame positioned proximate to the heat dispersion material opposite the image display panel; anda plurality of electronic components engaging the open frame, wherein the frame system exhibits a support factor of less than about 150 mm-W/m-K, where the support factor is determined by multiplying the thickness of the support member present in the frame system by its in-plane thermal conductivity and further wherein the image display device exhibits improved temperature uniformity as compared to an image display device having a frame system which exhibits a support factor of less than about 150 mm-W/m-K but does not include a heat dispersion material having an in-plane thermal conductivity of at least about 250 W/m-K and a thermal anisotropic ratio of no less than about 10 positioned proximate to the image display panel. 17. The frame system of claim 16, further including a first cross support spanning the open frame and a plurality of second printed circuit boards engaging the first cross support. 18. The frame system of claim 16, further including a second cross support spanning the open frame wherein at least one of the second printed circuit boards engages the second cross support. 19. The frame system of claim 16, wherein the open frame is composed of steel. 20. The frame system of claim 16, wherein the open frame including a height and a width, wherein the heat dispersion material substantially spans the height and the width. 21. The frame system of claim 16, which exhibits a support factor of 0 mm-W/m-K. 22. The frame system of claim 16, which further comprises at least one fan.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (39)
Akhter Sohail, Adhesive compositions for electronic applications.
Colombier Gabriel (St. Egreve FRX) Gimenez Philippe (Echirolles FRX) Drapier Claude (Vaucresson FRX) Moreau Michel (Clichy FRX), Multi-layer material comprising flexible graphite which is reinforced mechanically, electrically and thermally by a meta.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.