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Peeling apparatus and manufacturing apparatus of semiconductor device

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-031/18
  • H01L-033/00
  • H01L-027/15
출원번호 US-0540348 (2014-11-13)
등록번호 US-9087931 (2015-07-21)
우선권정보 JP-2006-266531 (2006-09-29)
발명자 / 주소
  • Eguchi, Shingo
  • Monma, Yohei
  • Tani, Atsuhiro
  • Hirosue, Misako
  • Hashimoto, Kenichi
  • Hosaka, Yasuharu
출원인 / 주소
  • Semiconductor Energy Laboratory Co., Ltd.
대리인 / 주소
    Robinson, Eric J.
인용정보 피인용 횟수 : 1  인용 특허 : 43

초록

To eliminate electric discharge when an element formation layer including a semiconductor element is peeled from a substrate used for manufacturing the semiconductor element, a substrate over which an element formation layer and a peeling layer are formed and a film are made to go through a gap betw

대표청구항

1. A method for manufacturing a display module, comprising: forming a release layer over a substrate;forming an element layer over the release layer;removing part of the element layer by irradiating the part with laser, whereby peeling is caused at an interface between the release layer and the elem

이 특허에 인용된 특허 (43)

  1. Yoneda Yoshiyuki,JPX ; Tsuji Kazuto,JPX ; Orimo Seiichi,JPX ; Sakoda Hideharu,JPX ; Nomoto Ryuji,JPX ; Onodera Masanori,JPX ; Kasai Junichi,JPX, Device having resin package with projections.
  2. Fay,Owen R.; Amrine,Craig S.; Lish,Kevin R., Die encapsulation using a porous carrier.
  3. Yamazaki,Shunpei; Nakajima,Setsuo, Display device and method of manufacturing the same.
  4. Yamazaki,Shunpei; Murakami,Masakazu; Takayama,Toru; Maruyama,Junya, Display device having a curved surface.
  5. Shimoda, Tatsuya; Inoue, Satoshi; Miyazawa, Wakao, Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device and liquid crystal display device produced by the same.
  6. Shimoda, Tatsuya; Inoue, Satoshi; Miyazawa, Wakao, Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device, and liquid crystal display device produced by the same.
  7. Shimoda,Tatsuya; Inoue,Satoshi; Miyazawa,Wakao, Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device, and liquid crystal display device produced by the same.
  8. Shimoda,Tatsuya; Inoue,Satoshi; Miyazawa,Wakao, Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device, and liquid crystal display device produced by the same.
  9. Okuyama, Futoshi; Shinba, Yoichi; Hayashi, Tetsuya; Akamatsu, Takayoshi, Laminated member for circuit board, method and apparatus for manufacturing of circuit board.
  10. Watanabe, Ryosuke; Takahashi, Hidekazu; Tsurume, Takuya; Arai, Yasuyuki; Watanabe, Yasuko; Higuchi, Miyuki, Laminating system, IC sheet, roll of IC sheet, and method for manufacturing IC chip.
  11. Suzuki,Masaru; Nitta,Yoshiki; Ohmuro,Kazuhiko, Lift-off method and chemical liquid tank.
  12. Yamazaki, Shunpei; Takayama, Toru; Akiba, Mai, Light emitting device and method of manufacturing the same.
  13. Inoue Satoshi,JPX ; Shimoda Tatsuya,JPX, Manufacturing method of active matrix substrate, active matrix substrate and liquid crystal display device.
  14. Tamura,Tomoko, Manufacturing method of semiconductor device.
  15. Tamura,Tomoko; Ogita,Kaori; Dairiki,Koji; Maruyama,Junya, Manufacturing method of semiconductor device.
  16. Yamazaki,Shunpei; Takayama,Toru; Kanno,Yohei, Manufacturing method of thin film integrated circuit device and manufacturing method of non-contact type thin film integrated circuit device.
  17. Hideo,Yamanaka, Manufacturing process for ultra slim electrooptic display device unit.
  18. Kuroda Shigeji,JPX ; Matsushita Takao,JPX ; Miyamoto Saburo,JPX, Method and apparatus for peeling protective adhesive tape from semiconductor wafer.
  19. Yamazaki, Shunpei; Murakami, Masakazu; Takayama, Toru; Maruyama, Junya, Method for fabricating a semiconductor device by transferring a layer to a support with curvature.
  20. Yamazaki,Shunpei; Murakami,Masakazu; Takayama,Toru; Maruyama,Junya, Method for fabricating a semiconductor device by transferring a layer to a support with curvature.
  21. Tateishi, Fuminori; Izumi, Konami; Yamaguchi, Mayumi, Method for manufacturing a micro-electro-mechanical device with a folded substrate.
  22. Goto,Yuugo; Fukumoto,Yumiko; Takayama,Toru; Maruyama,Junya; Tsurume,Takuya, Method for manufacturing semiconductor device.
  23. Maruyama, Junya; Isobe, Atsuo; Okazaki, Susumu; Tanaka, Koichiro; Yamamoto, Yoshiaki; Dairiki, Koji; Tamura, Tomoko, Method for manufacturing semiconductor device.
  24. Tamura, Tomoko; Sugiyama, Eiji; Dozen, Yoshitaka; Dairiki, Koji; Tsurume, Takuya, Method for manufacturing semiconductor device.
  25. Sato Nobuhiko,JPX ; Yonehara Takao,JPX ; Sakaguchi Kiyofumi,JPX, Method for producing semiconductor substrate.
  26. Yamazaki Shunpei,JPX ; Arai Yasuyuki,JPX ; Teramoto Satoshi,JPX, Method of manufacturing a semiconductor device using a metal which promotes crystallization of silicon and substrate bo.
  27. Yamashita, Akio; Fukumoto, Yumiko; Goto, Yuugo, Method of manufacturing display device.
  28. Shimizu, Noriyoshi; Yamasaki, Tomoo; Oi, Kiyoshi; Rokugawa, Akio, Method of manufacturing wiring substrate to which semiconductor chip is mounted.
  29. Katsumi Nakagawa JP; Takao Yonehara JP; Yasuyoshi Takai JP; Kiyofumi Sakaguchi JP; Noritaka Ukiyo JP; Masaaki Iwane JP; Yukiko Iwasaki JP, Method of producing thin-film single-crystal device, solar cell module and method of producing the same.
  30. Takayama,Toru; Goto,Yuugo; Maruyama,Junya; Ohno,Yumiko, Method of transferring a laminate and method of manufacturing a semiconductor device.
  31. McCormack, Mark Thomas; Roman, James; Zhang, Lei; Beilin, Solomon I., Methods for detaching a layer from a substrate.
  32. Lei Zhang ; Solomon Beilin ; Som S. Swamy ; James J. Roman, Methods for fabricating flexible circuit structures.
  33. Takayama,Toru; Maruyama,Junya; Yamazaki,Shunpei, Peeling method and method of manufacturing semiconductor device.
  34. Sonoda, Yuichi; Arao, Kozo; Toyama, Noboru; Miyamoto, Yusuke, Process and apparatus for forming zinc oxide film, and process and apparatus for producing photovoltaic device.
  35. Kakizaki Yasuo,JPX ; Yonehara Takao,JPX ; Sato Nobuhiko,JPX, Process for producing semiconductor article.
  36. Sakaguchi Kiyofumi,JPX ; Yonehara Takao,JPX ; Nishida Shoji,JPX ; Yamagata Kenji,JPX, Process for producing semiconductor article.
  37. Yamazaki,Shunpei; Takayama,Toru; Maruyama,Junya; Ohno,Yumiko, Semiconductor apparatus and fabrication method of the same.
  38. Ishikawa, Akira, Semiconductor device and manufacturing method thereof.
  39. Koyama, Jun; Dairiki, Koji; Okazaki, Susumu; Moriya, Yoshitaka; Yamazaki, Shunpei, Semiconductor device and method for manufacturing the same.
  40. Maruyama, Junya; Takayama, Toru; Goto, Yuugo, Semiconductor device and method of manufacturing the same.
  41. Maruyama,Junya; Takayama,Toru; Goto,Yuugo, Semiconductor device and method of manufacturing the same.
  42. Tatsuya Shimoda JP; Satoshi Inoue JP; Wakao Miyazawa JP, Separating method, method for transferring thin film device, thin film device, thin film integrated circuit device, and liquid crystal display device manufactured by using the transferring method.
  43. Yonehara,Takao; Sakaguchi,Kiyofumi, Thin-film semiconductor device and method of manufacturing the same.

이 특허를 인용한 특허 (1)

  1. Fukumoto, Atsushi; Aiso, Fumiki; Shundo, Takeshi; Nagano, Hajime, Semiconductor manufacturing apparatus and method of manufacturing semiconductor device.
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