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According to some embodiments, a thermoelectric system includes a plurality of thermoelectric elements forming a thermoelectric array, the thermoelectric elements having a cooling side and a heating side. The system further includes at least one heat exchanger on at least one of the cooling side and

According to some embodiments, a thermoelectric system includes a plurality of thermoelectric elements forming a thermoelectric array, the thermoelectric elements having a cooling side and a heating side. The system further includes at least one heat exchanger on at least one of the cooling side and the heating side, the heat exchanger being in thermal communication with at least some of the thermoelectric elements. In addition, the system includes a substrate generally positioned between the thermoelectric elements and the heat exchange element. The substrate comprises an electrical isolation layer, a support element configured to receive the heat exchanger and a plurality of interconnecting tabs configured to place adjacent thermoelectric elements in electrical communication with one another.

대표청구항 ▼

1. A thermoelectric system comprising: a plurality of thermoelectric elements forming a thermoelectric array, the thermoelectric elements having a cooling side and a heating side;at least one heat exchanger on at least one of the cooling side and the heating side, the heat exchanger being in thermal

1. A thermoelectric system comprising: a plurality of thermoelectric elements forming a thermoelectric array, the thermoelectric elements having a cooling side and a heating side;at least one heat exchanger on at least one of the cooling side and the heating side, the heat exchanger being in thermal communication with at least some of the thermoelectric elements;a substrate generally positioned between the thermoelectric elements and the heat exchange element, the substrate comprising: a gap-free electrical isolation layer;at least one support element configured to receive the at least one heat exchanger; anda plurality of interconnecting tabs configured to place adjacent thermoelectric elements in electrical communication with one another;wherein the substrate is configured to alleviate thermal stress on said substrate when the thermoelectric elements are electrically energized;wherein portions of the substrate do not include at least one of a support element and an interconnecting tab along the same lateral location of the substrate;wherein at least some portions of the substrate do not include a support element and an interconnecting tab, wherein such portions of the substrate that do not include a support element and an interconnecting tab are at least partially laterally aligned along at least one gap;wherein the substrate comprises at least one bridge configured to connect at least two adjacent support segments positioned on either side of the at least one gap;wherein the at least one support element comprises at least two support segments, wherein the at least one support element is provided in the substrate as a unitary member such that the at least two support segments are connected by the at least one bridge;wherein the electrical isolation layer of said substrate is positioned between the at least one support element and the plurality of interconnecting tabs, said electrical isolation layer comprising a film that comprises a continuous, unitary structure that extends across the at least one gap and across spaces formed between adjacent interconnecting tabs; andwherein the at least one bridge is integrally formed and substantially planar with the at least one support element and extends past an edge of the at least one support element. 2. The system of claim 1, wherein the bridge is configured to be selectively removed once the substrate is secured to the heat exchanger and the thermoelectric elements. 3. The system of claim 1, wherein the bridge is configured to hold at least two of the at least two support elements in place during soldering or assembling and to accommodate thermal stress. 4. The system of claim 1, wherein the electrical isolation layer comprises polyimide. 5. The system of claim 1, wherein the electrical isolation layer comprises ceramic. 6. The system of claim 1, wherein the at least one support element comprises copper. 7. The system of claim 1, wherein the heat exchanger is configured to extend across at least one gap. 8. The system of claim 1, wherein the heat exchanger is configured to not extend across at least one gap. 9. The system of claim 1, further comprising a sealant positioned within the at least one gap, the sealant being configured to protect the thermoelectric elements. 10. A thermoelectric assembly comprising: a plurality of thermoelectric elements forming a thermoelectric array, the thermoelectric elements having a cooling side and a heating side;fins located on at least one of the cooling side and the heating side, the fins being in thermal communication with at least some of the thermoelectric elements;a substrate generally positioned between the thermoelectric elements and the fins, the substrate comprising: a gap-free electrical isolation layer; andat least one support element configured to receive at least one of the fins;wherein the substrate is configured to reduce thermal stress on said substrate;wherein the substrate comprises at least one portion that does not include the at least one support element and an interconnecting tab, the interconnecting tab being configured to electrically couple two adjacent thermoelectric elements;at least one gap defined in portions of the substrate that do not include at least one support element and the interconnecting tab along the same lateral location;wherein the electrical isolation layer comprises a unitary structure and is generally continuous such that said electrical isolation layer extends across the at least one gap;wherein the substrate comprises at least one interconnecting bridge;wherein the at least one support element comprises at least two support segments, wherein the at least one support element is provided in the substrate as a unitary member such that the at least two support segments are connected by the at least one interconnecting bridge, wherein the at least one interconnecting bridge is configured to connect adjacent support elements of the at least one support element;wherein the electrical isolation layer is positioned generally between the at least one support element and the plurality of thermoelectric elements; andwherein the at least one interconnecting bridge is integrally formed and substantially planar with the adjacent support elements and extends past an edge of the adjacent support elements. 11. The assembly of claim 10, wherein the at least one interconnecting bridge is configured to be selectively removed once the substrate is secured to the fins and the thermoelectric elements. 12. The assembly of claim 10, wherein the electrical isolation layer comprises polyimide. 13. A method of manufacturing a thermoelectric assembly, comprising: attaching a plurality of thermoelectric elements to a substrate having at least one gap, the substrate comprising: a gap-free electrical isolation layer comprising a film that extends continuously along an entire substrate, including extending across the at least one gap;at least one support element configured to receive at least one heat exchanger, the at least one support element comprising at least two support segments;wherein the at least one gap separates the at least two support segments, the at least one gap being at least partially aligned laterally with a spacing between at least two interconnecting tabs that electrically couple adjacent thermoelectric elements; andat least one bridge connecting adjacent segments of the support element across the at least one gap, said at least one bridge at least partially originating from and at least partially forming a unitary structure with said adjacent segments of the support element;positioning the at least one support element and the at least one bridge as a unitary structure adjacent the gap-free electrical isolation layer;attaching the at least one heat exchanger to the substrate;wherein the at least one bridge is configured to either remain on the substrate or be removed from the substrate after the substrate has been secured to at least some of the plurality of the thermoelectric elements and the at least one heat exchanger; andwherein the electrical isolation layer is positioned generally between the at least one support element and the plurality of thermoelectric elements; andat least partially removing at least one bridge from the substrate or cutting at least one bridge when the substrate has been secured to at least one of the plurality of thermoelectric elements and the at least one heat exchanger. 14. The method of claim 13, further comprising positioning a housing at least partially around the assembly. 15. A method of manufacturing a thermoelectric assembly, comprising: attaching a plurality of thermoelectric elements to a substrate having at least one gap, the substrate comprising: at least one support element configured to receive at least one heat exchanger, the at least one support element comprising at least two support segments, wherein the at least one gap separates the at least two support segments; andat least one bridge connecting the at least two adjacent segments of the at least one support element across the at least one gap, said at least one bridge at least partially forming a unitary structure with the adjacent segments of the support element; andan electrical isolation layer positioned between the at least one support element and the thermoelectric elements;positioning the at least one support element and the at least one bridge as a unitary structure adjacent the electrical isolation layer;attaching at least one heat exchanger to the at least one support substrate;wherein the at least one gap is at least partially laterally aligned with a spacing between interconnecting members that electrically couple adjacent thermoelectric elements;wherein the at least one bridge is configured to either remain on the substrate or be removed from the substrate after the substrate has been secured to at least some of the plurality of the thermoelectric elements and the at least one heat exchanger; andat least partially removing at least one bridge from the at least two adjacent segments of the at least one support element of the substrate or cutting at least one bridge from the at least two adjacent segments of the at least one support element of the substrate when the substrate has been secured to at least one of the plurality of thermoelectric elements and the at least one heat exchanger.