A system is provided for the manufacture of carbon based electrical components including, an ultraviolet light source; a substrate receiving unit whereby a substrate bearing a first layer of carbon based semiconductor is received and disposed beneath the ultraviolet light source; a mask disposed bet
A system is provided for the manufacture of carbon based electrical components including, an ultraviolet light source; a substrate receiving unit whereby a substrate bearing a first layer of carbon based semiconductor is received and disposed beneath the ultraviolet light source; a mask disposed between the ultraviolet light source and the carbon based semiconductor layer; a doping agent precursor source; and environmental chemical controls, configured such that light from the ultraviolet light source irradiates a doping agent precursor and the first carbon layer.
대표청구항▼
1. An apparatus, comprising a carbon-based electrical circuit including a plurality of carbon layers, wherein: a section of each carbon layer in the plurality of carbon layers comprises a doping pattern;the doping pattern of each carbon layer comprises a plurality of doped regions, wherein each dope
1. An apparatus, comprising a carbon-based electrical circuit including a plurality of carbon layers, wherein: a section of each carbon layer in the plurality of carbon layers comprises a doping pattern;the doping pattern of each carbon layer comprises a plurality of doped regions, wherein each doped region of the plurality of doped regions extends from an upper surface of the respective carbon layer to a lower surface of the respective carbon layer; andone or more doped regions of each carbon layer aligns with one or more doped regions of an adjacent carbon layer to produce one or more circuit elements comprising doped regions from adjacent carbon layers. 2. The apparatus of claim 1, wherein the doping pattern of each carbon layer comprises a selection of n-type regions, p-type regions, or conductive regions. 3. The apparatus of claim 1, wherein the doping pattern of a first carbon layer from the plurality of carbon layers comprises an n-type region. 4. The apparatus of claim 1, wherein the doping pattern of a first carbon layer from the plurality of carbon layers comprises a p-type region. 5. The apparatus of claim 1, wherein the doping pattern of a first carbon layer from the plurality of carbon layers comprises a source region, a channel region, and a drain region of a transistor. 6. The apparatus of claim 5, wherein the doping pattern of a second carbon layer from the plurality of carbon layers comprises a plurality of conductive regions that align with the source region, channel region, and drain region of the transistor. 7. The apparatus of claim 1, wherein: the doping pattern of a first carbon layer from the plurality of carbon layers comprises a source region of a transistor;the doping pattern of a second carbon layer from the plurality of carbon layers comprises a channel region of the transistor; andthe doping pattern of a third carbon layer from the plurality of carbon layers comprises a drain region of the transistor. 8. The apparatus of claim 1, wherein: the doping pattern of a first carbon layer from the plurality of carbon layers comprises: a source region, a channel region, and a drain region of a first transistor; anda source region of a second transistor;the doping pattern of a second carbon layer from the plurality of carbon layers comprises a channel region of the second transistor; andthe doping pattern of a third carbon layer from the plurality of carbon layers comprises a drain region of the second transistor. 9. The apparatus of claim 1, wherein each carbon layer of the plurality of carbon layers comprises a single-walled nanotube mat. 10. An apparatus, comprising: a wafer substrate;a first layer of carbon-based semiconductor on the wafer substrate, wherein the first layer includes a first plurality of doped regions, and wherein each doped region from the plurality of doped regions extends from an upper surface to a lower surface of the first layer; anda second layer of carbon-based semiconductor on the first layer, wherein the second layer includes a second plurality of doped regions, and wherein each doped region from the second plurality of doped regions extends from an upper surface to a lower surface of the second layer;wherein one or more doped regions from the first plurality of doped regions and one or more doped regions from the second plurality of doped regions align to form at least a portion of an electrical circuit. 11. The apparatus of claim 10, wherein the first plurality of doped regions comprise a selection of n-type regions, p-type regions, or conductive regions. 12. The apparatus of claim 10, wherein the first plurality of doped regions comprise n-type regions. 13. The apparatus of claim 10, wherein the first plurality of doped regions comprise p-type regions. 14. The apparatus of claim 10, wherein the first plurality of doped regions comprise a source region, a channel region, and a drain region of a transistor. 15. The apparatus of claim 14, wherein the second plurality of doped regions comprise a plurality of conductive regions that align with the source region, channel region, and drain region of the transistor. 16. The apparatus of claim 10, further comprising: a third layer of carbon-based semiconductor on the second layer;wherein the third layer includes a third plurality of doped regions, and wherein each doped region from the third plurality of doped regions extends from an upper surface to a lower surface of the third layer;wherein the first plurality of doped regions includes a source region of a transistor;wherein the second plurality of doped regions includes a channel region of the transistor; andwherein the third plurality of doped regions includes a drain region of the transistor. 17. The apparatus of claim 10, further comprising: a third layer of carbon-based semiconductor on the second layer;wherein the first plurality of doped regions includes: a source region, a channel region, and a drain region of a first transistor; anda source region of a second transistor;wherein the second plurality of doped regions includes a channel region of the second transistor; andwherein the third plurality of doped regions includes a drain region of the second transistor. 18. The apparatus of claim 10, wherein: the first layer comprises a first single-walled nanotube mat; andthe second layer comprises a second single-walled nanotube mat formed on the first single-walled nanotube mat. 19. The apparatus of claim 10, wherein: the first layer comprises a sheet of sp2 bonded carbon; andthe second layer comprises a sheet of sp2 bonded carbon. 20. The apparatus of claim 10, wherein: the first layer comprises a sheet of carbon having a combination of sp2 and sp3 bonding; andthe second layer comprises a sheet of carbon having a combination of sp2 and sp3 bonding.
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