|국가/구분||United States(US) Patent 등록|
|국제특허분류(IPC7판)||B05D-001/02 B23K-031/02 C23C-014/34 C23C-024/04|
|발명자 / 주소|
|출원인 / 주소|
|대리인 / 주소||
|인용정보||피인용 횟수 : 0 인용 특허 : 191|
In various embodiments, joined sputtering targets are formed at least in part by spray deposition of the sputtering material and/or welding.
1. A method of forming a joined sputtering target comprising a sputtering material, the method comprising: forming a mechanical joint between two discrete sputtering-target tiles by (i) overlapping or (ii) overlapping and interlocking the tiles at an interface therebetween, the interface comprising a recess over the mechanical joint, and each of the tiles consisting essentially of the sputtering material;after (i) overlapping or (ii) overlapping and interlocking the tiles at the interface therebetween, joining the tiles by welding the mechanical joint; a...