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Heat dissipation in computing device

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G06F-001/20
  • F28D-003/02
  • F28D-015/02
  • G02F-001/1333
  • G06F-001/16
  • G06F-001/18
  • G11B-033/14
  • H01L-023/367
  • H01L-023/427
  • F28F-003/02
  • H05K-007/20
  • G11B-033/08
출원번호 US-0055784 (2013-10-16)
등록번호 US-9116674 (2015-08-25)
발명자 / 주소
  • Merz, Nicholas G.
  • DiFonzo, John C.
  • Zadesky, Stephen P.
  • Prichard, Michael J.
출원인 / 주소
  • Apple Inc.
대리인 / 주소
    Downey Brand LLP
인용정보 피인용 횟수 : 3  인용 특허 : 97

초록

A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclo

대표청구항

1. A computing device, comprising: an enclosure arranged to enclose a heat generating component, at least a portion of the enclosure formed of a thermally conductive material; andan integrated heat exchanger arranged to dissipate heat from the heat generating component, the heat exchanger comprising

이 특허에 인용된 특허 (97)

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이 특허를 인용한 특허 (3)

  1. Hsu, Sheng-Chieh, Electric device.
  2. Okumura, Kenji, Vibration suppression mechanism for an electronic device.
  3. Okumura, Kenji, Vibration suppression mechanism for an electronic device.
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