Certain embodiments disclosed herein relate to a smooth finish composite structure and methods for making the composite structure. In particular, in one embodiment, a method is provided that includes creating a first layer of a composite structure. The creation of the first layer includes positionin
Certain embodiments disclosed herein relate to a smooth finish composite structure and methods for making the composite structure. In particular, in one embodiment, a method is provided that includes creating a first layer of a composite structure. The creation of the first layer includes positioning the first layer in a mold and curing the first layer. Additional layers of the composite structure are created and bonded to the first layer.
대표청구항▼
1. A method comprising: creating a first layer of a composite structure, wherein the first layer forms an exterior surface of a housing of a portable electronic device, the exterior surface having a cosmetic finish, and wherein creating the first layer comprises:positioning a first side of the first
1. A method comprising: creating a first layer of a composite structure, wherein the first layer forms an exterior surface of a housing of a portable electronic device, the exterior surface having a cosmetic finish, and wherein creating the first layer comprises:positioning a first side of the first layer in a first mold;applying a first peel ply to a second side of the first layer, the second side of the first layer being opposite the first side of the first layer; andcuring the first layer with heat and pressure to provide the cosmetic finish to the first side of the first layer;creating a second layer of the composite structure, wherein a first side of the second layer forms an interior surface of the housing that is opposite to the exterior surface and oriented toward the inside of the housing, and wherein creating the second layer comprises:positioning the first side of the second layer in a second mold;applying a second peel ply to a second side of the second layer; and curing the second layer with heat and pressure, the second side of the second layer being opposite the first side of the second layer;removing the first peel ply to expose a first bonding surface of the first layer; removing the second peel ply to expose a second bonding surface of the second layer; andbonding the first bonding surface of the first layer to the second bonding surface of the second layer to form at least a portion of the housing of the portable electronic device. 2. The method of claim 1, wherein the first layer is formed using a first curing process and the second layer is formed using a second curing process that is different than the first curing process. 3. The method of claim 1, further comprising applying an adhesive material to the first layer prior to bonding the first layer to the second layer. 4. The method of claim 3, wherein the adhesive material comprises at least one of a film adhesive, a contact cement, and a liquid adhesive. 5. The method of claim 1, further comprising positioning a woven fabric over the first layer prior to applying the first peel ply layer and curing the first layer. 6. A method of manufacturing a housing of a portable computing device, the method comprising: coupling a woven fabric to a first ply, wherein a first side of the first ply is positioned in a first mold and wherein the woven fabric is coupled to a second side of the first ply opposite to the first side;positioning a first peel ply over the woven fabric;curing the first ply in the first mold;removing the first peel ply to expose a bonding surface on the second side of the first ply;curing one or more additional plies in a second mold, the one or more additional plies having a first side coupled to a second peel ply and a second side opposite to the first side;removing the second peel ply; andbonding the second side of the first ply with the first side of the one or more additional plies to form at least a portion of a housing of the portable computing device;wherein the first side of the first ply forms an exterior surface of the housing of the portable computing device and has a cosmetic finish; andwherein the first side of the one or more additional plies forms an interior surface opposite to the exterior surface of the housing of the portable computing device. 7. The method of claim 6, further comprising: cutting out an area of the one or more additional plies; andinserting a window into the cutout area. 8. The method of claim 6, further comprising: applying a first temperature and pressure to the first ply to cure the first ply; andapplying a second temperature and pressure to the one or more additional plies to cure the one or more additional plies, wherein the second temperature and pressure differs from the first temperature and pressure. 9. The method of claim 6, further comprising applying an adhesive to the bonding surface. 10. The method of claim 9, wherein the adhesive comprises at least one of a film adhesive, a contact cement, and a liquid adhesive. 11. The method of claim 6, wherein the one or more additional plies form a backing of the composite structure. 12. The method of claim 6, wherein the first ply comprises a pre-impregnated fiber material. 13. The method of claim 12, wherein each impregnated fiber of the pre-impregnated fiber material extends along a same axis. 14. The method of claim 6, wherein the woven fabric comprises a glass fiber. 15. A method for manufacturing a housing of a portable computing device, the method comprising: positioning a first side of a first ply in a first mold;applying a first peel ply to a second side of the first ply, the second side of the first ply being opposite the first side of the first ply;curing the first ply in the first mold to create an exterior surface of the housing of the portable computing device on the first side of the first ply, the exterior surface having a cosmetic finish;curing one or more additional plies in a second mold having a first side coupled to a second peel ply and a second side opposite to the first side;removing the first peel ply and the second peel ply; andbonding the second side of the first ply to the one or more additional plies to form at least a portion of the housing of the portable computing device, wherein the second side of the one or more additional plies form an interior surface opposite to the exterior surface of the housing. 16. The method of claim 15, wherein curing the first ply comprises applying a first temperature and a first pressure to the first ply. 17. The method of claim 16, wherein curing the one or more additional plies comprises applying a second temperature and a second pressure to the one or more additional plies, wherein the second temperature and the second pressure differ from the first temperature and the first pressure. 18. The method of claim 15, wherein the one or more additional plies form a backing for the surface of the housing of the portable computing device. 19. The method of claim 15, wherein the first ply comprises a pre-impregnated fiber material. 20. The method of claim 19, wherein each impregnated fiber of the pre-impregnated fiber material extends along a same axis.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (73)
Ulrich, Robert; Pritchard, Eric K., Adaptive nozzle system for high-energy abrasive stream cutting.
Ford James M. (Cleveland TN) Dean Robert A. (Cleveland TN) Woodard ; Jr. Kenneth E. (Cleveland TN) Branco Antonio (Prospect KY), Composite fiber reinforced plastic frame.
Hogdahl Per (Palm Beach Gardens FL) Hart William (Lake Park FL) Krallman Charles (Singer Island FL) Shaw Kenneth (Palm Beach Gardens FL), Modular computer system having self contained workslate unit detachably coupled to base unit including keyboard.
Tsumuraya,Takeo; Suzuki,Masanori, Polishing method for inner surface of tubular brittle material and tubular brittle material obtained by polishing method.
Martin, Alexander; Tillich, Arthur; Pellenkoft, Frederik, Structural element, method for producing such a structural element, and aircraft having such a structural element.
Diaz Rodolfo E. ; Miller Michael C. ; Lo Re Michael M. ; Gilb James P. K. ; Alam Shahriar, Synthetic magnetodielectric with controlled off-normal TE and TM response.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.