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Electronic device having passive cooling 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G06F-001/16
  • G06F-001/20
출원번호 US-0630947 (2012-09-28)
등록번호 US-9134757 (2015-09-15)
발명자 / 주소
  • Nishi, Yoshifumi
  • MacDonald, Mark
  • Heymann, Douglas
출원인 / 주소
  • Intel Corporation
대리인 / 주소
    KED & Associates LLP
인용정보 피인용 횟수 : 2  인용 특허 : 56

초록

An electronic device is provided that includes a base having a first side and a second side, and a lid having a first side and a second side. The electronic device may also include a heat exchanger provided at the base. The heat exchanger may have a first surface exposed to outside the base.

대표청구항

1. An electronic device comprising: a base having a top side and a bottom side, the bottom side including a first bottom part and a second bottom part to extend in a different direction than the first bottom part;a lid having a display;a hinge device to allow the lid to move relative to the base bet

이 특허에 인용된 특허 (56)

  1. Drolen Bruce L. ; Esposto David B. ; Gatti Ariel ; Ito Calvin H., Adjustable heat rejection system.
  2. Nishi, Yoshifumi, Apparatus and system for improved thermal radiation for a mobile computing device and case.
  3. Haley Kevin (San Jose CA) Aghazadeh Mostafa (Chandler AZ) Xie Hong (Chandler AZ), Apparatus for dissipating heat in a hinged computing device.
  4. John C. DiFonzo ; Andrew S. Healy ; Mounir M. Itani, Computer housing for a portable computer.
  5. Cipolla Thomas Mario ; Holung Joseph Anthony ; Kamath Vinod ; Mansuria Mohanlal Savji ; Mok Lawrence Shungwei ; Wong Tin-Lup, Computer incorporating heat dissipator with hinged heat pipe arrangement for enhanced cooling capacity.
  6. Tanaka, Toshiyuki; Hata, Yukihiko, Cooling apparatus for electronic apparatus.
  7. Hisano,Katsumi; Takamatsu,Tomonao; Iwasaki,Hideo, Cooling device for electronic element producing concentrated heat and electronic device.
  8. Park,Jong Hoon, Cooling device for folder type portable wireless terminal.
  9. Goto Kazuhiko,JPX ; Mashiko Koichi,JPX ; Saito Yuji,JPX ; Nguyen Thang Toan,JPX ; Mochizuki Masataka,JPX ; Eguchi Katsuo,JPX ; Hasegawa Hitoshi,JPX, Cooling device for notebook personal computer.
  10. Mecredy ; III Henry E. ; Dunens Egons K., Cooling fan with heat pipe-defined fan housing portion.
  11. Wang, Hwai-Ming; Chiang, Wei-Chieh; Liu, Hsien-Tsang, Cooling system for hinged portable computing device.
  12. Patel,Chandrakant; Bash,Cullen E., Docking station cooling system including liquid-filled hollow structure.
  13. Dechovich Boris (Jerusalem ILX), Electrolyte cooling device for use with a metal-air battery.
  14. Tanaka, Kaigo, Electronic apparatus.
  15. Lin, Wei-Yi; Wang, Li-Ting; Sun, Kuang-Chung; Huang, Ting-Chiang; Wang, Feng-Ku, Electronic apparatus with improved heat dissipation.
  16. May Gregory J ; Sterner John R, Electronic device having external surface thermal feedback.
  17. Shigeo Ohashi JP; Takashi Naganawa JP; Tadakatsu Nakajima JP; Tsuyoshi Nakagawa JP; Masaaki Eishima JP; Yoshihiro Kondo JP, Electronic equipment.
  18. Ghosh, Prosenjit, Enhanced space utilization for enclosures enclosing heat management components.
  19. Li Hsi-Shang,TWX ; Hsiao Chen-Ang,TWX, Flat plate heat pipe cooling system for electronic equipment enclosure.
  20. Mitchell Nathan A., Flexible heat pipe structure and associated methods for dissipating heat in electronic apparatus.
  21. Chandrakant D. Patel ; Marvin S. Keshner, Heat dissipating chassis member.
  22. Mecredy ; III Henry E., Heat dissipating lid hinge structure with laterally offset heat pipe end portions.
  23. Fleck, Rod G.; Chebeleu, Livius D., Heat dissipation from a hand-held portable computer.
  24. Hsu Richard T., Heat dissipation system for a laptop computer using a heat pipe.
  25. Bhatia Rakesh, Heat exchanger system for cooling a hinged computing device.
  26. Ishida Yoshio (Osaka JPX), Heat radiating apparatus.
  27. Hood ; III Charles D. ; Liu Peter, Heat sink assembly with rotating heat pipe.
  28. Shou Yong Kung,TWX ; Chiang Feng-Yu,TWX, Heat transfer device.
  29. Wang, Feng Ku; Cheng, Yi Lun; Lin, Chun Lung; Yang, Chih Kai; Liu, Cheng Shi, Heat-dissipating module and electronic apparatus.
  30. Chiang, Ho-Hsing, Heat-dissipation structure for a portable folding electronic apparatus.
  31. Moore, David A.; Tracy, Mark S., Hinge connector with liquid coolant path.
  32. Cipolla Thomas Mario ; Coteus Paul William ; Mok Lawrence Shungwei, Hinge incorporating a helically coiled heat pipe for a laptop computer.
  33. Kobayashi Takashi,JPX, Information processing apparatus and its heat spreading method.
  34. Wu,Sui An, KVM module with torsion-varying hinge.
  35. Mok Lawrence Shungwei, Laptop computer with slideable keyboard for exposing a heat generating surface for more efficient heat dissipation.
  36. Donahoe Daniel N. ; Gill Michael T., Liquid cooled computer apparatus and associated methods.
  37. Langley Philip David ; Boone Douglas, Low EMI emissions heat sink device.
  38. Cipolla Thomas Mario, Mechanism for deploying a keyboard for a portable computer.
  39. Ali, Ihab A., Methods and apparatus for cooling electronic devices using thermally conductive hinge assemblies.
  40. Eric DiStefano ; Krishna Seshan, Mobile computer having a housing with openings for cooling.
  41. Moore David A., Molded heat exchanger structure for portable computer.
  42. Mochizuki Masataka,JPX ; Saito Yuji,JPX ; Hasegawa Masashi,JPX ; Ono Motoyuki,JPX, Personal computer cooling device having hinged heat pipe.
  43. Mok, Lawrence Shungwei; Morris, Daniel Peter, Portable computer apparatus with thermal enhancements and multiple modes of operation.
  44. Anthony Olson ; Jerry L. Beckman, Portable computer with enhanced performance management.
  45. Youens John E., Portable computer with tilting keyboard that exposes pointing device.
  46. Huang, Xiaonan; Wong, Alec; Shih, Chia-cheng; Chen, Hung-Hsiang; Alenquer, Daniel; Kiat, Tan-Wee; Goh, Luke; Wong, Lionel; Loi, Wean-Fong; Wu, Hsien-Chih; Huang, Chiu-Lang, Portable electronic device with an actuating element to lift input/output modules.
  47. Lowry David A. ; Novin Eugene, Rotatable heat transfer coupling.
  48. Lowry David A. ; Novin Eugene, Rotatable heat transfer coupling.
  49. Mok Lawrence Shungwei, Spring loaded heat pipe connector for hinged apparatus package.
  50. Kim Tae-Yong,KRX, Structure for protecting electronic systems from impact and portable computer with such a structure.
  51. Launay, Stephane; Federov, Andrei G.; Joshi, Yogendra, Thermal management devices, systems, and methods.
  52. Janak G. Patel, Thermal transfer hinge for hinged mobile computing device and method of heat transfer.
  53. Janik Craig M. ; Boyle Dennis J. ; Mongan Ryan H. ; Shawver Michael J., Thermally efficient portable computer incorporating deploying CPU module.
  54. Larson Ralph I. (Bolton MA) Phillips Richard L. (Alachua FL) Beane Alan F. (Gilford NH), Two-phase cooling system for laptop computers.
  55. Ford, Daniel A.; Kaufman, James H.; Melroy, Owen R.; Miner, Cameron S.; Roche, Kevin P., Visual heat sink for computers and method of use.
  56. Tao Chian,TWX ; Chang Eric,TWX ; Lin Chia-Jui,TWX, Winding chain dissipating unit suitable for electronic device.

이 특허를 인용한 특허 (2)

  1. Morrison, John Trevor; North, Travis, Hybrid thermal foot and pen storage well.
  2. McBroom, Michael D.; Andre, Bartley K.; Silvanto, Mikael M.; Donarski, Matthew A.; Salvatti, Alexander V.; Boothe, Daniel K.; Mihelich, Ryan J.; Paseman, Sabrina K., One piece frame for a component in an electronic device.
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